Method for recovering cutting solution from by-product of silicon chip cutting processing

Abstract

The present invention provides a method for recovering cutting fluids from the silicon chip cutting processing byproduct. The silicon chip cutting processing byproduct is added to a separating agent after being mixed according to the technical method of the invention, the mixing temperature is normal temperature or 50-80 celsius degree; 50-95% paste riching in carborundum and 5-50% suspending liquid poor in carborundum are obtaind by mechanical separator; the paste riching in carborundum is used for carborundum recycling; suspending liquid poor in carborundum is solid-liquid separated by solid-liquid separation device, the temperature of the solid-liquid separation is normal temperature or 50-80 celsius degree; solid-liquid separating fluid is added with stabilizing agent, reacting 1-12 hours under the temperature 70-130 celsius degree, after the reaction finished, suspending liquid poor in carborundum is cooled to temperature suitable for mechanical filter, filtering solid particles of the suspending liquid poor in carborundum obtains a recovery cutting fluid. Recovering cutting fluid is used fpr cutting silicon chip.

Description

technical field [0001] The invention relates to a method for recovering cutting fluid from by-products of silicon wafer cutting. The application fields are mainly the by-products of silicon wafer cutting and processing in the solar energy industry and the by-products of silicon wafer cutting and processing in the electronics industry. The recovered cutting fluid can be reused for cutting silicon wafers. Background technique [0002] During the cutting process of solar-grade and electronic-grade silicon wafers, due to the effects of thermal and mechanical stress, problems such as microcracks, chipping and damage are prone to occur, resulting in secondary defects in silicon wafer processing, and silicon wafers and chips are easy to break Wait. In order to solve the stability problem of the wire cutting process and reduce the occurrence of secondary defects, selecting a cutting fluid with excellent performance has become an important task in the wire cutting process. The cut...

AI Technical Summary

Problems solved by technology

At present, cutting fluid mainly includes imported products from the United States, Japan and other countries and a small amount of domestic products. No matter what kind of product, its technical formula is highly confidential, so the price is expensive

[0003] A large number of by-products are produced during the silicon wafer cutting process, and the main components of this by-product are a large amount of organic matter (that is, the main components of the cutting fluid: ethylene glycol, polyethylene glycol, ethylene glycol monomethyl ether, surfactants mixed fluid), and the silicon carbide added therein when using the cutting fluid (the silicon carbide is used as the abrasive of the cutting fluid), and the polysilicon (or monocrystalline silicon) particles produced during the cutting process; If the product is not handled properly, it will not only cause serious environmental pollution, but also waste a lot of resources.