Preparation method of high-thermal-conductivity insulating heat-conducting layer

An insulating and thermally conductive layer, high thermal conductivity technology, applied in the direction of printed circuit manufacturing, manufacturing printed circuit precursors, printed circuit components, etc., can solve the problems of decreased PCB toughness, poor thermal conductivity, limited thermal conductivity, etc. Strength, simple machinability, simple process effect

Pending Publication Date: 2022-05-31
SOUTHWESTERN INST OF PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The disadvantages of this method are that the toughness of the PCB decreases, the brittleness of the insulating layer is large, the adhesion is poor, the processability is poor, the process is complicated, and the heat conduction effect is limited.
[0005] The alumina insulating layer prepared by the micro-arc oxidation method reduces the breakdown voltage due to the existence of micropores, and the thermal conductivity is not good

Method used

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  • Preparation method of high-thermal-conductivity insulating heat-conducting layer

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Embodiment 1

[0031] like figure 1 As shown, the preparation method of a high thermal conductivity insulating heat conduction layer provided by the present invention adopts micro-arc oxidation technology to prepare the insulating layer on the surface of the aluminum substrate, and improves the withstand voltage value of the aluminum oxide insulating layer through the atomic level filling technology of carbon ions, and at the same time Improve the thermal conductivity of the insulating layer, and solve the heat dissipation and heat resistance problems of power electronic devices caused by the substantial increase in power density and calorific value. Specifically include the following steps:

[0032] Step 1. Preparation of alumina insulating layer

[0033] Select a pure aluminum substrate of grade 1050 with a thickness of 1-1.5mm, and prepare an aluminum oxide insulating layer with a thickness of 50±10μm on the surface of the aluminum substrate by micro-arc oxidation, and the thickness of t...

Embodiment 2

[0048] Prepare a layer of aluminum film by hot-dipping aluminum on the surface of the stainless steel substrate, and then complete the preparation of the insulating heat-conducting layer and the surface metal layer according to Example 1, including the following steps:

[0049] Step 1, hot-dip plating on the surface of the stainless steel substrate to prepare an aluminum layer

[0050] The surface of the stainless steel substrate is degreased and then dried, and industrial pure aluminum is used as the raw material for hot-dip plating at a temperature of 750°C. The thickness of the aluminum layer is 80-100 μm after hot-dip plating.

[0051] Step 2. Preparation of alumina insulating layer

[0052] After the aluminum film is prepared on the stainless steel substrate, the surface micro-arc oxidation method is used to prepare the aluminum oxide insulating layer with a thickness of 50 ± 10 μm, and the thickness of the dense layer is ≥ 30 μm. Specific preparation process:

[0053] Co...

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Abstract

The invention belongs to the technical field of surface science and engineering, and particularly relates to a preparation method of a high-thermal-conductivity insulating heat-conducting layer. The method specifically comprises the following steps: step 1, preparing an aluminum oxide insulating layer on a substrate; 2, strengthening the thermal conductivity and insulativity of the aluminum oxide insulating layer; step 3, preparing an electroplating seed layer; and 4, electroplating and thickening to prepare a conductive metal copper layer. The method is simple in process and environmentally friendly, the binding force between the insulating heat conduction layer prepared through the method and the metal substrate is high, the insulating heat conduction performance is good, and the insulating heat conduction performance is stable and reliable. The aluminum oxide and carbon-based coating composite structure replaces the epoxy resin adhesive and insulating heat-conducting particle mixed layer, so that the overall bending resistance of the aluminum-based copper-clad plate is improved, and the aluminum-based copper-clad plate has good machining performance.

Description

technical field [0001] The invention belongs to the technical field of surface science and engineering, and in particular relates to a preparation method of a high thermal conductivity insulating heat conduction layer. Background technique [0002] Metal-based printed circuit board (PCB) has high thermal conductivity, high heat resistance, high heat dissipation, high insulation, and excellent comprehensive performance. It is currently the most widely used and most used heat-dissipating printed circuit board. In particular, aluminum-based copper-clad laminates have become the most popular high-dissipation metal-based printed board development products in recent years. It is used in fields with high heat dissipation requirements such as high-power devices, high-power substrates for automobiles, and display backplanes. [0003] At present, the main preparation technologies of aluminum-based PCB insulation and heat-conducting layer are: [0004] The traditional preparation met...

Claims

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Application Information

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IPC IPC(8): H05K1/05H05K3/00H05K3/02
CPCH05K1/053H05K3/0011H05K3/022Y02E60/10
Inventor 陈美艳唐德礼谢新林刘旋刘彤
Owner SOUTHWESTERN INST OF PHYSICS
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