Porous ceramic-based grinding block for grinding semiconductor plastic package substrate and manufacturing method of porous ceramic-based grinding block

A technology of porous ceramics and manufacturing methods, which is applied in the direction of ceramic products, manufacturing tools, abrasives, etc., and can solve problems such as adverse effects on product stability, gas generation, micro-cracks and deformation of the substrate

Inactive Publication Date: 2022-04-26
西安易星新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main problem of this method is that gas is generated during the sintering process, and the gas is easy to form micro-cracks and deformation in the matrix during the diffusion process, which will adversely affect the stability of subsequent products

Method used

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  • Porous ceramic-based grinding block for grinding semiconductor plastic package substrate and manufacturing method of porous ceramic-based grinding block

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The manufacturing method of the porous ceramic-based grinding block for grinding semiconductor plastic-encapsulated substrates of the present invention comprises the following steps:

[0031] 1) Drying: Place the required ceramic bond, diamond powder, aluminum ball pore-forming agent and other raw materials in a drying oven, set the temperature at 300°C, and hold for 1 hour;

[0032] 2) Screening: Before screening, clean the screen with an ultrasonic cleaner for 30 minutes, and wash once. The screen model is two standard grades larger than the selected diamond size, and the diamond powder is passed through a vibrating screen. Sieve, sieve 3 times to ensure the removal of large diamond particles in the diamond raw material;

[0033] 3) Ingredients: Weigh 35% vitrified bond, 35% diamond, 20% aluminum ball pore-forming agent, and 10% auxiliary agent with an electronic balance according to mass percentage. The particle size of the aluminum ball pore-forming agent is 30-100...

Embodiment 2

[0040] The manufacturing method of the porous ceramic-based grinding block for grinding semiconductor plastic-encapsulated substrates of the present invention comprises the following steps:

[0041] 1) Drying: Place the required vitrified bond, diamond powder, aluminum ball pore-forming agent and other raw materials in a drying oven, set the temperature at 50°C, and hold for 5 hours;

[0042] 2) Screening: Before screening, clean the screen with an ultrasonic cleaner for 30 minutes, and wash once. The screen model is two standard grades larger than the selected diamond size, and the diamond powder is passed through a vibrating screen. Sieve, sieve 3 times to ensure the removal of large diamond particles in the diamond raw material;

[0043]3) Ingredients: Weigh 50% vitrified bond, 35% diamond, 10% aluminum ball pore-forming agent, and 5% auxiliary agent with an electronic balance according to mass percentage. The particle size of the aluminum ball pore-forming agent is 30-100...

Embodiment 3

[0050] The manufacturing method of the porous ceramic-based grinding block for grinding semiconductor plastic-encapsulated substrates of the present invention comprises the following steps:

[0051] 1) Drying: Place the required vitrified bond, diamond powder, aluminum ball pore-forming agent and other raw materials in a drying oven, set the temperature at 250°C, and hold for 3 hours;

[0052] 2) Screening: Before screening, clean the screen with an ultrasonic cleaner for 30 minutes, and wash once. The screen model is two standard grades larger than the selected diamond size, and the diamond powder is passed through a vibrating screen. Sieve, sieve 3 times to ensure the removal of large diamond particles in the diamond raw material;

[0053] 3) Ingredients: Weigh 45% vitrified bond, 37% diamond, 12% aluminum ball pore-forming agent, and 6% auxiliary agent with an electronic balance according to mass percentage. The particle size of the aluminum ball pore-forming agent is 30-1...

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Abstract

The invention discloses a porous ceramic-based grinding block for grinding a semiconductor plastic package substrate and a manufacturing method of the porous ceramic-based grinding block, the porous ceramic-based grinding block comprises the following components in percentage by mass: 35-50% of a ceramic bond, 35-50% of diamond powder, 10-20% of an aluminum ball pore-forming agent and 5-10% of an auxiliary agent, and the porous ceramic-based grinding block is prepared by mixing, compression molding, heat treatment and sintering; an aluminum ball pore-forming agent is adopted, in the sintering process, when the temperature rises to the aluminum melting point (660 DEG C) or above, aluminum balls are gradually molten, molten liquid gradually permeates into gaps of a nearby ceramic bonding agent, the original positions of the aluminum balls are changed into round holes, along with prolonging of heat preservation time, the molten aluminum is gradually oxidized into aluminum oxide solids, and the positions occupied by the aluminum balls are changed into hollow holes; and moreover, no gas is generated in the whole process, so that the derivative problems of deformation, cracking and the like caused by a pore-forming agent in the prior art are avoided, and the stability and the consistency of the product quality are ensured.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and relates to a porous ceramic-based grinding block for grinding semiconductor plastic-encapsulated substrates and a manufacturing method thereof. Background technique [0002] The main processes of semiconductor packaging and testing are wafer back grinding (Wafer back grinding), wafer cutting (Wafersaw), die attach (Die attach), wire bonding (Wire bond), plastic packaging (Compound molding), plastic packaging body grinding (Compound grinding), compounding and cutting (Compoundsingulation), marking (Marking), testing (Testing) and other processes. Among them, the basic method of grinding the plastic package is to install the special grinding wheel on the automatic precision grinding machine, and use the grinding wheel to grind off the excess material on the back of the plastic package according to the requirements to achieve the desired thickness, while ensuring the surface ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B38/06C04B35/52C04B35/622C04B35/63B24D3/18
CPCC04B38/061C04B35/52C04B35/622C04B35/6303B24D3/18C04B2235/602C04B2235/606C04B2235/612C04B2235/656C04B2235/6562C04B2235/6567C04B2235/3217
Inventor 殷攀峰
Owner 西安易星新材料有限公司
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