Compound copper powder for manufacturing capillary structure of inner wall of heat pipe

Abstract

The composite copper powder is a mixture of copper powder and pore-forming agent powder. The copper powder is selected from gas atomized copper powder, water atomized copper powder, oxide-reduced copper powder or electrolytic copper powder.The pore-forming agent powder may be ammonium carbonate, ammonium bicarbonate, copper sulfate, copper carbonate, copper hydroxide, ammonium nitrite, polyethylene glycol, polyvinyl alcohol, polyvinyl chloride, polystyrene, binary nitrogen-ammonia benzene, azobisisbutyromtple, azobisformamide, urea, paraffin or methylcellulose The composite copper powder can be used for manufacturing heat pipe with inner wall capillary structure. The heat pipe can be used for manufacturing high-efficiency radiator.

Description

technical field [0001] The invention relates to a composite copper powder, which is used for manufacturing the capillary structure of the inner wall of a heat pipe. The heat pipes include ordinary sintered heat pipes, composite heat pipes, loop heat pipes, flat heat pipes (Vapor chamber), etc., and can be used in aerospace, electrical, electronic and mechanical fields. Background technique [0002] In recent years, with the rapid development of aerospace, electrical and electronic fields, especially the rapid development of semiconductor manufacturing and electronic packaging technology, the work efficiency of electronic and electrical components has been greatly improved. However, while the components are working fast, the heat consumption is also greatly increasing, and the working life and stability of the devices are also severely restricted. According to statistics, when the operating temperature of the CPU rises by 10°C, its life It will be reduced by 50%; when the wo...

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Problems solved by technology

Due to its complicated process, it is not suitable for the production of heat pipes, and the porosity of the capillary structure layer and the heat conduction effect of heat pipes are not mentioned.

[0009] Chinese patent 200610156330.5 also proposes a method for preparing a high-porosity metal porous carrier material, but the sintering process requires multi-stage heat preservation, which is used for the adsorption storage of special substances and catalyst carriers, and the thermal conductivity is unknown

Not suitable for making heat pipes

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