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Resist underlayer film-forming composition for lithography containing polymer having acrylamide structure and acrylic acid ester structure

a technology of acrylic acid ester and resist, which is applied in the direction of photomechanical equipment, photosensitive material processing, instruments, etc., can solve the problems of reducing the film thickness of the resist, the influence of standing waves, and the diffuse reflection of active rays on the substrate, etc., and achieves good resist pattern shape, high thermal stability, and easy and accurate performance.

Active Publication Date: 2017-02-16
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a resist underlayer film-forming composition that can be used to form a good resist pattern shape without causing intermixing with an inorganic hard mask layer provided on the upper layer of the resist underlayer film. This composition also provides an excellent resist underlayer film with a close selection ratio of dry etching rate to a resist or a semiconductor substrate. The resist pattern transferred to the resist underlayer film can be transferred to the inorganic hard mask layer by dry etching. The resist underlayer film acts as an anti-reflective coating against exposure light and can be used as a planarizing film, an anti-contamination film for a resist layer, and a film having dry etch selectivity. The resist underlayer film-forming composition has high thermal stability, preventing contamination of the upper layer film and providing a sufficient temperature margin in a banning process.

Problems solved by technology

Accordingly, the influence of diffuse reflection of the active ray on the substrate or the influence of standing waves has become a serious problem.
In the future, when a finer resist pattern is further pursued, a problem about resolution or a problem of collapse of a resist pattern after development should arise, whereby reduction of the film thickness of a resist is desired.

Method used

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  • Resist underlayer film-forming composition for lithography containing polymer having acrylamide structure and acrylic acid ester structure
  • Resist underlayer film-forming composition for lithography containing polymer having acrylamide structure and acrylic acid ester structure
  • Resist underlayer film-forming composition for lithography containing polymer having acrylamide structure and acrylic acid ester structure

Examples

Experimental program
Comparison scheme
Effect test

synthesis example 1

[0088]20.0 g of N-(4-hydroxyphenyl)methacrylamide (manufactured by Osaka Organic Chemical Industry Ltd.), 11.3 g of methyl methacrylate (manufactured by Tokyo Chemical Industry Co., Ltd.), and 3.7 g of 2,2-azobis(isobutylnitrile) (manufactured by Tokyo Chemical Industry Co., Ltd.) were added to 140.2 g of propylene glycol monomethyl ether, and dissolved therein. This solution was added dropwise to a 300 mL flask containing 58.5 g of propylene glycol monomethyl ether heated to 85° C., and after the completion of the dropwise addition, the mixture was stirred for approximately 15 hours. After the completion of the reaction, to this solution, 45 g of a cation exchange resin (trade name: DOWEX [registered trademark] 550A, manufactured by Muromachi Technos Co., Ltd.) and 45 g of an anion exchange resin (trade name: Amberlite [registered trademark] 15JWET, manufactured by Organo Corporation) were added, and the mixture was subjected to ion exchange treatment at room temperature for 4 hour...

synthesis example 2

[0089]16.0 g of N-(4-hydroxyphenyl)methacrylamide (manufactured by Osaka Organic Chemical Industry Ltd.), 21.1 g of methyl methacrylate (manufactured by Tokyo Chemical Industry Co., Ltd.), and 4.3 g of 2,2-azobis(isobutylnitrile) (manufactured by Tokyo Chemical Industry Co., Ltd.) were added to 165.5 g of propylene glycol monomethyl ether, and dissolved therein. This solution was added dropwise to a 300 mL flask containing 68.9 g of propylene glycol monomethyl ether heated to 85° C., and after the completion of the dropwise addition, the mixture was stirred for approximately 15 hours. After the completion of the reaction, to this solution, 42.0 g of a cation exchange resin (trade name: DOWEX [registered trademark] 550A, manufactured by Muromachi Technos Co., Ltd.) and 42.0 g of an anion exchange resin (trade name: Amberlite [registered trademark] 15JWET, manufactured by Organo Corporation) were added, and the mixture was subjected to ion exchange treatment at room temperature for 4 ...

example 1

[0092]52.7 g of the polymer solution obtained in Synthesis Example 1 (the solution of a polymer containing N-(4-hydroxyphenyl) methacrylamide unit and methyl methacrylate unit at 50 mol %:50 mol %), 1.6 g of a blocked isocyanate-based crosslinking agent (blocked polyisocyanate protected with an oxime group based on an isophorone diisocyanate structure, trade name: VESTANAT [registered trademark] B1358, manufactured by Degussa Japan Co., Ltd.), and 0.06 g of a surfactant (trade name: MEGAFACE [registered trademark] R-40, manufactured by DIC Corporation) were dissolved in 22.4 g of propylene glycol monomethyl ether acetate, 31.5 g of propylene glycol monomethyl ether, and 11.2 g of gamma butyllactone to prepare a solution of a resist underlayer film-forming composition for use in a lithography process using a multilayer film.

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Abstract

A resist underlayer film-forming composition for lithography capable of being dry-etched during pattern transfer from the upper layer or during substrate processing and capable of being removed with an alkaline aqueous solution after the substrate processing. A resist underlayer film-forming composition for lithography includes a polymer (A) including a unit structure of Formula (1) and a unit structure of Formula (2); a crosslinkable compound (B) having at least two groups selected from blocked isocyanate groups, methylol group, or C1-5 alkoxy methyl groups; and a solvent (C), characterized in that the polymer (A) is a polymer in which the unit structure of Formula (1) and the unit structure of Formula (2) are copolymerized in a mol % ratio of the unit structure of Formula (1):the unit structure of Formula (2)=25 to 60:75 to 40.

Description

TECHNICAL FIELD[0001]The present invention relates to a resist underlayer film-forming composition for lithography that is effective in semiconductor substrate processing, and relates to a method of forming a resist pattern using the resist underlayer film-forming composition, and a method of manufacturing a semiconductor device.BACKGROUND ART[0002]In the manufacture of semiconductor devices, fine processing by lithography using a photoresist composition has conventionally been performed. The fine processing is a processing method of forming a thin film of a photoresist composition on a substrate to be processed such as a silicon wafer; irradiating the thin film with an active ray such as ultraviolet ray through a mask pattern having a semiconductor device pattern depicted therein, thereby carrying out development, and etching the substrate to be processed such as a silicon wafer with the obtained photoresist pattern as a protection film. However, with the higher integration of semi...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G03F7/11C08F220/58G03F7/40G03F7/16G03F7/20G03F7/26H01L21/308C08F220/14
CPCG03F7/11H01L21/3081H01L21/3086C08F220/58C08F220/14G03F7/40G03F7/168G03F7/2002G03F7/2037G03F7/26G03F7/162H01L21/0271H01L21/0332C09D133/26G03F7/091G03F7/094G03F7/004H01L21/0274H01L21/0337H01L21/311
Inventor KARASAWA, RYOSOMEYA, YASUNOBUENDO, TAKAFUMINISHITA, TOKIOSAKAMOTO, RIKIMARU
Owner NISSAN CHEM IND LTD
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