Production process of silicon wafter for solar cell with waste IC chips
A technology for solar cells and integrated circuits, which is used in electronic waste recycling, solid waste removal, waste treatment, etc., can solve the problems of high quality requirements of silicon polycrystalline, low impurity content, and high production costs, and achieve high photoelectric conversion efficiency. Effect
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[0009] The process flow and technical points of the present invention
[0010] 1. The metal and silicide on the surface of the silicon wafer are peeled off
[0011] In the integrated circuit process, due to the needs of the electrode pins, a metal film is often sputtered on the surface of the silicon wafer. Common metals include aluminum, copper, etc. In addition, metal and silicon contact to form metal silicides, silicon and oxygen , Nitrogen forms silicon oxide and silicon nitride. These metals and compounds, as harmful impurities, must first be chemically removed. The specific method is as follows:
[0012] 1) Dilute hydrochloric acid or dilute sulfuric acid to strip light metals
[0013] The waste silicon wafers are loaded with a special flower blue (sheet rack) and placed in a dilute hydrochloric acid or dilute sulfuric acid solution. The metals in the metal activity sequence table that are more active than hydrogen can react with dilute acid.
[0014] Such as
[0015] Th...
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