Wire connecting device with quick-melting wiring mechanism and application method thereof

Abstract

The invention discloses a wire connecting device with a quick-melting wiring mechanism and an application method thereof and belongs to the technical of wire connection. The device includes a wiring table, wherein left and right ends of the wiring table are respectively provided with a base plate clamp, an upper end of the base plate clamp is fixedly connected with a wire edge clamp, the wire quick-melting wiring mechanism is arranged between the two lead edge clamps, and an upper hinge of the wire quick-melting wiring mechanism is connected with a path inspection cover body. A new wire connection mode can be provided, through cooperation use of matched wiring tools and wires, change in resistivity at a connection portion of the circuit wires in the wiring process is small, abnormal heat generation at the circuit connection portion due to the change of resistance of the wire is reduced, and contact failure at the circuit connection portion is avoided.

Description

technical field [0001] The invention relates to the technical field of wire connection, more specifically, to a wire connection device with a quick-melt wire connection mechanism and a method for using the same. Background technique [0002] The connection of power wires usually adopts the twisting method, that is, after the wires remove the insulation layer, an external force is applied to make the two wires intertwined with each other, and then the insulating tape is wrapped around the connection of the wires. The above connection method has the following defects: the wire connection is not well packaged, and the tape is easy to fall off. In order to ensure safety, the insulating tape is wrapped thicker; at the wire connection, due to the mutual winding of the wires, the conductivity of the wire is reduced; It is crude and not suitable for connecting fine wires. The Chinese Invention Publication No. CN103401120B discloses "A Wire Connecting Device", which includes a high-t...

AI Technical Summary

Problems solved by technology

The above connection method has the following defects: the wire connection is not well packaged, and the tape is easy to fall off. In order to ensure safety, the insulating tape is wrapped thicker; at the wire connection, due to the mutual winding of the wires, the conductivity of the wire is reduced; It is crude and not suitable for connecting fine wires. The Chinese Invention Publication No. CN103401120B discloses "A Wire Connecting Device", which includes a high-temperature chamber, a heating chamber, a cementing part and a controller. The cementing part is provided with a connecting cavity. The connecting chamber is filled with gel that can soften at high temperature, the high temperature chamber is provided with a support rod for placing the cementing part, the bottom end of the high temperature chamber is connected to one end of the heating chamber through a channel, and the heating chamber is another One end is provided with an air intake pipe, the heating chamber is equipped with an electric heating device, the opposite side walls on both sides of the high temperature chamber are provided with wire openings that can accommodate high temperature wires passing through, and the top of the high temperature chamber is provided with an end cover , the high temperature chamber is equipped with a temperature sensor that can measure the temperature in the high temperature chamber, the temperature sensor and the electric heating device are both connected to the controller in communication, and the temperature sensor sends the temperature information in the high temperature chamber to the The controller, the controller controls the start and stop of the electric heating device according to the temperature information in the high temperature chamber

[0003] Although the above technical solution connects the wires through the heating device, in the process of use, due to the influence of high temperature on the resistivity of the circuit wires during the heating process, the internal resistance of the wires changes, and at the same time, the surface of some wires is easily exposed to high temperatures. Occurrence of high-temperature oxidation can easily cause poor contact at the connection of the circuit wires, which in turn leads to overheating and fire due to excessive contact resistance of the circuit. normal operation

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