Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Conductor compositions and use thereof

A composite, conductor technology, used in cable/conductor manufacturing, conductive coatings, conductive materials dispersed in non-conductive inorganic materials, etc., can solve problems such as difficulty in determining resistivity

Inactive Publication Date: 2007-03-28
EI DU PONT DE NEMOURS & CO
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, it is difficult to determine the exact value of the target resistivity for this type of composite

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0086]Prepare the conductive pattern as described previously. The metal particles used are oblate spheroidal particles. The nickel particles are below 100 mesh, the iron particles are below 325 mesh, the bismuth particles are below 200 mesh, and the cobalt particles are less than 2 μm. The silver particles consist of 50% spherical silver particles (with a surface area of ​​0.80-1.40m 2 g -1 ) and 50% silver particle debris (surface area of ​​0.60 ~ 0.90m 2 g -1 ) mixed together. The glass used was composition I in Table 1. The liquid medium is a butyl ether with ethylene glycol (known as butyl Carbitol TM sold) in combination with ethyl cellulose in terpineol (in a ratio of 1 to 9). The substrate was a float glass (untempered) substrate. The thickness of the sintered film is 8-20 μm. All parts were fired through a belt furnace at a peak firing temperature of 660°C, and samples were held at peak temperature for approximately 72 seconds unless otherwise noted. The tota...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
sizeaaaaaaaaaa
sizeaaaaaaaaaa
sizeaaaaaaaaaa
Login to View More

Abstract

Use of a composition comprising finely divided particles of (a) an electrically-conductive material; (b) one or more inorganic binders; and (c) one or more metal(s) selected from cobalt, nickel, iron and bismuth, wherein components (a), (b) and (c) are dispersed in a liquid vehicle, in the manufacture of an electrically-conductive pattern on a substrate for the purpose of increasing the resistivity of said electrically-conductive pattern.

Description

[0001] The present invention relates to the electroconductive composition that comprises one or more metals selected from cobalt, nickel, iron and bismuth, and its application in the manufacture of elements in microelectronic circuits, especially heating elements, especially when heating Compositions used in the manufacture of defogging elements for automotive windows, such as automotive glazing, especially automotive rear lights. Background of the invention [0002] In the electronics field, the use of thick film conductors as components in hybrid microelectronic circuits is well known. Compositions used to fabricate such components generally appear as colloidal solid-liquid dispersions in which the solid phase comprises: particles of noble metal or noble metal alloy or a mixture of the two, and an inorganic binder. The liquid medium used for diffusion is usually an organic liquid medium, but may also be an aqueous based liquid medium. Small amounts (typically less than 3% b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/16H05K1/09H01C17/28C09D1/00C09D5/24H01B1/22H01B13/00H05B3/12
CPCH01B1/16H01B1/22H05K1/092H05B3/12H01C17/283
Inventor S·J·米尔斯
Owner EI DU PONT DE NEMOURS & CO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com