Cutting method of super-hard crystal
A cutting method and superhard crystal technology, which are applied to fine working devices, manufacturing tools, stone processing equipment, etc., can solve the problems of small cutting warpage, reduced diamond powder usage, and high cost of superhard crystals. Small warpage, reduced cutting cost, small warpage effect
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Embodiment 1
[0018] Example 1: Cutting of a 3-inch sapphire crystal
[0019] Using the TRS440 wire cutting machine produced in the United States, using the high-speed reciprocating motion of cutting copper wire and cutting mud to realize the cutting of sapphire crystal with a diameter of 3 inches. Specific steps are as follows:
[0020] ① Adjust the wire cutting machine to be in a horizontal state, install the copper cutting wire on the winding wheel, and then adjust the copper wire on the winding wheel, tensioning wheel and guiding wheel to be on the same plane through the tensioning wheel and the guiding wheel, so that The tension on the copper wire is evenly distributed;
[0021] ②The cutting mud is prepared according to (200 carats of diamond powder + 50 carats of boron carbide or 4:1) / per liter of olive oil;
[0022] ③ Install the sapphire crystal to be cut, adjust the cutting direction of the crystal, stick the crystal on the special base, and then fix the base on the workbench;
...
Embodiment 2
[0026] Example 2: Cutting of a 2-inch sapphire crystal
[0027] The cutting method and specific cutting steps are the same as in Example 1, and the cutting mud is prepared according to (150 carats of diamond micropowder+50 carats of boron carbide that is 3:1) / per liter of olive oil; the wire feeding speed is 25m / min, and the cutting speed is 4.5mm / h. The wafer obtained by dicing has a warpage of less than 30 μm and a thickness unevenness of less than 15 μm.
Embodiment 3
[0028] Example 3: Cutting of 2-inch silicon carbide crystal
[0029] Silicon carbide crystals are slightly harder than sapphire crystals, so it is necessary to increase the proportion of diamond powder in the cutting mud and the wire feeding speed, and reduce the cutting speed. The TRS440 wire cutting machine produced in the United States is used to cut the silicon carbide crystal with a diameter of 2 inches by using the high-speed reciprocating motion of cutting copper wire and cutting mud. Specific steps are as follows:
[0030] ① Adjust the wire cutting machine to be in a horizontal state, install the cutting copper wire on the winding wheel, and then adjust the copper wire on the winding wheel, tensioning wheel and guiding wheel to be on the same plane through the tensioning wheel and the guiding wheel, so that The tension on the copper wire is evenly distributed;
[0031] ②The cutting mud is prepared according to (250 carats of diamond powder + 50 carats of boron carbid...
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