31results about How to "Solve the drop in quantum efficiency" patented technology

The invention relates to an LED packaging method. The method comprises the following steps of selecting an ultraviolet lamp wick; welding the ultraviolet lamp wick on a substrate through the reflow soldering process; coating silica gel on the ultraviolet lamp wick and the substrate to prepare a multilayer lens layer, and completing the LED packaging process. By adopting the LED packaging method, through preparing the multilayer lens layer, the refractive index is sequentially increased, so that the light transmittance of the LED lamp wick can be improved. Therefore, more light emitted by the LED lamp wick can be irradiated out through packaging materials.

The invention relates to an LED lamp and an LED packaging method. The packaging method comprises the steps of selecting an LED chip; selecting heat sink and cleaning the heat sink; welding a lead of the LED chip on the heat sink; and potting a light guide material on the heat sink to make light emitted from the LED chip emit outwards through the light guide material. The LED lamp provided by the invention is packaged by adopting the method; and according to the packaging method, through separation of fluorescent powder from the LED chip, the problem that the quantum efficiency and the light transmittance of the fluorescent powder are reduced due to high temperature is solved.

The invention relates to an LED package structure. The structure comprises a cooling substrate 101, a blue-light lamp wick chip, first semi-spherical silica gel lenses 102, lower-layer silica gel 103,second semi-spherical silica gel lenses 104 and upper-layer silica gel 105, wherein the blue-light lamp wick chip is arranged on an upper surface of the cooling substrate 101, the first semi-spherical silica gel lenses 102 are arranged on upper surfaces of the blue-light lamp wick chip and the cooling substrate 101 at intervals, the lower-layer silica gel 103 is arranged on upper surfaces of theblue-light lamp wick chip and the first semi-spherical silica gel lenses, the second semi-spherical silica gel lenses 104 are arranged on an upper surface of the lower-layer silica gel 103 at intervals, and the upper-layer silica gel 105 is arranged on upper surfaces of the lower-layer silica gel 103 and the second semi-spherical silica gel lenses 104. In the LED package structure, the cooling effect of an LED is improved by employing an iron cooling substrate with an oblique through hole structure; with the adoption of the two-layer semi-spherical silica gel lens structure, the light from anLED chip can be enabled to penetrate through a package material very well to irradiate, and the light transmittance is improved.

The invention relates to an LED packaging structure, which comprises an LED bottom plate (11), a first silica gel layer (12), a lens area (13) and a second silica gel layer (14), wherein the first silica gel layer (12) is arranged on the LED bottom plate (11); the lens area (13) is arranged on the first silica gel layer (12); and the second silica gel layer (14) is arranged on the first silica gellayer (12) and the lens area (13). According to the LED packaging structure provided by the invention, by adopting a technology for separating fluorescent powder from an LED chip, the problem that the quantum efficiency of the fluorescent powder is reduced due to high temperature is solved; and silica gel in contact with the LED chip is high temperature-resistant silica gel, so that the problem that the light transmittance is reduced due to ageing and yellowing of the silica gel is solved; and meanwhile, provided silica gel spheres are uniformly arranged in a rectangle or diamond manner, so that uniform distribution of light of a light source in a concentration area can be ensured.

The invention relates to an LED packaging method. The method comprises steps: a cooling substrate is selected; a blue light chip is welded on the cooling substrate by using a welding technology; a first hemispherical silica gel lens grows on the blue light chip; a lower silica gel layer grows on the blue light chip and the first hemispherical silica gel lens; a second hemispherical silica gel lensgrows on the lower silica gel layer; and an upper silica gel layer grows on the lower silica gel layer and the second hemispherical silica gel lens to complete LED packaging. According to the LED packaging structure of the invention, through adopting the iron cooling substrate with an oblique through hole structure, the cooling effects of the LED are increased; through adopting the spherical silica gel lens structure, light of the LED chip can shine out better through the packaging material, and the light transmittance is improved.

The invention relates to an LED packaging structure, which comprises a heat dissipation substrate (21), an LED chip and a silica gel layer, wherein the LED chip is fixedly connected to the heat dissipation substrate (21); the silica gel layer comprises a first silica gel layer (22), a hemispherical lens layer (23) and a second silica gel layer (24); the hemispherical lens layer (23) is embedded between the first silica gel layer (22) and the second silica gel layer (24); the hemispherical lens layer (23) comprises a plurality of hemispherical lenses; and the second silica gel layer (24) contains fluorescent powder. According to the LED packaging structure, the hemispherical lens layer is arranged between the first silica gel layer and the second silica gel layer, and the fluorescent powderis contained in the second silica gel layer, so that light beams are more concentrated and uniform in irradiation, direct contact of the fluorescent powder and the LED chip is avoided and the light extraction efficiency is improved.

The invention relates to a package process of a large-power blue-light LED dual-layer structure. The package process comprises the following steps of (a) fabricating a package cooling substrate, welding an LED lamp core on the package cooling substrate, and coating a first silica gel layer on the package cooling substrate; (b) forming a first spherical lens; (c) laminating the first spherical lensin the first silica gel layer; (d) coating a second silica gel layer at an upper part of the first spherical lens, and coating a third silica gel layer on the second silica gel layer; (e) forming a second spherical lens; (f) laminating the first spherical lens in the first silica gel layer; and (g) coating a fourth silica gel layer at an upper part of the second spherical lens, wherein at least one of the second silica gel layer, the third silica gel layer and the fourth silica gel layer is provided with fluorescent power, and the LED lamp core is a ultraviolet lamp core. According to the package process of the large-power blue-light LED dual-layer structure, secondary shaping is not needed, and the process is simple and is low in cost.

The invention relates to a white-light LED package structure. The structure comprises a heat radiation substrate 21, an LED lamp chip arranged on the upper surface of the heat radiation substrate 21,a lower silica gel layer 22 arranged on the upper surface of the LED lamp chip, hemispherical silica gel balls 23 arranged on the upper surface of the lower silica gel layer 22, and an upper silica gel layer 24 arranged on the upper surfaces of the lower silica gel layer 22 and the hemispherical silica gel balls 23. The white-light LED package structure solves the problem of reduction of quantum efficiency of fluorescent powders due to high temperature by separating the fluorescent powders from the LED lamp chip.

The invention relates to an LED packaging method, which comprises the steps of selecting a heat dissipation substrate; welding an ultraviolet chip on the heat dissipation substrate by using a weldingprocess; growing lower silica gel on the ultraviolet chip; growing a spherical silica gel lens on the lower silica gel; and growing upper silica gel on the spherical silica gel lens to complete packaging of an LED. According to an LED packaging structure, the heat dissipation effect of the LED is improved by adopting the iron heat dissipation substrate with a through hole structure; the conditionthat an LED chip can better irradiate outwards through a packaging material can be ensured by adopting a spherical silica gel lens structure; and the light transmittance is improved.

The invention relates to an LED lamp and an LED packaging technology. The packaging technology comprises the steps of selecting an LED chip; welding the LED on heat sink (21) and arranging the heat sink (21) on a bracket; and forming multiple silica gel layers on the LED chip to achieve packaging of the LED chip, wherein the silica gel layer, in contact with the LED chip, in the multiple silica gel layers does not contain fluorescent powder. According to the LED packaging technology, the fluorescent powder is separated from the LED chip, so that the problem that the quantum efficiency of the fluorescent powder is reduced due to high temperature is solved; and silica gel in contact with the LED chip is high-temperature resistant silica gel, so that the problem that the light transmittance is reduced due to ageing and yellowing of the silica gel is solved.

The invention relates to an LED packaging structure and a high-concentration LED lamp. The LED packaging structure comprises heat sink (21), an LED chip, a first silica gel layer (22), a first lens layer (23), a second silica gel layer (24), a third silica gel layer (25), a second lens layer (26) and a fourth silica gel layer (27), wherein the LED chip is arranged on the heat sink (21); the silicagel layer (22) coats the LED chip and the heat sink (21); the first lens layer (23) is prepared on the first silica gel layer (22); the second silica gel layer (24) and the third silica gel layer (25) are sequentially arranged on the first lens layer (23); the second lens layer (26) is arranged on the third silica gel layer (25); and the fourth silica gel layer (27) is arranged on the second lenslayer (26). According to the LED packaging structure provided by the invention, fluorescent powder is separated from the LED chip, so that the problem that the quantum efficiency of the fluorescent powder is reduced due to high temperature is solved; and silica gel in contact with the LED chip is high-temperature resistant silica gel, so that the problem that the light transmittance is reduced due to ageing and yellowing of the silica gel is solved.

The invention discloses a high-power LED wall washer lamp. The high-power LED wall washer lamp comprises a shell 301, a wall washer lamp body 303, support frames 302 arranged at two ends of the shell301, mounting pieces 304 arranged at the bottoms of the support frames 302, a lamp tube 305 arranged in the shell 301, and a lamp cover 306 arranged at the top of the wall washer lamp body 303 and connected with the shell 301. A high-power LED lawn lamp can be used for a long time through additional arrangement of a protection device; and in addition, as most wall washer lamps are mounted on wallsof high-rise buildings, switches for wirelessly controlling the LED wall washer lamps are selected to achieve convenience to use and maintain and broad market prospect.

The invention relates to an LED packaging structure, which comprises a heat dissipation substrate 01, an ultraviolet lamp core 03 and a silica gel layer 05, wherein the ultraviolet lamp core 03 is arranged on the upper surface of the heat dissipation substrate; and the silica gel layer 05 is arranged on the heat dissipation substrate and the upper surface of the ultraviolet lamp core. According tothe LED packaging structure provided by the invention, the refractive indexes are sequentially increased through multiple lens layers, so that the light transmittance of the LED lamp core can be improved, and more light emitted from the LED lamp core can shine out through a packaging material.

The invention relates to a high-power LED double-layer hemispherical structure packaging technology, which comprises the following steps of (a) preparing a packaging heat dissipation substrate and welding an LED lamp core on the packaging heat dissipation substrate; (b) coating the packaging heat dissipation substrate with first lens silica gel and forming a plurality of first hemispherical lenses, wherein the first hemispherical lenses are of a hemispherical convex lens structure; (c) coating the upper parts of the first hemispherical lenses with a first silica gel layer; (d) coating the first silica gel layer with second lens silica gel and forming a plurality of second hemispherical lenses, wherein the second hemispherical lenses are of a hemispherical convex lens structure; and (e) coating the upper parts of the second hemispherical lenses with a second silica gel layer, wherein at least one layer of the second hemispherical lenses and the second silica gel layer contains fluorescent powder and the LED lamp core is an ultraviolet lamp core. According to the high-power LED double-layer hemispherical structure packaging technology, secondary shaping is not needed, so that the technology is simple and the cost is low.

The invention discloses a multilayer packaging structure of a high-power blue-light LED. The structure comprises a plurality of groups of lens layers (1), a heat dissipation substrate (21) and an outer packaging layer (3). The lens layers (1) are arranged on the heat dissipation substrate (21). The outer packaging layer (3) is further arranged on the topmost part of the plurality of groups of lenslayers (1). Each group of the lens layers comprises a lower packaging layer (11), an upper packaging layer (12) and a spherical lens (13). At least a part of a spherical lens (23) is embedded into the lower packaging layer (22). The upper packaging layer (24) is located in the non-embedded part of the spherical lens (23) and is above the lower packaging layer (22). According to the multilayer packaging structure of the high-power blue-light LED provided in the invention, the spherical lens is adopted. Therefore, the technical problem that the illumination brightness of a light source is not centralized enough is solved. Meanwhile, the secondary shaping is not needed, so that the structure is simple. The production cost is reduced. In addition, compared with the prior art, fluorescent powders do not need to be coated on a chip. The problem that the brightness is reduced due to the fact that the quantum efficiency of fluorescent powders caused by high temperature is reduced is solved.

The invention relates to an LED package method. The LED package method comprises the steps of preparing a cooling substrate (21); preparing an LED chip, fixedly connecting the LED chip onto the cooling substrate (21); forming a first silica gel layer (22) on an upper surface of the LED chip; forming a semi-spherical lens layer (23) on an upper surface of the first silica gel layer (22), wherein the semi-spherical lens layer (23) comprises a plurality of semi-spherical lenses; forming a second silica gel layer (24) above the semi-spherical lens layer (23) and the first silica gel layer (22), wherein the second silica gel layer (24) contains fluorescent powder; and baking an LED package structure comprising the first silica gel layer (22), the semi-spherical lens layer (24) and the second silica gel layer (24) for a long time so as to complete package of an LED. According to the LED package method disclosed by the embodiment of the invention, the semi-spherical lens layer is arranged between the first silica gel layer and the second silica gel layer, the fluorescent powder is arranged in the second silica gel layer, so that light beams are more concentrated and uniformly irradiate, moreover, the fluorescent powder is prevented from being in direct contact with the LED chip, and the light extraction efficiency is improved.