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Application of 3D printing in cross-linked polyimide, preparation of porous polyimide and preparation of polyimide composite material

A 3D printing and polyimide technology, which is applied in application, additive processing, household appliances, etc., can solve the problem of high heat-resistant cross-linked polyimide 3D printing, which has less research on 3D printing and thermosetting polyimide. Reduced thermal performance of parts, difficult to melt and high temperature resistant cross-linked polyimide, etc., to achieve the effect of rich pores, excellent dimensional stability, and enhanced van der Waals force

Active Publication Date: 2021-09-03
LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since both fused deposition 3D printing and selective laser burning 3D printing are difficult to melt high-temperature-resistant cross-linked polyimide, forming is difficult; although stereolithography 3D printing and digital lithography 3D printing are easier to achieve thermosetting polyimide Forming of imide parts, but the thermal performance of the obtained thermosetting polyimide parts is often reduced; at present, the main research object of direct writing 3D printing polyimide is thermoplastic polyimide, which is made of polyamic acid or polyimide Amic acid salts are used as raw materials, and the printed parts are reheated and imidized to obtain polyimide parts
It can be seen that the existing 3D printing has little research on the 3D printing of high heat-resistant cross-linked polyimide

Method used

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  • Application of 3D printing in cross-linked polyimide, preparation of porous polyimide and preparation of polyimide composite material
  • Application of 3D printing in cross-linked polyimide, preparation of porous polyimide and preparation of polyimide composite material
  • Application of 3D printing in cross-linked polyimide, preparation of porous polyimide and preparation of polyimide composite material

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preparation example Construction

[0036] The invention provides a preparation method of direct writing 3D printing cross-linked porous polyimide, comprising the following steps:

[0037] Mix polyamic acid, organic solvent and porogen to obtain polyamic acid ink;

[0038] Carrying out direct writing 3D printing with the polyamic acid ink to obtain 3D printing components;

[0039] The 3D printing component is heat-treated to obtain a cross-linked porous polyimide.

[0040] In the present invention, unless otherwise specified, the required preparation materials are commercially available products well known to those skilled in the art.

[0041] The invention mixes polyamic acid, organic solvent and porogen to obtain polyamic acid ink. In the present invention, the number average molecular weight of the polyamic acid corresponding to the polyimide is preferably 5000-50000 g / mol, more preferably 10000-30000 g / mol; the polyamic acid is preferably:

[0042]

[0043] In the present invention, there is no special l...

Embodiment 1

[0078] (1) Preparation of polyamic acid powder: under a nitrogen atmosphere, dissolve 4.9199g of 4,4'-diaminodiphenyl ether in 70mL of N,N-dimethylformamide, and add 10.4707 g 4,4'-(hexafluoroisopropene) diphthalic anhydride, remove the ice bath after 1 hour of reaction, and after 5 hours of reaction at room temperature, add 0.4965g of 4-phenylethynylphthalic anhydride and add 20mL of N,N-dimethylformamide , continue to react for 24h to obtain a polyamic acid solution with a solid content of 15%, the polyamic acid solution is poured into a mixed solution of water and ethanol (4:1 by volume) under excessive stirring conditions, and then the resulting white Soak the solid in the mixed solution of water and ethanol for 12 hours, filter and wash with water, dry at 80°C for 12 hours, pulverize the obtained solid with a pulverizer, and sieve with a 100-mesh sieve to obtain polyamic acid powder, corresponding to the number of polyimide The average molecular weight is 18700g / mol;

[...

Embodiment 2

[0084] Mix 6 parts of polyamic acid powder prepared in Example 1, 4 parts of N,N-dimethylformamide and 15 parts of sodium chloride with a particle size of less than 300 mesh at room temperature for ball milling, the ball milling time is 30min, and the ball milling rate is 3000r / min, the resulting mixed material is pumped and centrifuged to remove air bubbles to obtain polyamic acid ink;

[0085] Direct writing 3D printing and heat treatment were carried out in the same method as in Example 1, and the obtained article was soaked in deionized water for 12 hours, then taken out, washed with deionized water, and dried to obtain a cross-linked porous polyimide.

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Abstract

The invention provides application of 3D printing in cross-linked polyimide, preparation of porous polyimide and preparation of a polyimide composite material, and belongs to the technical field of 3D printing and intelligent manufacturing. The direct writing 3D printing technology is applied to the cross-linked polyimide, and the cross-linked porous polyimide which is good in heat resistance, excellent in size stability, rich in pores and controllable in pore diameter can be simply prepared. the technology is used for preparing the polyimide composite material, the prepared polyimide composite material has the characteristics of excellent thermal performance, good dimensional stability and complex shape, the process is simple, and the polyimide composite material with diversified shapes can be prepared.

Description

technical field [0001] The invention relates to the technical field of 3D printing and intelligent manufacturing, in particular to the application of 3D printing in cross-linked polyimide, the preparation of porous polyimide, and the preparation of polyimide composite materials. Background technique [0002] Polyimide refers to a class of polymers containing an imide structure on the main chain, which has excellent mechanical properties, high and low temperature resistance, good transparency, excellent electrical properties and radiation resistance, etc., so it is used in aerospace , microelectronics, coatings, batteries, automobile manufacturing, liquid crystal display and gas separation and other fields have a wide range of applications. When the polyamic acid solution is prepared according to the number of non-equal molar components, the polyamic acid with controllable molecular weight can be obtained by adding the monoanhydride or monoamine containing the curing crosslin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C09D11/102C09D11/03B33Y70/10
CPCC08G73/1071C08G73/1039C08G73/1007C09D11/102C09D11/03B33Y70/10
Inventor 王晓龙胡海媛丁镜红郭玉雄杨昌宫琛亮周峰
Owner LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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