Production method for implementing selective emitter solar battery
A solar cell and manufacturing method technology, applied in circuits, electrical components, climate sustainability, etc., can solve problems such as unsatisfactory effects and insufficient phosphorus activation, and achieve the effects of easy implementation, low equipment investment, and convenient sources.
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Embodiment 1
[0013] 1. Select P-type single crystal silicon wafer, crystal phase , resistivity 0.5Ω.cm, remove surface damage of silicon wafer, form anti-reflection surface texture and chemical cleaning;
[0014] 2. Using a tubular diffusion furnace, in POCl 3 Light doping diffusion is carried out in the atmosphere, and the sheet resistance of the emitter after diffusion is 100Ω / □;
[0015] 3. Clean the dephosphorous silicon glass, and remove the peripheral and back PN junctions by plasma etching;
[0016] 4. Deposit silicon nitride anti-reflection layer and surface passivation. Silicon nitride is deposited by PECVD method with a thickness of 30nm, and the passivation of defects in the body is realized in the subsequent process;
[0017] 5. Print antimony-doped silver paste on the front of the battery by screen printing process, the mass content of antimony metal is 1.0%, and the doped antimony is high-purity >99.9% simple metal antimony;
[0018] 6. The back electrode is printed and sin...
Embodiment 2
[0020] 1. Select P-type single crystal silicon wafer, crystal phase , resistivity 1.0Ω.cm, remove surface damage of silicon wafer, form anti-reflection surface texture and chemical cleaning;
[0021] 2. Using a tubular diffusion furnace, in POCl 3 Light doping diffusion is carried out in the atmosphere, and the sheet resistance of the emitter after diffusion is 200Ω / □;
[0022] 3. Clean the dephosphorous silicon glass, and remove the peripheral and back PN junctions by plasma etching;
[0023] 4. Deposit the anti-reflection layer and surface passivation. First grow a layer of 10nm SiO2 in an open-tube furnace, and then deposit 50nm silicon nitride on it. The silicon nitride is deposited by PECVD and realized in vivo in the subsequent process. passivation of defects;
[0024] 5. On the front of the battery, antimony and nickel-doped silver paste is printed by screen printing process. The mass content of antimony is 5%, and the doped antimony is high-purity >99.9% simple metal...
Embodiment 3
[0027] 1. Select P-type monocrystalline silicon wafers, crystal phase , and resistivity 10Ω.cm. After the silicon wafers are cleaned by RCA process, they are textured to obtain a "pyramid" texture;
[0028] 2. Using a tubular diffusion furnace, in POCl 3 Light doping diffusion is carried out in the atmosphere, and the sheet resistance of the n-type emitter after diffusion is 100Ω / □;
[0029] 3. Clean the dephosphorous silicon glass, and remove the peripheral and back PN junctions by plasma etching;
[0030] 4. Deposit anti-reflection layer and surface passivation, first grow a layer of 10nm SiO with an open tube furnace 2 , and then deposit 50nm silicon nitride on it, and silicon nitride is deposited by PECVD method;
[0031] 5. The silver paste mixed with antimony and gold is printed on the front of the battery by screen printing process. The mass content of antimony is 1.0%.
[0032] 6. The back electrode is printed and sintered, and the sintering adopts rapid high-temper...
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