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Device and method for forming a three-dimensional circuit board

A technology of three-dimensional circuit board and circuit board, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical recording process using charge pattern, etc., can solve the problem of end warping of circuit board, and achieve the effect of suppressing end warping

Inactive Publication Date: 2009-07-22
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even in response to such needs, in order not to cause overlapping or large gaps when pasting, and to cut the circuit board with the adhesive layer formed in advance with high precision, there is a problem of bonding the circuit board to the roller. After that, there is a problem of lifting at the end of the board

Method used

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  • Device and method for forming a three-dimensional circuit board
  • Device and method for forming a three-dimensional circuit board
  • Device and method for forming a three-dimensional circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] First, the circuit board 2b is produced as follows.

[0050] Using a 35 μm thick PET film (manufactured by Toyobo Co., Ltd., A4100), a copper thin film was formed on the surface by a sputtering method, and then a copper layer was formed by an electrolytic copper plating method. For electrolytic copper plating, use an electroplating solution with a copper sulfate concentration of 90g / liter and a sulfuric acid concentration of 180g / liter at room temperature, by making the cathode current density 2A / dm 2 , forming a copper capping layer with a thickness of 8 μm.

[0051] Furthermore, a dry film resist (dry film resist) (manufactured by Asahi Kasei Co., Ltd., AQ-1158) was pasted on the surface of the copper layer by a photolithography resist method, and a mask having a predetermined wiring shape was used to apply a dry film resist on the surface of the copper layer. Exposure is carried out on the agent, and then development, etching, and stripping of the dry film resist ar...

Embodiment 2

[0064] First, the circuit board 2 is fabricated as follows.

[0065] Using a double-layer substrate (manufactured by Sumitomo Metal Mining Co., Ltd., S'perFlex) in which a 38-μm-thick polyimide film is laminated with an 8-μm-thick copper foil, it is pasted on the surface of the copper layer by a photoresist method. Dry film resist (manufactured by Asahi Kasei Co., Ltd., AQ-1158), make a mask of the wiring shape, after that, expose on the dry film resist, then develop, etch and peel off the dry film resist to obtain Circuit board 2b.

[0066] Next, the obtained circuit board 2b and the thermocompression-bonding type adhesive film 2a with a separator (manufactured by Nikon Industry Co., Ltd., SAFW) were each cut with a die and rotated. The side in the axial direction is 50.3 mm, and the side in the perpendicular direction is 350 mm. In addition, in this adhesive film 2a, the separator is arrange|positioned only on the surface side. After cutting, the adhesive film with the se...

Embodiment 3

[0075] As the roll 1 , an aluminum pipe having an adhesive layer formed on its surface was used. Specifically, a solution obtained by diluting a solution-type denatured epoxy-based adhesive (Aron mighty AS-60, manufactured by Toagosei Co., Ltd.) with toluene in advance to 2 times was used. For a diameter of 16 mm, An aluminum tube with a length of 300 mm was dip-coated, heated to 100° C., and kept for 2 minutes. The dried aluminum tube was used as the roll 1. The process was the same as in Example 2 except that the process of sticking the adhesive film 2 a was omitted. , the roller 1 is heated with a heater by a rotating device, and the adhesive layer is pasted on the circuit board 2b in an activated state, thereby obtaining a three-dimensional circuit board 3 .

[0076] From the obtained three-dimensional wiring board 3 , the gap between the sides of the pasted wiring board 2 b was measured for each sample. In addition, the state of curling up of the end according to the ela...

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PUM

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Abstract

The present invention provides a forming device and forming method of stereo circuit board, which can accuracy paste circuit board in correct location on roller surface of cylinder-shape or barrel-shape, especially on the whole circle to make gaps being the smallest and most shallow. Forming device of the stereo circuit board includes rotary mechanism (10), which holding objects (1) of cylinder-shape or barrel-shape in horizontal status of central axis and rotating the object (1) around the central axis as rotating axle; holding mechanism (20) which holding adhesive film with isolation film with the exposed adhesive layer adown, and carrying horizontally; controlling mechanism (30), which can adjust relative position to make the carried adhesive film with isolation film (2a) or the circuit board (2b) contact with surface of the rotating object (1) and controlling the pressure pushed against the object (1) surface as constancy.

Description

technical field [0001] The present invention relates to a forming device and a forming method of a three-dimensional circuit board, in particular to a device and a method for forming a three-dimensional circuit board by pasting the circuit board on the surface of a roller. Background technique [0002] With the miniaturization, multi-function and cost reduction of electronic devices such as mobile phones, it is necessary to compactly mount circuit boards on the inner and outer surfaces of the casings. Therefore, it is sometimes required that the circuit board is not a planar circuit board but a three-dimensional circuit board. Also in the field of copiers, it has been proposed to form a three-dimensional circuit board by affixing a circuit board to a part or the entire circumference of a roller such as a developing roller, a charging roller, or a transfer roller. [0003] As a method of forming a circuit board on the entire circumference of the surface of the roll, it is co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00G03G15/00
CPCH05K3/388H05K3/4611H05K2203/0143
Inventor 冈田浩吉田堪
Owner SUMITOMO METAL MINING CO LTD
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