Thin film transistor array substrate and manufacturing method thereof
a technology of thin film transistors and array substrates, which is applied in the direction of optics, semiconductor devices, instruments, etc., can solve the problems of difficult to ensure yield and product quality, decrement of electrical characteristics uniformity of tft across the whole substrate, and difficulty in ensuring yield and product quality. , to achieve the effect of improving the product yield and quality of tft array substrates, improving the uniformity of electrical characteristics of tft, and improving the channel length o
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[0042]FIG. 2a is a plan view of the first embodiment after a first patterning process in the embodiment, and FIG. 2b is a cross-sectional view of a display region, a gate line PAD region and a data line PAD region in the structure in FIG. 2a. A gate metal layer is deposited on the base substrate 1 (e.g., a glass substrate, a quartz substrate, or a plastic substrate) to a thickness of 500 Ř4000 Šby a sputtering method or a thermal evaporation method. The gate metal layer may be a metal such as Cr, W, Ti, Ta, Mo, Al, Cu or an alloy thereof, and the gate metal layer may also be a multi-layer metal thin film. The gate metal layer is etched through the first patterning process to form a pattern of a gate electrode 2a and a gate line 2b on the display region and form a pattern of a gate connecting line 2c in the gate line PAD region on the base substrate 1, as shown in FIGS. 2a and 2b.
[0043]FIG. 3a is a plan view of the first embodiment after a second patterning process, and FIG. 3b is...
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