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Preparation method of nano Sn/SiC composite plating

A composite coating, nano-scale technology, applied in coatings, electrolytic coatings, etc., can solve problems such as easy growth of tin whiskers, poor mechanical properties, difficult co-deposition of nanoparticles, etc., to achieve the effect of promoting deposition, reducing agglomeration, and dense coating

Inactive Publication Date: 2011-05-11
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problems that current pure tin coatings are easy to grow tin whiskers and have poor mechanical properties, and that nanoparticles are not easy to co-deposit on the cathode in conventional nanocomposite coating technology, and provide a preparation method of nanoscale Sn / SiC composite coatings

Method used

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specific Embodiment approach 1

[0012] Specific embodiment 1: The preparation method of nano-scale Sn / SiC composite coating of this embodiment is carried out according to the following steps: 1. SiC nanoparticles with a particle size of 10-100nm are soaked in methanesulfonic acid for 2-5h, and then dispersed Stabilization agent, mechanical stirring for 2-6h, rotating speed of 1000-3000r / min, followed by ultrasonic stirring with frequency of 30-90KHz for 1-2h, then adding stannous methanesulfonate, brightener, co-deposition accelerator, main salt stabilization The concentration of SiC nanoparticles in the electroplating solution is 1-30g / L, the concentration of dispersant is 40-300g / L, the concentration of methanesulfonic acid is 100-250g / L, and the concentration of methanesulfonic acid is 100-250g / L. The concentration of stannous is 20~80g / L, the concentration of brightener is 0.5~10mL / L, the concentration of co-deposition promoter is 5~30g / L, and the concentration of main salt stabilizer is 10~200g / L; 2. Pla...

specific Embodiment approach 2

[0015] Specific embodiment two: this embodiment is different from specific embodiment one in that the particle size of the SiC nanoparticles in step one is 30-80 nm. Others are the same as the first embodiment.

specific Embodiment approach 3

[0016] Specific embodiment three: This embodiment is different from specific embodiment one in that the particle size of the SiC nanoparticles in step one is 50 nm. Others are the same as the first embodiment.

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Abstract

The invention discloses a preparation method of nano Sn / SiC composite plating, relating to a preparation method of Sn / SiC composite plating. The invention aims to solve the problems that the existing pure tin plating is easy to grow tin whisker and has poor mechanical property and codeposition of nano particles on a cathode can not be realized easily in the conventional nano composite plating technology. The preparation method comprises the following steps: 1, soaking SiC nano particles in methanesulfonic acid, then adding dispersant, stirring, and sequentially adding tin methanesulfonate, brightening agent, codeposition accelerant and main salt stabilizer to compose a plating solution; 2, parallelizing a cathode copper foil and a pure tin anode plate into the plating solution; and 3, adjusting the cathode current density, mechanically stirring and plating alternately, and keeping stirring under compressed nitrogen all the time, thus finishing preparing the nano Sn / SiC composite plating. The prepared nano Sn / SiC composite plating is obviously improved in inhibition of tin whisker growth, corrosion resistance, hardness and the like, and the preparation method can be applied to the field of weldable plating.

Description

Technical field [0001] The invention relates to a method for preparing a Sn / SiC composite coating. Background technique [0002] At the end of the 20th century, the traditional solderability coating composition in the electronics industry was relatively simple, mainly using electroplated Sn-Pb alloy. Sn-Pb alloy coating is widely used in electronics due to its low melting point (183°C), good solderability, effective suppression of tin whiskers, good corrosion resistance, stable plating solution, low cost, and good throwing power. Electroplating field. However, due to the environmental pollution caused by lead, in the 21st century, the research on lead-free solderable coating has become a hot spot in the field of solderable electroplating. There are various difficulties in finding metal elements that can replace Pb, so people return to the pure Sn coating, but the pure tin coating as a solderable coating has the disadvantages of easy growth of tin whiskers and poor mechanical pr...

Claims

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Application Information

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IPC IPC(8): C25D15/00C25D3/32
Inventor 安茂忠初红涛张锦秋杨培霞
Owner HARBIN INST OF TECH
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