269results about "Orthogonal PCBs mounting" patented technology

A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.

A differential connector has a plurality of rows. Each row includes a plurality of signal conductors provided as differential pairs. Each signal conductor has a first contact end connectable to a printed circuit board, a second contact end, and an intermediate portion having a first width. For each differential pair, one first contact end lies along a first line parallel to the plurality of rows and the other first contact end lies along a second line parallel to and spaced from the first line. The differential connector further includes a plurality of ground conductors, with each ground conductor corresponding to a differential pair. Each ground conductor has a first contact end connectable to the printed circuit board, a second contact end, and an intermediate portion having a second width that is at least twice the first width.

A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.

A system and method are disclosed in which flex cables are affixed to PCBs, for providing high-speed signaling paths between ICs disposed upon the PCBs. The flex cables are fixably attached to the PCBs so as to substantially mimic their structural orientation. Where the configuration includes more than one PCB, the flex cables include multiple portions which are temporarily separable from one another and from the die, using flex-to-flex and flex-to-package connectors, allowing field maintenance of the configuration. By routing the high-speed signals between ICs onto the flex cable, single-layer PCBs can be used for non-critical and power delivery signals, at substantial cost savings. By disposing the flex cables onto the PCB rather than allowing the cables to float freely, the configuration is thermally managed as if the signals were on the PCB and cable routing problems are avoided.

The disclosed board fabrication techniques and design features enable the construction of a reliable, high-layer-count, and economical backplane for routers and the like that require a large number of signaling paths across the backplane at speeds of 2.5 Gbps or greater, as well as distribution of significant amounts of power to router components. The disclosed techniques and features allow relatively thick (e.g., three- or four-ounce copper) power distribution planes to be combined with large numbers of high-speed signaling layers in a common backplane. Using traditional techniques, such a construction would not be possible because of the number of layers required and the thickness of the power distribution layers. The disclosed embodiments use novel layer arrangements, material selection, processing techniques, and panel features to produce the desired high-speed layers and low-noise high-power distribution layers in a single mechanically stable board.

In the case where high speed differential signals are transmitted in differential transmission lines through via holes with open-stubs, signal waveforms are distorted due to impedance mismatch in the open-stubs of the via holes, thus causing jitter, which has become an issue of high speed signals. For differential transmission lines that pass through via holes with open-stubs, a degree of coupling of the lines is decreased while the differential characteristic impedance is made constant. Thereby, the effects of backward cross talk noise caused by the coupling can be minimized, and thus jitter can be suppressed.

A connector for connecting a first printed circuit board with a second printed circuit board that comprises a first column of differential signal pair launches offset from a second column of differential signal pair launches on the first printed circuit board so that each differential signal pair in the first column is closest to a launch of a first polarity in a corresponding differential signal pair in the second column on the first circuit board, a first column of differential signal pair launches offset from a second column of differential signal pair launches on the second printed circuit board so that each differential signal pair in the first column is closest to a launch of a second polarity, opposite the first polarity, in a corresponding signal pair in the second column on the second circuit board, and a connector electrically connecting the first column of differential signal pair launches on the first printed circuit board to the first column of differential signal pair launches on the second printed circuit board and electrically connecting the second column of differential signal pair launches on the first printed circuit board to the second column of differential signal pair launches on the second printed circuit board.

An optically connectable circuit board and optical components mounted thereon. At least one component includes optical transceivers and provides an optical connection to the board. Electronic components may be directly connected to the board electrically or optically. Also, some electronic components may be indirectly connected optically to the board through intermediate optical components.

The invention provides a perpendicular orthogonal interconnection system and a communication device, suitable for the field of the communication technology. The perpendicular orthogonal interconnection system comprises a first veneer group, a second veneer group and a middle-mounted backboard, wherein the first veneer group and the second veneer group are orthogonal, and the middle-mounted backboard is mounted between the first veneer group and the second veneer group. The first veneer group comprises multiple parallel first veneers, and the second veneer group comprises multiple parallel second veneers. Multiple bending male connectors are arranged on the first veneer, and multiple bending female connectors are arranged in the second veneer, wherein the bending male connectors are directly cooperated and connected with the bending female connectors in one-to-one correspondence. According to the inventionthe bending male connectors and the bending female connectors are directly cooperated and connected. Thus, to upgrade the perpendicular orthogonal interconnection system only requires replacing veneers which are equipped with the bending male connectors and the bending female connectors, which is quite simple and shortens signal links. Based on the above advantages, the perpendicular orthogonal interconnection system can be used in various communication devices, thereby making upgrades convenient, improving signal qualities, being good in heat radiation and saving material costs.

A circuit board including a board substrate having opposite first and second sides. The board substrate has a thickness measured along a z-axis that is perpendicular to the first and second sides. The circuit board also includes plated thru-hole (PTH) vias extending along the z-axis from the first side into the board substrate. The PTH vias are arranged to form multiple signal pairs. The circuit board also includes signal traces that are directly coupled to the PTH vias and extend perpendicular to the z-axis in the board substrate. The signal traces and the PTH vias are configured to transmit differential signals. The circuit board also includes ground columns that extend along the z-axis in the board substrate. The ground columns are distributed relative to the signal pairs to form shield arrays. Each of the shield arrays surrounds one of the signal pairs, wherein the ground columns comprise microvias.

An electrical connector assembly (10) includes a circuit board (12) having a through hole (54) extending at least partially therethrough along a through hole axis (106). The circuit board has traces (104) and mounting pads (102) electrically connected to the traces. The mounting pad is exposed in the through hole. An electrical connector (16) is mounted on the circuit board. The electrical connector includes a housing (20) and signal terminals (26) held by the housing. The signal terminal has a mounting contact (30) arranged to be received in each of said through holes. Each via has a stepped diameter along the via axis with a constricted region (94) adjacent the mounting pad, and the mounting contact engages the mounting pad within the constricted region of the via.

A power module includes a substrate that includes an upper layer, an electrical insulator and a thermal coupling layer. The upper layer includes an electrically conductive pattern and is configured for receiving power devices. The electrical insulator is disposed between the upper layer and the thermal coupling layer. The thermal coupling layer is configured for thermal coupling to a heat sink. The power module further includes at least one laminar interconnect that includes first and second electrically conductive layers and an insulating layer disposed between the first and second electrically conductive layers. The first electrically conductive layer of the laminar interconnect is electrically connected to the upper layer of the substrate. Electrical connections connect a top side of the power devices to the second electrically conductive layer of the laminar interconnect.

A receptacle assembly for a midplane connector system has a receptacle housing having openings receiving signal contacts and ground shields of a header assembly. The receptacle assembly includes contact modules coupled to the receptacle housing that each have a leadframe, a dielectric frame and a ground shield. The leadframe has signal contacts arranged in pairs carrying differential signals that are generally arranged along a leadframe plane with mating portions at ends thereof that have at least two points of contact electrically connected to a corresponding signal contact of the header assembly. The dielectric frame holds the signal contacts. The ground shield is coupled to a side of the dielectric frame and has ground tabs extending into the dielectric frame to provide electrical shielding between the pairs of signal contacts and grounding beams electrically connected to ground shields of the header assembly.

A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias in a circuit board are surrounded by an opening that is formed within a ground plane disposed on another layer of the circuit board. The vias are connected to traces on the circuit board by way of an exit structure that includes two flag portions and associated angled portions that connect the flag portions to circuit board traces. In an alternate embodiment, the circuit board traces that leave the differential signal vias are disposed in one layer of the circuit board above a wide ground strip disposed on another layer of the circuit board in a triangular pattern when viewed in section.

The invention relates to the technical field of communication systems and discloses a backboard and a communication device. The backboard comprises at least one fixing plate, a plurality of connectors and a plurality of flexible cables, the corresponding connectors are in signal connection through the flexible cables, each connector in the connectors is provided with a shell and a plurality of signal inserting pins mounted in the shell, the shells are mounted on the fixing plates and are provided with sockets used for being connected with connectors of a daughter card in the communication device, one end of each signal inserting pin stretches into the corresponding socket, and the other end of each signal inserting pin is connected with one flexible cable in the flexible cables. The face, facing the daughter card in the communication device, of each fixing plate is the inserting connecting face of the fixing plate, and the flexible cables are located on the sides, apart from the inserting connecting faces, of the fixing plates. When the communication device with the backboard transmits high-speed signals, the transmission quality and the transmission speed of the high-speed signals are not constrained by the technology for manufacturing traditional PCBs, and the transmission quality and the transmission speed of the high-speed signals of the communication device are high.

An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a substrate comprising an optical waveguide wherein electrically conductive traces are designed, forming an electro-optical module. When such electro-optical module is inserted and aligned into a printed circuit board, the external part of the substrate, comprising electrically conductive traces and pads, referred to as flex-cable, is bent down toward the mounting plane of the PCB allowing to establish electrical connections between these pads and the PCB. The substrate may be broken along a pre-formed groove, and the external part of the substrate can be removed leaving the flex-cable section in place.