LED packaging structure

Abstract

The present invention relates to a LED packaging structure which comprises a heat-dissipating substrate 101, an ultraviolet chip which is located on the upper surface of the heat-dissipating substrate101, a lower-layer silica gel 102 which is located on the upper surface of the ultraviolet chip, an upper-layer silica gel 104 which is on the upper surface of the lower-layer silica gel 102, and hemispherical silica gel lenses 103 at the an interface between the lower-layer silica gel 102 and the upper-layer silica gel 104. According to the LED packaging structure, the heat-dissipating effect ofan LED is improved by using an iron heat-dissipating substrate with a through-hole structure, by using a hemispherical silica gel lens structure, the light emitted by an LED chip can pass through a packaging material well, and the transmittance of the light is improved.

Description

Technical field [0001] The present invention relates to the technical field of LED packaging, and in particular to an LED packaging structure. Background technique [0002] As a new type of solid-state light source, LED has the advantages of small size, high luminous efficiency, low energy consumption, long life, no mercury pollution, all solid state, fast response, low working voltage, safety and reliability, etc. It is used in lighting and display Such fields have very broad application prospects and market economic benefits, and are expected to become a new generation of green and environmentally friendly lighting sources that replace the existing fluorescent lamps and incandescent lamps. Therefore, they have received extensive attention from domestic and foreign researchers. [0003] In recent years, LEDs mostly use blue wicks and yellow fluorescence to generate white light to achieve illumination. This method has the following problems. [0004] First of all, the light emitted ...

AI Technical Summary

Problems solved by technology

Finally, because high-power LEDs are used in lighting and other occasions, cost control is very important, and the structural size of the external heat sink of high-power LED lamps is not allowed to be too large, and it is impossible to allow active cooling by adding electric fans and other methods. The safe junction temperature should be within 110°C. If the junction temperature is too high, it will lead to a series of problems such as reduced light intensity, spectral shift, increased color temperature, increased thermal stress, and accelerated chip aging, which greatly reduces the service life of the LED. At the same time, it can also lead to accelerated aging of the encapsulation gel filled on the chip, affecting its light transmission efficiency

At present, most of the chips are packaged on thin metal heat dissipation substrates. Because metal heat dissipation substrates are thin, have small heat capacity, and are easy to deform, the contact between them and the bottom surface of the heat sink is not close enough to affect the heat dissipation effect.

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