Technological method for processing high-frequency copper-clad plate by means of additive manufacturing of PTFE (polytetrafluoroethylene)

A PTFE and additive manufacturing technology, used in the field of high-frequency copper clad laminates, can solve the problems of poor size control, poor dielectric properties of the plate, low product stability, etc., and reduce the hysteresis effect of dielectric conductance and polarization. , high-speed transmission capability, the effect of fast signal transmission speed

Active Publication Date: 2022-05-13
SHANDONG SENRONG PLASTIC IND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the size of the substrate made by short fiber reinforcement or glass fiber cloth reinforcement is not easy to control, the surface is relatively rough, the dielectric properties of the board are relatively poor, and it is not easy to balance the performance of the dielectric constant Dk and thermal expansion coefficient CTE , so that the stability of the product is not high, and the production cost is high

Method used

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  • Technological method for processing high-frequency copper-clad plate by means of additive manufacturing of PTFE (polytetrafluoroethylene)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The process for processing high-frequency copper-clad laminates in the manner of additively manufacturing PTFE described in Example 1 consists of the following steps:

[0033] (1) After mixing and grinding alumina, titanium oxide and silicon oxide in a certain proportion, sintering at 1150°C, and then grinding the sintered product to prepare ceramic filler;

[0034] (2) mixing the ceramic filler prepared in step (1) with the silane coupling agent KH560 aqueous solution to prepare a dispersion;

[0035] (3) add the dispersion liquid that step (2) prepares in PTFE emulsion, stir and prepare to obtain emulsion;

[0036] (4) In a certain working environment, put the emulsion prepared in step (3) into the electrospinning equipment, and adjust the receiving distance between the nozzle of the electrospinning equipment and the copper foil to be 11cm;

[0037] (5) After the electrospinning equipment is turned on, it is directly spray printed on the surface of the copper foil, a...

Embodiment 2

[0051] The process method for processing high-frequency copper-clad laminates in the manner of additively manufacturing PTFE described in Example 2 consists of the following steps:

[0052] (1) After mixing and grinding alumina, titanium oxide and silicon oxide in a certain proportion, sintering at 1100°C, and then grinding the sintered product to prepare ceramic filler;

[0053] (2) mixing the ceramic filler prepared in step (1) with the silane coupling agent KH560 aqueous solution to prepare a dispersion;

[0054] (3) add the dispersion liquid that step (2) prepares in PTFE emulsion, stir and prepare to obtain emulsion;

[0055] (4) In a certain working environment, put the emulsion prepared in step (3) into the electrospinning equipment, and adjust the receiving distance between the nozzle of the electrospinning equipment and the copper foil to be 8cm;

[0056] (5) After the electrospinning equipment is turned on, it is directly spray printed on the surface of the copper foi...

Embodiment 3

[0070] The process for processing high-frequency copper-clad laminates in the manner of additively manufacturing PTFE described in Example 3 consists of the following steps:

[0071] (1) After mixing and grinding alumina, titanium oxide and silicon oxide uniformly according to a certain ratio, sintering at 1130°C, and then grinding the sintered product to prepare a ceramic filler;

[0072] (2) mixing the ceramic filler prepared in step (1) with the silane coupling agent KH560 aqueous solution to prepare a dispersion;

[0073] (3) add the dispersion liquid that step (2) prepares in PTFE emulsion, stir and prepare to obtain emulsion;

[0074] (4) In a certain working environment, put the emulsion prepared in step (3) into the electrospinning equipment, and adjust the receiving distance between the nozzle of the electrospinning equipment and the copper foil to be 15cm;

[0075] (5) After the electrospinning equipment is turned on, it is directly spray printed on the surface of t...

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Abstract

The invention belongs to the technical field of preparation of high-frequency copper-clad plates, and particularly relates to a process method for processing a high-frequency copper-clad plate by adopting an additive manufacturing PTFE (Polytetrafluoroethylene) mode. The preparation method comprises the following steps: mixing and grinding aluminum oxide, titanium oxide and silicon oxide in proportion, sintering, and then grinding to prepare a ceramic filler; the preparation method comprises the following steps: mixing a ceramic filler with a KH560 aqueous solution to prepare a dispersion liquid; adding the dispersion liquid into a PTFE emulsion to prepare an emulsion; putting the emulsion into electrostatic spinning equipment, and adjusting the receiving distance between a spray head of the electrostatic spinning equipment and a copper foil to be 8-15cm; starting electrostatic spinning equipment and then directly jet-printing on the surface of the copper foil; putting the product into a high-temperature hot press for sintering and pressing; and taking out the product from the high-temperature hot press, and standing at room temperature to prepare the high-frequency copper-clad plate processed by adopting a PTFE additive manufacturing mode. According to the high-frequency copper-clad plate disclosed by the invention, the dielectric constant is obviously reduced, and the high-speed transmission capability of signals is ensured.

Description

technical field [0001] The invention belongs to the technical field of preparation of high-frequency copper-clad laminates, and in particular relates to a process method for processing high-frequency copper-clad laminates by using additive manufacturing of PTFE. Background technique [0002] CCL is mainly used in the field of electronic information. As a carrier of signal transmission, it is an important substrate for realizing high-frequency, high-speed, large-capacity transmission and information storage functions. In satellite navigation systems, 5G signal transmission systems, radar and other communication systems, the frequency and speed of signal transmission can be satisfied, and the quality of signal transmission can also be guaranteed. In recent years, with the increasing power of electronic components and the ultra-thinning of circuit boards and other trends, there are higher requirements for the dielectric properties and heat dissipation performance of copper clad...

Claims

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Application Information

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IPC IPC(8): B32B27/02B32B27/32B32B27/20B32B15/20B32B15/14B32B15/085B32B37/15B32B37/06B32B37/10D04H1/728D04H1/4318H05K3/02
CPCB32B5/022B32B15/20B32B15/14B32B15/085B32B37/153B32B37/06B32B37/10D04H1/728D04H1/4318H05K3/022H05K3/025B32B2262/0253B32B2457/08B32B2307/306B32B2307/20B32B2307/726Y02P10/25
Inventor 荣钦功
Owner SHANDONG SENRONG PLASTIC IND TECH
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