Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ionic two-end bionic memristor and preparation method thereof

A memristive device and ion-type technology, applied in the field of ion-type two-terminal bionic memristive devices and their preparation, can solve problems such as difficulty in satisfying high-density integration, and achieve the effect of excellent scale miniaturization

Pending Publication Date: 2022-02-01
FUDAN UNIV
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although some three-terminal ionic transistor neurosynaptic devices have been developed, it is difficult to meet the needs of high-density integration due to factors such as the minimum unit size and integration density, and there is an urgent need to develop new bionic synapse devices.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ionic two-end bionic memristor and preparation method thereof
  • Ionic two-end bionic memristor and preparation method thereof
  • Ionic two-end bionic memristor and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] In order to make the objects, technical solutions, and advantages of the present invention, the technical solutions in the embodiments of the present invention will be apparent from the drawings in the embodiment of the present invention, and it is understood that the specific examples described herein will be understood. EXAMPLES The present invention is not intended to limit the invention. The described embodiments are merely the embodiments of the invention, not all of the embodiments. Based on the embodiments of the present invention, those of ordinary skill in the art will belong to the scope of the present invention in the scope of the present invention without making creative labor premises.

[0026] In the description of the present invention, it is to be described, the orientation or positional relationship indicated by the term "upper", "lower", "vertical" "horizontal", etc. is based on the orientation or positional relationship shown in the drawings, is only for ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an ionic two-end bionic memristor and a preparation method thereof. The ionic two-end bionic memristor device comprises a substrate, bottom electrodes which are formed on the substrate, are arranged in parallel along a first direction at certain intervals and serve as one end of the memristor, ionic gel which is formed on the bottom layer electrode and serves as a functional layer of the memristor, and top electrodes which are formed on the ionic gel, are arranged in parallel along a second direction at certain intervals, are in a cross array structure with the bottom electrodes, and serve as the other end of the memristor, wherein two ends of the memristor respectively correspond to a synaptic front end and a synaptic rear end, a functional layer of the memristor corresponds to a synaptic gap, ion migration in brain-like nerve synapses is simulated by utilizing diffusibility of ions in the ionic gel, information transmission of a conductive channel is realized, an ion channel effect in a similar organism is simulated, and a nerve synapse weight modulation process is completed.

Description

Technical field [0001] The present invention relates to the field of semiconductor technology, and more particularly to a bionic resentment device and a preparation method thereof thereof in an ion type. Background technique [0002] With the development of Moore's law, the demand for novel scale micro-shrinkable storage devices is increasing. The memory of the two-end structure has the advantages of CMOS process compatibility, simple structure, fast operating speed, low power consumption, easy to miniature and high density integration, and is ideal for applications of electronic devices. [0003] As the basic components calculated by the cerebral neurological morphology, the neurotactic device can break the bottleneck of the traditional calculation system from the architecture, and improve the calculation energy efficiency of the chip and have received extensive attention. Neural synaptic components need to be adjusted to the syntarians, thereby completing the computational mode...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L45/00G06N3/063
CPCG06N3/063H10N70/245H10N70/20H10N70/881H10N70/011
Inventor 陈琳孟佳琳王天宇孙清清张卫
Owner FUDAN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products