VC radiator with built-in copper/diamond composite configuration wick and preparation method thereof

A diamond, absorbent core technology, applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating renovation, etc., can solve the problems of low thermal expansion, limited thermal conductivity improvement, small diamond content, etc. Humidity, improve the overall heat transfer performance, and reduce the overall thermal resistance

Active Publication Date: 2021-12-07
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] As the core component of the VC board, the capillary wick is mostly copper-based at present, but due to the low thermal conductivity of copper itself, it will be difficult to meet higher power requirements in the future Cooling needs
As the material with the best thermal conductivity in nature, diamond has both high thermal conductivity and low thermal expansion characteristics. It has unique advantages as a thermal conductivity enhancing material. However, at present, diamonds are composited with copper liquid-absorbing cores by coating methods, and the diamond content is small. Limited improvement in thermal conductivity

Method used

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  • VC radiator with built-in copper/diamond composite configuration wick and preparation method thereof
  • VC radiator with built-in copper/diamond composite configuration wick and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Preparation of copper / diamond sintered framework:

[0052] Get the diamond particles with a particle size of 150 μm (100 mesh) to deposit a Cr transition layer, magnetron sputtering power 200w, deposition time 20min, to obtain a thickness of 2 μm diamond particles containing a Cr transition layer, and then deposit a Cr transition layer on the diamond particles containing Cr Copper plating on the surface, the specific copper plating process is: magnetron sputtering power 200w, to obtain a copper cladding layer with a thickness of 2μm, and then the diamond particles containing the copper cladding layer and the copper powder with a particle size of 150μm are in a mass ratio of 40: Mix at 60°C to obtain mixed powder, loosely pack it into a graphite mold, and sinter in a hydrogen atmosphere. During sintering, first raise the temperature to 750°C at a speed of 5°C / min, and then raise the temperature to 900°C at a speed of 3.3°C / h , the holding time is 60 minutes, and then air...

Embodiment 2

[0062] Preparation of copper / diamond sintered framework:

[0063] Get the diamond particle diameter that is 250 μm (60 order) to deposit the Cr transition layer, magnetron sputtering power 200W, deposition time 90min, obtain the diamond particle that is 9 μm in thickness and contain the Cr transition layer, and then on the diamond particle that contains the Cr overcoating layer Copper plating on the surface, the specific copper plating process is: magnetron sputtering power 200W, deposition time 90min to obtain a copper coating layer with a thickness of 9μm, and then the diamond particles containing the copper coating layer and the copper powder with a particle size of 150μm are mixed by mass Mix at a ratio of 50:50 to obtain a mixed powder, loosely pack it in a graphite mold, and sinter it under a hydrogen atmosphere. During sintering, first raise the temperature to 750°C at a rate of 300°C / h (5°C / min), and then increase the temperature at 200°C The temperature was raised to ...

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Abstract

The invention discloses a VC radiator with a built-in copper / diamond composite configuration wick and a preparation method thereof. The VC radiator comprises a lower shell plate, a concave cavity is formed in the center of the inner surface of the lower shell plate, the copper / diamond composite configuration wick is contained in the concave cavity, the copper / diamond composite configuration wick is of a three-dimensional porous structure, the copper / diamond composite configuration wick takes a copper / diamond sintering framework as a base body, a diamond layer is arranged on the surface of the base body, and a metal hydrophilic layer is arranged on the surface of the diamond layer. According to the copper / diamond composite configuration wick, the combination of a high-heat-conduction diamond zero-dimensional particle configuration and a three-dimensional diamond film configuration is realized by compounding the copper / diamond sintering framework containing diamond particles and a three-dimensional communicated diamond film, so that the continuous conduction high-speed heat conduction channel effect of the three-dimensional diamond film is exerted; and by adding the diamond particles, the diamond content in the radiator is increased, the overall thermal resistance is smaller, and the overall heat transfer performance of the VC device can be improved.

Description

technical field [0001] The invention discloses a VC radiator with a copper / diamond composite configuration liquid-absorbing core and a preparation method thereof, belonging to the technical field of thermal management equipment. Background technique [0002] With the advent of the 5G era, in order to meet the growing needs of use, various electronic devices have been updated and developed in the direction of miniaturization, high integration, and high performance. Under the requirements of sharply increasing working power and smaller size, the power density of electronic components has increased sharply. Electronic components perform high-power work in such a small area, which is bound to bring amazing heat. When the heat cannot be dissipated in time, it will lead to failure, damage, or even meltdown of electronic devices. The heat dissipation problem of high-power electronic devices has become a bottleneck in the application of new-generation electronic devices. [0003]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04H05K7/20
CPCF28D15/046H05K7/20336
Inventor 魏秋平周科朝马莉王熹
Owner CENT SOUTH UNIV
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