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Preparation method for smelting copper-titanium series alloy material by adopting vacuum self-consuming electric arc

A vacuum consumable arc and alloy material technology, which is applied in the field of copper-titanium alloy preparation, can solve problems such as titanium alloy segregation, and achieve the effect of uniform structure, simple process and less inclusions

Pending Publication Date: 2021-10-01
SHAANXI SIRUI ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In addition, due to the high density of copper (the density of high-purity copper is 8.96g / cm3), the density of titanium is relatively light (the density of sponge titanium is 4.516g / cm3), and the segregation phenomenon of titanium alloys is easily produced by the general preparation process.

Method used

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  • Preparation method for smelting copper-titanium series alloy material by adopting vacuum self-consuming electric arc
  • Preparation method for smelting copper-titanium series alloy material by adopting vacuum self-consuming electric arc
  • Preparation method for smelting copper-titanium series alloy material by adopting vacuum self-consuming electric arc

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Embodiment 1

[0035] A method for preparing copper-titanium series alloy materials by vacuum consumable arc melting, comprising the following steps:

[0036] S1: Raw material ratio

[0037] The material composition and its mass percentage are: copper powder 0.5%, sponge titanium 99.5%; the copper powder is electrolytic copper powder, the copper content in the copper powder is 99.8%, the particle size is 30-40um, the sponge titanium is grade 0, and the particle size range 3-4mm;

[0038] S2: Raw material mixing

[0039] Take the required raw materials according to the mass percentage of copper powder 0.5%, and the mass percentage of titanium sponge 99.5%, and mix them in a mixer for 2 hours; the speed of the mixer is 10r / min, and the temperature of the mixer is 30°C, 30°C The ambient temperature can ensure that the mixer is dry;

[0040] S3: stereotypes

[0041] Put the mixture into the mold to pier the powder, put the puffed mold into a cold isostatic press for compaction, the compactio...

Embodiment 2

[0051] A method for preparing copper-titanium series alloy materials by vacuum consumable arc melting, comprising the following steps:

[0052] S1: Raw material ratio

[0053] The material composition and its mass percentage are: copper powder 40%, sponge titanium 60%; the copper powder is electrolytic copper powder, the copper content in the copper powder is 99.9%, the particle size is 40-50um, the sponge titanium is grade 0, and the particle size range 4-8mm;

[0054] S2: Raw material mixing

[0055] Take the required raw materials according to the mass percentage of copper powder 40%, and the mass percentage of titanium sponge 60%, and mix them in a mixer for 5 hours; the speed of the mixer is 50r / min, and the temperature of the mixer is 40°C, 40°C The ambient temperature can ensure that the mixer is dry;

[0056] S3: stereotypes

[0057] Put the mixture into the mould, and put the powdered mold into a cold isostatic press for compaction. The compaction pressure is 200Mpa...

Embodiment 3

[0065] A method for preparing copper-titanium series alloy materials by vacuum consumable arc melting, comprising the following steps:

[0066] S1: Raw material ratio

[0067] The material composition and its mass percentage are: copper powder 99.5%, sponge titanium 0.5%; the copper powder is electrolytic copper powder, the copper content in the copper powder is 99.9%, the particle size is 50-74um, the sponge titanium is 0 grade, and the particle size range 8-12.7mm;

[0068] S2: Raw material mixing

[0069] Weigh the required raw materials according to the proportion, and mix them in the mixer for 7 hours; the speed of the mixer is 60r / min, the temperature of the mixer is 50°C, and the ambient temperature of 50°C can ensure the drying in the mixer;

[0070] S3: stereotypes

[0071] Put the mixture into the mold to pier the powder, put the puffed mold into the cold isostatic press for compaction, the compaction pressure is 300Mpa, and the pressure holding time is 10min; put...

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Abstract

The invention discloses a preparation method for smelting a copper-titanium series alloy material by adopting vacuum self-consuming electric arc, and relates to the technical field of copper-titanium alloy preparation. The preparation method comprises the following steps of, S1, raw material proportioning, specifically, the material comprises the following components of, in percentage by mass: 0.5-99.5% of copper powder and 99.5-0.5% of sponge titanium; s2, mixing the raw materials, specifically, weighing the required raw materials according to the proportion, and mixing the raw materials in a mixer; s3, pressing, specifically, putting the mixture into a mold for powder upsetting, and putting the mold subjected to powder upsetting into a cold isostatic press for blank pressing; s4, sintering: putting the pressed green body into a vacuum sintering furnace for sintering; and S5, smelting, specifically, taking the sintered blank as a consumable electrode to be loaded into a vacuum consumable electric arc smelting furnace to be smelted. The alloy material prepared through the method has the advantages of being low in gas content, few in inclusion, uniform in structure and free of copper, titanium enrichment and other microdefects.

Description

technical field [0001] The invention relates to the technical field of copper-titanium alloy preparation, in particular to a method for preparing copper-titanium series alloy materials by vacuum consumable arc melting. Background technique [0002] CuTi alloys are widely used in electrical contact components due to their excellent yield strength, elastic limit, electrical conductivity, ductility and fatigue resistance. Compared with high-strength and high-conductivity copper-beryllium materials, its preparation process is more environmentally friendly, and its high-temperature elasticity is higher, so it has more market application potential as a conductive elastic material. At present, most of the research on CuTi alloy as a substitute for high-strength and high-conductivity copper-beryllium materials is that the Ti content is less than 6.5%. [0003] Titanium and titanium alloy materials are also widely used in the biomedical market due to their excellent comprehensive pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/02C22C9/00C22C14/00B22F3/04B22F3/10
CPCC22C1/02C22C9/00C22C14/00B22F3/04B22F3/1007
Inventor 杨晓青李鹏王文斌王小军武旭红师晓云屈晓鹏吉德胜
Owner SHAANXI SIRUI ADVANCED MATERIALS CO LTD
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