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Heat-resisting high-dielectric constant inorganic/polymer composite film

A high dielectric constant and composite thin film technology, applied in the field of composite materials, can solve the problems of drastic changes, difficulty in controlling the amount of addition and dielectric constant, etc., and achieve the effect of overcoming drastic changes and excellent dielectric properties

Inactive Publication Date: 2011-01-26
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantage of this method is that it can quickly increase the dielectric constant of the composite material under the condition of low filling amount, so it does not affect the mechanical properties of the composite material. , the change is drastic, it is difficult to control the accurate addition amount and dielectric constant

Method used

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  • Heat-resisting high-dielectric constant inorganic/polymer composite film
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  • Heat-resisting high-dielectric constant inorganic/polymer composite film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] 1) Add 0.4063g of CCTO powder, 0.5006g of ODA and 10ml of DMAC into a three-necked flask, ultrasonicate for 10min, stir to disperse evenly, and add PMDA to the system in 3 times (the total amount is 0.5507g, and the time interval of addition is 10min ), reacted for 3h to obtain a mixed solution of calcium copper titanate / polyamic acid;

[0019] 2) After spreading the mixed solution of calcium copper titanate / polyamic acid on a glass plate, let it stand in vacuum for 25 minutes, then place it in a blast oven, and heat it at 80°C, 120°C, 180°C, 240°C, and 300°C in sequence. ℃ for 1 h to imidize, to obtain a composite film with a volume fraction of CCTO of 10 vol%.

Embodiment 2

[0021] 1) Add 0.9142g of CCTO powder, 0.5006g of ODA and 10ml of DMAC into a three-necked flask, ultrasonicate for 15min, stir to make it evenly dispersed, and add PMDA to the system in 3 times (the total amount is 0.5507g, and the time interval of addition is 10min ), reacted for 3h to obtain a mixed solution of calcium copper titanate / polyamic acid;

[0022] 2) After spreading the mixed solution of calcium copper titanate / polyamic acid on a glass plate, let it stand in vacuum for 20 minutes, and then place it in a blast oven, and heat it at 80°C, 120°C, 180°C, 240°C, and 300°C in sequence. °C for 1 h for imidization, to obtain a composite film with a volume fraction of CCTO of 20 vol%.

Embodiment 3

[0024] 1) Add 1.5673g of CCTO powder, 0.5006g of ODA and 10ml of DMAC into a three-necked flask, ultrasonicate for 15min, stir to make it evenly dispersed, and add PMDA to the system in 3 times (the total amount is 0.5507g, and the time interval of addition is 10min), reacted 3h, obtained the mixed solution of calcium copper titanate / polyamic acid;

[0025] 2) After spreading the mixed solution of calcium copper titanate / polyamic acid on a glass plate, let it stand in vacuum for 20 minutes, and then place it in a blast oven, and heat it at 80°C, 120°C, 180°C, 240°C, and 300°C in sequence. °C for 1 h for imidization, to obtain a composite film with a volume fraction of CCTO of 30 vol%.

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Abstract

The invention provides a heat-resisting high-dielectric constant inorganic / polymer composite film, which belongs to the field of composite materials. The composite film provided by the invention consists of 60 to 90 volume percent of substrate polyimide and 10 to 40 volume percent of filler copper calcium titanate (CCTO) ceramic powder, has high dielectric properties, and can solve the problems that the dielectric constant of a conventional polymer-based composite material filled with dielectric ceramics is increased slowly with the increasing of filler content, that the dielectric constant of the polymer-based composite material filled with a conductive material greatly changes in the vicinity of a seepage value and that the filler content and the dielectric constant are difficult to control.

Description

technical field [0001] The invention belongs to the field of composite materials, and in particular relates to a high-temperature-resistant high-dielectric constant inorganic / polymer composite film. Background technique [0002] With the continuous improvement of the requirements for the dielectric constant of materials, many researchers have begun to devote themselves to the research of high dielectric composite materials. Among them, polymer-based composite dielectric materials have attracted the attention of researchers because of their good mechanical properties, processability and insulation properties. At present, polymer-based composite dielectric materials are mainly divided into two types: (1) adding high-dielectric ceramic materials to the polymer body, such as: Liu Weidong et al. of Zhejiang University filled the polyimide matrix with barium titanate Powder, when the filling amount of barium titanate powder reaches 50vol%, under 100Hz, the dielectric constant of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K3/24C08J5/18
Inventor 党智敏周涛
Owner BEIJING UNIV OF CHEM TECH
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