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Nickel-based high temperature solder and preparation method thereof

A high-temperature brazing filler metal and nickel-based technology, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of violent reaction and poor mechanical properties of joints, and achieve good wettability, good mechanical properties, and simple preparation process reliable effect

Active Publication Date: 2010-11-24
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the severe reaction between the existing nickel-based solder and the ceramic matrix of the C / SiC composite material leads to poor mechanical properties of the joint obtained by brazing the C / SiC composite material and the nickel-based super high temperature alloy. The invention provides a nickel-based high-temperature solder and its preparation method

Method used

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  • Nickel-based high temperature solder and preparation method thereof
  • Nickel-based high temperature solder and preparation method thereof
  • Nickel-based high temperature solder and preparation method thereof

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specific Embodiment approach 1

[0015] Specific implementation mode one: the nickel-based high-temperature brazing filler metal of this embodiment is made up of Si powder of 9%~11%, TiH of 0~15% by mass percentage 2 powder and the rest of Ni powder.

[0016] The form of the nickel-based high-temperature solder in this embodiment is uniformly mixed powder.

[0017] In this embodiment, the nickel-based high-temperature brazing filler metal is based on the binary eutectic composition of Ni powder and Si powder, and has a high Si content, which can effectively inhibit the reaction of Ni and SiC ceramic phase in the C / SiC composite material, and inhibit the brazing joint. A brittle graphitic carbon layer is produced in the Adding a certain amount of Ti can not only improve the wettability of nickel-based high-temperature solder, but also the Ti element can form a dispersed TiC second phase particle phase in the brazing joint structure, relieve the thermal stress of the joint, optimize the joint structure, and im...

specific Embodiment approach 2

[0021] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the mass purity of Si in the nickel-based high-temperature solder is 99.0% to 99.9%, and the TiH 2 The mass purity of Ni is 99.0% to 99.9%, and the mass purity of Ni is 99.0% to 99.9%. Other parameters are the same as in the first embodiment.

specific Embodiment approach 3

[0022] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that the nickel-based high-temperature solder is made of 9% to 11% Si powder and the remainder Ni powder in mass percentage. Other parameters are the same as those in Embodiment 1 or Embodiment 2.

[0023] Using the brazing method described in the first specific embodiment, the room temperature shear strength of the joint obtained by brazing the C / SiC composite material and the GH99 nickel-based ultra-high temperature alloy with the nickel-based high-temperature solder of this embodiment is 80MPa-88MPa The room temperature shear strength of the joint obtained by brazing the C / C composite material and the GH99 nickel-based ultra-high temperature alloy with the nickel-based high-temperature solder of this embodiment is 2MPa-3MPa.

[0024] Using the brazing method described in the specific embodiment one, the scanning electron microscope (SEM) microstructure of the joint obtained by brazing the C / Si...

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Abstract

The invention discloses a nickel-based high temperature solder and a preparation method thereof, relates to a nickel-based solder and a preparation method thereof and solves the problem of poor mechanical property of a soldered joint of a C / SiC composite material and a nickel-based ultrahigh-temperature alloy caused by violent reaction between the ceramic matrixes of the conventional nickel-based solder and the C / SiC composite material. The solder is prepared from Si powder, TiH2 powder and Ni powder. The preparation method comprises the following steps of: adding acetone into mixed powder of the Si powder, the TiH2 powder and the Ni powder to obtain suspension; and carrying out ultrasonic processing on the suspension, drying the processed suspension and grinding the dried suspension to obtain the solder. Based on binary eutectic compositions of the Ni powder and the Si powder, the solder has higher Si content and has good wettability and low cost for soldering of the C / SiC composite material and the nickel-based ultrahigh-temperature alloy. The soldered joint has good room temperature strength of 80 to 102MPa and good high temperature mechanical property of 800 to 1,000 DEG C. The nickel-based high temperature solder is applicable for brazing connection of graphite or a C / C composite material and the nickel-based ultrahigh-temperature alloy.

Description

technical field [0001] The invention relates to a nickel-based solder and a preparation method thereof. Background technique [0002] C / SiC ceramic matrix composite material is a new type of ultra-high temperature structural material, which has broad application prospects in aerospace, weaponry and other fields. Due to the limitations of its preparation and forming methods, it is difficult to be directly applied to thermal structural components in the above fields. Nickel-based superalloys have excellent high-temperature performance and are an important class of high-temperature metal structural materials. It is of great engineering significance to realize the reliable connection of C / SiC ceramic matrix composites and nickel-based superalloys. [0003] At present, there are very few reports on the brazing connection of C / SiC composite materials, mainly due to the low chemical activity of the composite materials, and the conventional solder is difficult to wet its surface. ...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K35/40B23K1/00B23K103/00
Inventor 张丽霞李宏伟田晓羽杨振文王宇欣刘玉章
Owner HARBIN INST OF TECH
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