Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Alkali-soluble resin, positive photosensitive resin composition, cured film and display device

A positive-type photosensitive resin and alkali-soluble resin technology, applied in the field of positive-type photosensitive resin compositions, cured films, display devices, and alkali-soluble resins, can solve the problems of slow development, loss of dark film, poor contrast or image resolution, etc. , to achieve high exposure sensitivity and improve the effect of dissolution rate ratio

Active Publication Date: 2022-05-31
武汉柔显科技股份有限公司 +1
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But because the ratio of polyimide in polyamic acid / polyimide, polyamic acid ester / polyamic acid / polyimide resin composition has close relationship to the transmittance of solubility and ultraviolet light, to exposure Sensitivity and image resolution have a large impact, too many ester groups may cause slow development (slow dissolution rate), poor contrast or image resolution
In addition, in order to improve the alkali solubility of polyimide, its solubility is often improved by introducing phenolic hydroxyl groups, but it will cause the loss of dark film

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Alkali-soluble resin, positive photosensitive resin composition, cured film and display device
  • Alkali-soluble resin, positive photosensitive resin composition, cured film and display device
  • Alkali-soluble resin, positive photosensitive resin composition, cured film and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0127] The above and other advantages of the present invention can be better understood through the following examples, which are not intended to limit the scope of the present invention.

[0128] Abbreviations:

[0129] ODA: 4,4'-diaminodiphenyl ether

[0130] 6FAP: 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane

[0131] SiDA: 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane

[0132] 6FODA: 2,2'-bis(trifluoromethyl)-4,4'-diaminodiphenyl ether

[0133] 6FDA: 2,2'-bis(3,4-dicarboxylic acid phenyl)hexafluoropropane dianhydride

[0134] ODPA: 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride

[0135] BTDA: 3,3',4,4'-benzophenonetetracarboxylic dianhydride

[0136] CBDA: Cyclobutanetetracarboxylic dianhydride

Synthetic example 1

[0138] Synthesis of diamine derivative A1 of 6FDA

[0139] Dissolve 0.1 mol of 2-amino-4-nitrophenol in 50 ml of acetone and 0.34 mol of propylene oxide, cool down to -15°C, and slowly dropwise add the A3 solution (0.048 mol, dissolved in 150 ml of propylene glycol) synthesized in Synthesis Example 3. In monomethyl ether), the reaction was continued at -15°C for 4h after dropping, then warmed to room temperature, filtered, the filter cake was washed with acetone for several times and then vacuum-dried at 50°C for 10h to obtain the nitro intermediate.

[0140] The nitro compound was dissolved in 100 ml of NMP, 3 g of 5% palladium-carbon was added, hydrogen was introduced into the autoclave, the room temperature was continuously stirred for 6 h, then the reaction solution was filtered to remove the catalyst, the filtrate was poured into water, and a solid product was precipitated. Filtration and vacuum drying at 50°C for 24h gave the diamine derivative A1 of 6FDA.

[0141]

Synthetic example 2

[0143] Synthesis of diamine derivative A2 of 6FDA

[0144] The only difference from Synthesis Example 1 is that the raw material A3 is replaced with A4 synthesized in Synthesis Example 4, and other conditions remain unchanged to obtain the diamine derivative A2 of 6FDA.

[0145]

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses alkali-soluble resin, a positive photosensitive resin composition, a cured film and a display device, and relates to the technical field of photoelectric display. The alkali-soluble resin comprises a structure (a1) and a structure (a2); the structure (a1) comprises a structural formula (a11) and / or a structural formula (a12), and the structure (a2) comprises any one or more of structural formulas (a21), (a22) and (a23); in the structural formula (a11) and the structural formula (a12), A is an organic group containing at least six carbons; in the structural formula (a21), R0 represents a hydrocarbon group having 1-4 carbon atoms, and * in the structural formulae (a21), (a22) and (a23) represents a connection position. The positive photosensitive resin composition containing the alkali-soluble resin has high exposure sensitivity and excellent imaging capability.

Description

technical field [0001] The present invention relates to the technical field of photoelectric display, in particular to an alkali-soluble resin, a positive-type photosensitive resin composition, a cured film and a display device. Background technique [0002] Polyimide (PI) is an ideal polymer material with excellent heat resistance, mechanical properties, electrical insulation properties and chemical stability, and is often used in aerospace, semiconductor, optoelectronics and microelectronics. Compared with ordinary polyimide, photosensitive polyimide (PSPI) can realize pattern processing without the help of other photoresists, shorten the process route, and is an ideal insulating material in the field of electronics and microelectronics. [0003] In recent years, with the miniaturization of the development of semiconductor elements, the interlayer insulating films and passivation layers of semiconductor elements also require finer exposure and development sensitivity and i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10G03F7/039G09F9/30
CPCC08G73/1078C08G73/1042C08G73/1039C08G73/106C08G73/1071C08G73/1028G03F7/0392G09F9/301Y02E60/10
Inventor 周小明王元强肖桂林鲁丽平朱双全
Owner 武汉柔显科技股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com