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Lead-free solder

A lead-free solder and solder technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of environmental pollution, low wettability, high melting point, etc.

Inactive Publication Date: 2006-07-26
THOUSAND ISLAND METAL FOIL
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0002] With the rapid development of the electronics industry, the requirements for electronic products are getting higher and higher. There are many types of solder used in current electronic products, but most of them still use tin-lead alloy solder. Because the lead in tin-lead solder pollutes the environment, Harmful to humans, so many countries began to ban the use of lead-containing solder
Most of the existing lead-free solders are tin-silver, tin-copper, tin-silver-copper, tin-zinc-indium-bismuth, and tin-silver alloys. low cost, high cost

Method used

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Embodiment Construction

[0018] Below in conjunction with embodiment the utility model is described further in detail, but content of the present invention is not limited to embodiment.

[0019] Because the melting points of silver, copper, tin, and phosphorus are different from those of tin, among them, silver and copper have higher melting points. In order to balance the melting point in tin-based smelting, and to more accurately grasp the addition amount of indium, a relatively precious metal, on the production site , the method of preparing master alloy can be adopted. The master alloy and its preparation method are as follows: Tin-silver master alloy: Add the refined tin containing 99.95% tin and the silver ingot containing 99.99% silver to the crucible according to the mass ratio of 70:30 and put it into the intermediate frequency furnace for smelting, vacuumize and fill with nitrogen, and heat up Heat it to 1200°C, keep it warm for 3 hours, stir for 30 minutes, take it out of the furnace, cool ...

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PUM

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Abstract

The invention relates to a leadless tin soldering material which comprises the constituents (by mass ratio) of Ag 0.5-6%, Cu 0.1-2%, In 0.0001-1%, P 0.0001-1%, and balancing Sn. The preparing process of the soldering material comprises weighing 1.67-20 parts of Sn-Ag intermediate alloy ingot containing Ag 30%, 1-20 parts of Sn-Cu intermediate alloy ingot containing Cu 30%, 0.002-20 parts of Sn-In intermediate alloy ingot containing In 5%, P 0.0001-1 part, and balancing Sn in the whole 100 parts, charging the raw materials into manganese alloy crucible, smelting in intermediate frequency furnaces, evacuating and filling in nitrogen, elevating the temperature to 450 deg. C, agitating 1 hour, cooling down slowly and homogeneously to 340 deg C, charging weighed P and stirring homogeneously, finally pouring the melted liquid into dies.

Description

technical field [0001] The invention relates to soldering materials, in particular to a lead-free tin solder, which belongs to the field of tin alloys. Background technique [0002] With the rapid development of the electronics industry, the requirements for electronic products are getting higher and higher. There are many types of solder used in current electronic products, but most of them still use tin-lead alloy solder. Because the lead in tin-lead solder pollutes the environment, Harmful to people, so many countries began to ban the use of leaded solder. Most of the existing lead-free solders are tin-silver, tin-copper, tin-silver-copper, tin-zinc-indium-bismuth, and tin-silver alloys. Sex is small, and some cost is high. Contents of the invention [0003] The purpose of the present invention is to overcome the shortcomings and deficiencies of the above-mentioned prior art, and provide a lead-free solder with low melting point, good wettability and low cost, thereby...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C1/03
Inventor 黄守友
Owner THOUSAND ISLAND METAL FOIL
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