Heat dissipation conductive flexible board

Abstract

The invention relates to a heat dissipation conductive flexible board, which comprises at least one single-layer thin board, and the single-layer thin board structurally comprises a first conductive thin layer and a first functional thin layer; and the structure of the double-layer thin plate comprises a second conductive thin layer, a second functional thin layer and a third functional thin layer, the single-layer thin plate and the double-layer thin plate are manufactured by utilizing at least one spraying, coating and printing mode, and the single-layer thin plate is matched with the double-layer thin plate to be laminated and formed. Therefore, the heat-dissipation conductive flexible board with the multi-layer conductive structure is formed. According to the invention, a large-area heat-conducting and electric-conducting flexible substrate structure can be manufactured, a single-layer thin plate and a double-layer template which are based on shaping can be selectively matched and combined according to function requirements, and the method has higher degree of freedom and material matching property for development of increasingly few diversified products.

Description

technical field [0001] The invention relates to a flexible substrate with heat dissipation and conduction for high-frequency electronic components, in particular, the heat dissipation and conductive flexible plate has the characteristics of high heat dissipation and thinning. Background technique [0002] Today's communication electronic products have become a necessity of human life. Under the trend of high-speed transmission, high processing performance and thin line, flexible flexible substrates have been widely used in various electronic devices. The heat dissipation effect of the board is not good. If it is necessary to connect high-heating electronic components, it is still necessary to use traditional ceramic hard boards or aluminum metal hard boards to connect flexible substrates to solve the problem of high temperature heat dissipation. Traditional low heat generation chips or low heat generation electronic components can be carried by flexible circuit boards, such ...

AI Technical Summary

Problems solved by technology

[0006] The inventors of the present invention are fully aware that it is difficult to produce large-area products with flexible substrates at present, and the production line speed of large-area production in the roll-to-roll method still cannot be improved, and what is more, the production of large-area heat-dissipating and conductive flexible substrates, the pressing and alignment of flexible substrate materials The process is cumbersome, the production speed of the existing process is slow, and the introduction of heat dissipation materials such as ceramics in the structure is prone to cracks during production and use. The insufficient heat conduction and easy cracking are issues that cannot be broken through by current technology

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