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One-step molding technology and device for spherical soldering tin

A molding device and solder ball technology, applied in the direction of welding medium, manufacturing tools, welding equipment, etc., can solve the problems of difficulty in meeting the refinement of IC packaging technology, increasing cleaning and drying processes, and easy to produce tolerances, etc. Strong adaptability, high one-time forming rate and good sphericity

Active Publication Date: 2007-04-11
云南锡业研究院有限公司研究设计院
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  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

However, the process has the following limitations: (1) Due to the limitation of the wire diameter, solder balls with a ball diameter of 0.3mm, which is difficult to meet the requirements of IC packaging technology. The need to develop towards refinement and miniaturization; (2) tolerances are easy to occur during punching, and the yield is low; (3) the use of molding liquid to shape the shape increases the subsequent cleaning and drying processes, which increases the cost of the product to a certain extent

Method used

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  • One-step molding technology and device for spherical soldering tin

Examples

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Comparison scheme
Effect test

Embodiment 1

[0029] Utilize above-mentioned molding device, adopt the alloy that raw material is 63%Sn, 37%Pb, prepare solder ball according to the following steps:

[0030] (1) Alloy melting: Put the commercial 1#Sn and 1#Pb ingots in proportion or qualified 63Sn37Pb alloy ingots into the electric heating melting pot for heating and melting, then stir them evenly until the alloy temperature reaches 360°C±10°C, prepare Put the alloy liquid into the "liquid particle forming machine".

[0031] (2) Electromechanical integration liquid particle forming: open the heating and heat preservation facilities in the "forming machine", and at the same time send nitrogen into the machine and adjust the atmosphere, pressure and temperature, of which the oxygen atmosphere is 100ppm, and the temperature is 390 ° C ± 10 ° C; start the electromechanical Oscillating device, open the liquid discharge valve in the electric heating melting pot and put the alloy liquid into the SMT laser orifice plate container....

Embodiment 2

[0036] Prepare lead-free solder balls of 96Sn3.5Ag0.5Cu according to the method and steps of Example 1. Among them, the alloy melting temperature is 380°C±10°C, the SMT laser orifice plate container is 410°C±10°C, and the SMT laser orifice plate aperture is Φ0.06mm±0.005mm; other process parameters are the same as in Example 1, and the obtained solder ball particle size is Φ0.15mm±0.005mm.

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Abstract

A technology for preparing the spherical soldering tin used for packing ICs (BAG, CSP, etc) includes such steps as smelting the soldering tin, delivering the molten soldering tin via tube to a container with laser perforated plate, electromechanical longitudinal and transverse oscillasion to make the molten soldering tin pass through the pinholes on plate while vacuum sucking downward to become drops, rounding and antioxidizing treating in a vertical cylinder, and screening. Its apparatus is composed of smelting furnace, liquid drop shaper, and sphere shaper.

Description

technical field [0001] The invention relates to a preparation process and device for non-ferrous metal particles, in particular to a preparation process and device for BGA, CSP and other IC packaging solder balls. Background technique [0002] Solder balls are the metal pins of BGA package and CSP package IC, mainly used in notebook computers, mobile communication equipment, computer motherboards, handheld computers, satellite positioning systems, digital cameras and other products. At present, the method commonly used in the production of solder balls in the world is the quantitative melting method, that is, the cutting method. The main process is to first draw the metal into a thin-diameter core wire, and then cut the filament into a cut wire of the required size. , and then use the weight of the material itself to carry out molding treatment with a specific molding solution, and then make it through cleaning, screening, and inspection, such as CN1355075, CN1320959A patent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/40
Inventor 朱华明刘宝权黄迎红王炜刘国宇朱林毅
Owner 云南锡业研究院有限公司研究设计院
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