Chemical stannum-plating solution

A technology of electroless tin plating and solution, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of short stability time of tin plating solution and inability to meet requirements, and achieve easy control of process and thickness. Wide-ranging, light-enhancing effects

Inactive Publication Date: 2009-10-07
TAIYUAN NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Some people in China have studied electroless tin plating (Sun Wu et al. Research material protection of chemical tin plating liquid additives, 2007 No. 1), and provided tin plating liquid formulas including stannous sulfate, concentrated sulfuric acid, complexing agents, sodium hypophosphite, etc. The tin plating solution has a short stabilization time, and the thickness of the obtained coating is about 0.5 μm, which cannot meet the requirements of most users.

Method used

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  • Chemical stannum-plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Example 1: Composition ratio of electroless tin plating solution per liter

[0025] Stannous sulfate (or stannous chloride) 10g / L

[0026] Concentrated sulfuric acid (content 98%) 20mL / L

[0027] Schiff Base 0.1g / L

[0028] Polyethylene glycol 6000 0.005g / L

[0029] Sodium hypophosphite 0g / L

[0030] Amidinothiourea 0.02g / L

[0031] Pyritinol hydrochloride 0.01g / L

[0032] 4,4'-(2-pyridinemethylene) diphenol 0.01 / L

[0033] Glucuronic acid 0.2g / L

[0034] The rest is deionized water.

[0035] The tin plating solution is used to plate tin on the surface of the copper material, the working temperature is 65°C, the plating time is 90 seconds, and the plating thickness is 1.01 μm. The plating solution can be stored stably for more than 90 days at room temperature.

Embodiment 2

[0036] Example 2: Composition ratio of electroless tin plating solution per liter

[0037] Stannous sulfate (or stannous chloride) 40g / L

[0038] Concentrated sulfuric acid (content 98%) 70mL / L

[0039] Schiff Base 3g / L

[0040] Polyethylene glycol 6000 0.015g / L

[0041] Sodium hypophosphite 80g / L

[0042] Amidinothiourea 0.08g / L

[0043] Pyritinol hydrochloride 0.06g / L

[0044] 4,4'-(2-pyridinemethylene) diphenol 0.05g / L

[0045] Glucuronic acid 0.05g / L

[0046] The rest is deionized water.

[0047] The tin plating solution is used for tin plating on the surface of the copper material, the working temperature is 20 DEG C, the plating time is 30 seconds, and the plating thickness is 0.45 μm. The plating solution can be stored stably for more than 90 days at room temperature.

Embodiment 3

[0048] Example 3: Composition ratio of electroless tin plating solution per liter

[0049] Stannous sulfate (or stannous chloride) 25g / L

[0050] Concentrated sulfuric acid (content 98%) 35mL / L

[0051] Schiff Base 2g / L

[0052] Polyethylene glycol 6000 0.01g / L

[0053] Sodium hypophosphite 30g / L

[0054] Amidinothiourea 0.05g / L

[0055] Pyritinol hydrochloride 0.04g / L

[0056] 4,4'-(2-pyridinemethylene) diphenol 0.03g / L

[0057] Glucuronic acid 0.3g / L

[0058] The rest is distilled water.

[0059] The tin plating solution is used for tin plating on the surface of the copper material, the working temperature is 60°C, the plating time is 85 seconds, and the plating thickness is 1.42 μm. The plating solution can be stored stably for more than 90 days at room temperature.

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Abstract

The invention provides an electroless tin plating solution, the components of which include stannous sulfate or stannous chloride, concentrated sulfuric acid, sodium hypophosphite, pyrithione hydrochloride, 4,4'-(2-pyridine methylene) di Phenol, Schiff base, polyethylene glycol 6000, amidinothiourea, etc. The tin plating solution is used to replace tin on the surface of steel, copper or copper alloy materials. The working temperature is 20-65°C, the plating time is 30-90 seconds, the thickness of the coating is 0.45-1.42μm, and the plating solution can be stored stably at room temperature. More than 90 days.

Description

Technical field [0001] The invention relates to chemical plating on the surface of metal materials, in particular to a solution for chemical displacement tin plating on the surface of steel, copper or copper alloy substrates. Background technique [0002] Tin plating is a coating with good solderability and certain corrosion resistance, which is widely used in the electronics industry. However, the coating obtained from the Sn electroplating solution is often accompanied by the precipitation of coarse particles and the growth of tin whiskers. This tin whisker is one of the main hazards that cause electrical short circuits. To avoid this situation, a coating thickness of 5 μm is necessary . Unlike electroless tin plating, there is no stress, the deposited particles are very small and dense, and there are no pinholes. The thickness of the coating layer of 0.45~1.2μm can meet the requirements of most users. Therefore, electroless tin plating is particularly suitable for the surface ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/31
Inventor 任跃红冯美荣张耀文李文娟
Owner TAIYUAN NORMAL UNIV
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