Preparation method of PDMS in-situ wrinkled antireflection film and preparation method of white organic light-emitting diode
A technology of light-emitting diodes and anti-reflection coatings, which is applied in semiconductor/solid-state device manufacturing, electrical components, and electrical solid-state devices. It can solve problems such as unsuitable flexible substrates, harsh reaction conditions, and expensive equipment, and achieve improved display quality and cost. Low, soft output light effect
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Embodiment 1
[0064] In this example,
[0065] see figure 1 and figure 2 , a method for preparing a PDMS in-situ wrinkled anti-reflection film and a white light organic light-emitting diode, comprising the steps of:
[0066] Step 100: According to the mass ratio (w / w) of DMS prepolymer and crosslinking agent mixed at 10:1, weigh 3.3g of PDMS prepolymer and PDMS crosslinking agent, and add them into a clean transparent reagent bottle , respectively take 0.5mL, 1.0mL and 1.5mL of chloroform and mix with PDMS solution;
[0067] Step 101: Stir evenly, seal, and place the mixed solution in a moderate vacuum environment for degassing for 1 hour;
[0068] Step 102: After heating the deionized water to boiling, the generated steam is introduced into the spin coater so that the humidity in the airtight environment reaches a dynamic balance, and the relative humidity is controlled to be 75%;
[0069] Step 103: After ultrasonically cleaning the ITO glass substrate with detergent, acetone, deioniz...
Embodiment 2
[0077] This embodiment is basically the same as Embodiment 1, and the special features are:
[0078] In this embodiment, a method for preparing a PDMS in-situ wrinkled anti-reflection film and a white light organic light-emitting diode includes the following steps:
[0079] Step 100: According to the mass ratio (w / w) of DMS prepolymer and crosslinking agent mixed at 10:1, weigh 3.3g of PDMS prepolymer and PDMS crosslinking agent, and add them into a clean transparent reagent bottle , take 1.0mL chloroform and mix it with PDMS solution;
[0080] Step 101 to step 200: this step is the same as that of Embodiment 1;
[0081] Step 201: Place the conductive side of the substrate in step 200 down in a vacuum evaporation chamber to sequentially evaporate various functional layers, including NPB:rubrene (2wt%, 50nm) / BCP (8nm) / Alq3 (30nm) / Liq ( 1nm);
[0082] Step 202: Finally, replace the mask to vapor-deposit cathode metal Al to prepare an electrode cathode layer with a thickness o...
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