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Method for preparing metal binding agent diamond scroll saw

A technology of diamond wire saw and metal bond, which is applied in the direction of metal sawing equipment, metal processing equipment, tool manufacturing of sawing machine devices, etc. Application prospects, the effect of enhancing the binding performance

Inactive Publication Date: 2008-07-02
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problems of environmental pollution, low production efficiency, high cost, low product strength, poor wear resistance and heat resistance of the existing manufacturing method of consolidated abrasive diamond wire saw, and provides an environmentally friendly, efficient and low-cost The method of producing diamond wire saw at the lowest cost, and at the same time, the product has good wear resistance and bonding strength

Method used

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  • Method for preparing metal binding agent diamond scroll saw
  • Method for preparing metal binding agent diamond scroll saw

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] This embodiment relates to a manufacturing method of a wire saw for cutting semiconductor materials (such as silicon and silicon carbide, gallium arsenide, bismuth telluride), optoelectronic materials, piezoelectric crystals, magnetic materials, and the like.

[0025] Refer to attached figure 1 : a preparation method of a metal bond wire saw, the method comprising the following steps:

[0026] (1) Surface treatment of metal saw wire: Size of metal saw wire: diameter 0.2mm, length: 100m; first wash in the self-prepared alkaline solution for about 5 minutes, and rinse with water after completion. Then wash it in the self-prepared acid solution for about 5 minutes, then rinse with water after pickling to remove the residual acid solution.

[0027] (2), help plating treatment: put the steel wire in the self-provided NH 4 Cl, ZnCl 2 , KCl mixed solution dip-plating, and scrubbing with mechanical force, so that the surface is evenly coated with plating flux and dried.

[...

Embodiment 2

[0051] This embodiment introduces a metal bond wire saw for cutting semiconductor materials (such as silicon and silicon carbide, gallium arsenide, bismuth telluride), optoelectronic materials, piezoelectric crystals, and magnetic materials.

[0052] refer to figure 1 , its preparation method comprises the following steps:

[0053] (1) Surface treatment of metal saw wire: Size of metal saw wire: diameter 0.2mm, length: 100m; first wash in the self-prepared alkaline solution for about 5 minutes, and rinse with water after completion. Then wash it in the self-prepared acid solution for about 5 minutes, then rinse with water after pickling to remove the residual acid solution.

[0054] (2), help plating treatment: put the steel wire in the self-provided NH 4 Cl, ZnCl 2 , KCl mixed solution dip-plating, and scrubbing with mechanical force, so that the surface is evenly coated with plating flux and dried.

[0055] (3), batching, with 98.14g commercially available zinc alloy, th...

Embodiment 3

[0061] The feature of this implementation is that in the preparation step (3) seasoning, the concentration of abrasive grains is 25%, and the rest are the same as in Embodiment 1.

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Abstract

The invention provides a preparation method and the product of a metal binder diamond wire saw, comprising the preparation steps of (1) steel wire surface, (2) plating auxiliary disposal of the steel wire, (3) burdening, (4) plating of steel wire and (5) post-processing. The thickness of the binder coating ranges from 1 / 2 to 2 / 3 of the grain diameter of the diamond. By a series of chemical and diffusion reaction, the surface of the steel wire is covered by a layer of uniform and firm coating 3; a diamond mill grain 2 is also uniformly held in a metal binding layer 1, thus achieving the cutting object.

Description

1. Technical field [0001] The invention relates to a preparation method of a diamond wire saw. 2. Background technology [0002] The traditional cutting of semiconductor materials has been using diamond inner and outer circle cutting technology. However, with the development of the semiconductor industry, especially the gradual increase in the diameter of silicon crystal blocks, due to the influence of various factors such as output, productivity, and size, diamond wire saws will It is widely used in the cutting of hard and brittle materials such as monocrystalline silicon, polycrystalline silicon, gallium arsenide, lithium tantalate, lithium niobate and other semiconductor materials and semiconductor dies. [0003] At present, the mainstream diamond wire sawing machine adopts the diamond wire cutting technology with free abrasive grains, that is, when cutting, the steel wire travels along the longitudinal direction and is pressed against the workpiece at the same time, when...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23D65/00B23D61/18B28D1/12
Inventor 彭伟毛炜
Owner ZHEJIANG UNIV OF TECH
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