Single-component epoxy structure adhesive tape and preparation method thereof

Abstract

The invention relates to an epoxy resin adhesive agent, in particular to a single-component epoxy structure adhesive tape and a preparation method thereof. The preparation method of the epoxy resin adhesive agent comprises the following steps of: blending a solid state bisphenol A epoxy resin, a liquid bisphenol A type epoxy resin and an epoxy diluent at the temperature of between 90 and 100 DEG C; stirring the mixture for 20 to 30 minutes; maintaining a 0.1 to 0.2 atmosphere pressure condition; cooling the mixture to 50 to 70 DEG C; adding a tenacity modifying bisphenol A epoxy resin and a phosphorization modifying bisphenol A epoxy resin into the mixture; blending and stirring the mixture for 10 to 15 minutes; maintaining a 0.1 to 0.2 atmosphere pressure condition; adding a thixotropic agent and a filler into the mixture; blending and stirring the mixture for 10 to 15 minutes; maintaining a 0.1 to 0.2 atmosphere pressure condition; adding a dicyandiamide type solid agent and a urea type curing accelerator after cooling the mixture to 40 to 50 DEG C; after blending and stirring the mixture for 10 to 15 minutes, discharging the material; maintaining a 0.1 to 0.2 atmosphere pressure condition; placing the obtained pasty material between two pieces of oilpaper; and pressing the oilpaper on a flat pressing machine until the thickness of the oilpaper is 0.5 to 1mm to obtain the adhesive tape. The adhesive tape has the advantages of high strength, simple preparation method and the like and is convenient to transport and use.

Description

technical field [0001] The invention relates to an epoxy resin adhesive, in particular to a single-component epoxy structural adhesive tape and a preparation method thereof. Background technique [0002] Epoxy resin adhesives have good bonding properties to metal, plastic, glass, ceramics and other materials. After bonding and curing, they have excellent mechanical properties, electrical insulation properties, heat resistance and chemical resistance. Processing and manufacturing, electronics, aerospace, shipbuilding, automobiles, construction, etc. are widely used; for example, in order to reduce mass and stress concentration in automobiles, aircraft and other industrial fields, high-strength structural adhesives are often used to replace welding bonds Aluminum alloy, stainless steel and non-metallic composite materials, in recent years, the output of epoxy adhesives in China has been growing at a rate of more than 10%, and the growth rate of output value has reached about 2...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to overcome the disadvantages of the existing single-component epoxy structural adhesives, such as heating and pressurizing devices, easy to bring air bubbles in the process of sizing, waste of glue, etc. during transportation, and provide a The single-component epoxy structural tape composition has high bonding strength, is convenient to use, and avoids waste, and the preparation method of the epoxy structural tape

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