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Low-temperature curing low-dielectric high-toughness cyanate ester resin and preparation method thereof

A cyanate resin, low dielectric technology, applied in the fields of organic polymer synthesis and thermosetting resin modification, can solve the problems of poor dimensional stability, high residual stress of products, and high curing temperature of cyanate resin, and achieve excellent Mechanical properties, fast curing rate, and the effect of improving mechanical properties

Active Publication Date: 2022-03-08
AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve technical problems such as high curing temperature of cyanate ester resin, large residual stress of product, poor dimensional stability, etc., develop cyanate ester resin that can be cured rapidly at low temperature and has low dielectric constant and excellent mechanical properties. On the basis of not changing the existing mature cyanate ester resin system, introduce maleimide phenol containing double bonds and phenolic hydroxyl groups, and develop a rapid Cured cyanate ester resin with low dielectric constant and high toughness and preparation method thereof

Method used

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  • Low-temperature curing low-dielectric high-toughness cyanate ester resin and preparation method thereof
  • Low-temperature curing low-dielectric high-toughness cyanate ester resin and preparation method thereof
  • Low-temperature curing low-dielectric high-toughness cyanate ester resin and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0038] Take 20 parts of bisphenol A epoxy resin E51, add 5 parts of 4-maleimidophenol (structural formula 2), add 5 parts of dicyandiamide, 3 parts of substituted urea, 1 part of 9920 defoamer, and stir well Finally, add 16 parts of E20 epoxy resin, add 50 parts of bisphenol A type cyanate (CE01), stir and mix evenly at 90°C, then pour it into a mold at 100°C, vacuumize for 15 minutes, and then heat it at 90°C, 110°C ℃ for 2 hours each, and 130 ℃ for 4 hours to obtain low-dielectric and high-toughness cyanate ester resin.

[0039] The dielectric and mechanical properties of the prepared cyanate resin are listed in Table 1.

Embodiment 2

[0041] Take 20 parts of bisphenol A type epoxy resin E51, add 2 parts of 4-maleimide phenol (structural formula 2), add 2 parts of m-maleimido phenol (structural formula 1), add 1 part of ortho Position 4-maleimidophenol (structural formula 3), add 5 parts of dicyandiamide, 1 part of substituted urea, 0.5 part of 530 defoamer, add 1 part of free radical initiator tert-butyl peroxybenzoate, stir After uniformity, add 15 parts of E20 epoxy resin, add 50 parts of bisphenol A type cyanate (CE01), stir and mix evenly at 90 ° C, then pour into a mold at 100 ° C, vacuumize for 15 minutes, and then at 90 ° C, Keep at 110°C for 2 hours each, and at 130°C and 180°C for 4 hours each to obtain a low-dielectric and high-toughness cyanate ester resin.

[0042] The dielectric and mechanical properties of the prepared cyanate resin are listed in Table 1.

Embodiment 3

[0044] Take 9 parts of bisphenol A epoxy resin E51, add 3 parts of 4-maleimide phenol (structural formula 2), add 4 parts of dicyandiamide, 3 parts of substituted urea, 1 part of 530 defoamer, and stir well Finally, add 80 parts of bisphenol A cyanate (CE01), stir and mix evenly at 90°C, then pour into a mold at 100°C, vacuumize for 15 minutes, then keep at 80°C, 115°C for 4 hours, and at 140°C 6h, you can get low dielectric high toughness cyanate ester resin.

[0045] The dielectric and mechanical properties of the prepared cyanate resin are listed in Table 1.

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Abstract

The invention discloses low-temperature curing low-dielectric high-toughness cyanate ester resin and a preparation method thereof, and belongs to the field of organic polymer synthesis and thermosetting resin modification.On the basis that an existing mature cyanate ester resin system is not changed, maleimido phenol containing double bonds and phenolic hydroxyl groups is introduced, and the low-temperature curing low-dielectric high-toughness cyanate ester resin is obtained; according to the present invention, the cyanate ester resin can be cured under the medium-high temperature condition, and can be rapidly cured under the low temperature condition of less than 130 DEG C so as to prepare the cyanate ester resin with characteristics of low dielectric constant and high toughness, and the mechanical property and the dielectric property of the cyanate ester resin can be improved.

Description

technical field [0001] The invention relates to a preparation method of low-temperature curing low-dielectric high-toughness cyanate resin, in particular maleimidophenol-modified cyanate resin, which belongs to the fields of organic polymer synthesis and thermosetting resin modification. Background technique [0002] Cyanate resins have attracted extensive attention from material science researchers due to their excellent mechanical properties, high heat resistance, low water absorption, good weather resistance and unique dielectric properties. However, the high curing temperature of cyanate resin, the high crosslink density and strong molecular rigidity of the cured product lead to poor toughness of cyanate resin. In order to make up for these shortcomings of cyanate resin, people have tried many modification methods in order to obtain a high-performance resin matrix. Commonly used methods include rubber elastomer blending, allyl compound copolymerization, thermosetting re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/04C08L63/00C08L79/08
CPCC08L79/04C08L2205/04C08L63/00C08L79/08Y02P20/10
Inventor 桂起林董大为郝杰欧秋仁刘克胜
Owner AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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