Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Cutting tool

A technology of cutting tools and substrates, applied in the direction of manufacturing tools, turning equipment, metal processing equipment, etc., can solve the problem of insufficient wear resistance and defect resistance of the coating, insufficient defect resistance of the coating, insufficient cutting performance, etc. question

Active Publication Date: 2010-09-29
KYOCERA CORP
View PDF10 Cites 19 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] However, for the hard film composed of (TiNbAl)N described in Patent Document 1, the hard film composed of (AlTiNbSi)N(O) described in Patent Document 2, and the (TiWSi)N coating layer of Patent Document 3 , the chipping resistance of the coating is not sufficient, and it is desired to extend the life of cutting tools
In addition, in the cutting tools described in Patent Documents 5 to 10, the cutting performance is insufficient, and it is necessary to extend the life of the cutting tool
[0019] In addition, in the hard coating comprising a laminate of a nitride layer and an oxide layer described in Patent Document 4, the wear resistance and chipping resistance of the entire coating are not sufficient, and further improvement is required.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cutting tool
  • Cutting tool
  • Cutting tool

Examples

Experimental program
Comparison scheme
Effect test

no. 2 Embodiment approach

[0066] As a second example of the substrate 2, Al 2 o 3 The particles contain 0 to 1% by mass of MgO, a total of 10 to 70% by mass of at least one selected from the group of carbides, nitrides, and carbonitrides of Ti or Si, and a total of 0.1 to 2.0% by mass % of Al selected from at least one of Co and Ni 2 o 3quality ceramics. Here, by including Ti or Si carbides, nitrides, and carbonitrides in the ceramics, the strength and toughness of the base can be improved, and the adhesion to the coating layer 6 of the present invention can also be improved. In addition, the content of any one or more selected from Ti or Si carbides, nitrides, and carbonitrides is preferably 20 to 40% by mass from the viewpoint of eliminating the difference in thermal expansion coefficient with the coating layer 6. Make Al 2 o 3 It is particularly preferable to contain TiC or TiCN in an amount of 20 to 40% by mass from the viewpoint that the high-quality ceramics have conductivity and film forma...

Embodiment 1

[0110] Using tungsten carbide (WC) powder with an average particle size of 0.8 μm as the main component, 10% by mass of metal cobalt (Co) powder with an average particle size of 1.2 μm and 0.1% by mass of vanadium carbide ( VC) powder, 0.3% by mass of chromium carbide (Cr 3 C 2 ) powder, mixed, formed into CNMG120408MS-shaped multi-edged cutter head shape by press molding, and then subjected to binder removal treatment, followed by firing in a vacuum of 0.01Pa at 1450°C for 1 hour to produce super hard alloy. In addition, grinding processing was performed by blasting, brushing, or the like on the rake face surface of each sample. Furthermore, the obtained cemented carbide is subjected to edge treatment (honing) by brushing.

[0111] For the substrate prepared as described above, the first target for forming the first layer and the second target for forming the second layer shown in Table 1 were arranged on opposite sides of the film forming apparatus. First, use the first ...

Embodiment 2

[0133] Opposed to the cover layer of Example 1, the first target for forming the first layer and the second target for forming the second layer shown in Table 4 were arranged opposite to the film forming apparatus. According to the film formation conditions in Table 4, the sample stage installed in the device was rotated while generating plasma from the two targets, and the first layer was alternately laminated at the period of the thickness shown in Table 5. Except for the coating layer having the configuration of the second layer, a cutting tool was produced in the same manner as in Example 1, and the cutting performance was evaluated in the same manner (I-15 to 28). The results are shown in Table 5.

[0134] [Table 4]

[0135]

[0136] The * mark represents a sample outside the scope of the present invention.

[0137] [table 5]

[0138]

[0139] The * mark represents a sample outside the scope of the present invention.

[0140] As can be seen from the results show...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

Disclosed is a cutting tool having high wear resistance, high lubricating properties and excellent defect resistance. Specifically disclosed is a cutting tool (1) comprising a base (2) and a coating layer (6) or (9) that covers the surface of the base (2), wherein the coating layer (6) or (9) comprises a first layer (7) comprising Ti1-a-b-c-dAlaWbSicMd(C1-xNx) [wherein M represents at least one member selected from Nb, Mo, Ta, Hf and Y; 0.45<=a<=0.55; 0.01<=b<=0.1; 0<=c<=0.05; 0.01=<d=<0.1; and 0=<x<=1] and a second layer (8) comprising Ti1-e-f-gAleSifM'g(C1-yNy) [wherein M' represents at least one member selected from Nb, Mo, Ta, Hf and Y; 0.50<=e<=0.60; 0<=f<=0.1; 0.05<=g<=0.15; and 0<=y<=1].

Description

technical field [0001] The present invention relates to a cutting tool in which a coating film is formed on the surface of a base. Background technique [0002] At present, the following methods of improving wear resistance, sliding properties, and chipping resistance are used in parts that require wear resistance, sliding properties, and chipping resistance, such as cutting tools, or friction-resistant parts, sliding parts, and the like. A coating film is formed on the surface of a substrate made of sintered alloys such as cemented carbide or cermets, high-hardness sintered bodies of diamond or cBN (cubic boron nitride), or ceramics such as alumina or silicon nitride. [0003] Physical vapor deposition methods such as arc ion plating and sputtering are widely used as the film forming method of the coating layer. In particular, nitride layers mainly composed of Ti and Al have been extensively studied, and efforts to extend the tool length Improved lifespan. For example, Pa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23B27/14C23C14/06
CPCC23C14/0641C23C14/0664C23C30/005C04B41/009C04B41/52C04B41/89Y10T407/27Y10T428/24975Y10T428/252Y10T428/265C04B35/117C04B35/5831C04B35/584C04B41/4529C04B41/5063C04B41/5068C04B41/5061C04B41/522
Inventor 胁真宏中冈达行立野周一渡边孝野田谦二牧野贵彦
Owner KYOCERA CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com