High-heat-dissipation metal aluminum-based copper-clad plate

Abstract

The invention discloses a high-heat-dissipation metal aluminum-based copper-clad plate. The copper-clad plate is formed by pressing a copper foil plate, a heat dissipation insulating layer and an aluminum substrate which are sequentially arranged from top to bottom. The heat dissipation insulating layer comprises the following components in parts by weight: 100 parts of epoxy resin, 20-40 parts of heat conduction filler, 2-8 parts of curing accelerator and 20-50 parts of curing agent. The heat conduction filler is prepared by coating boron nitride with modified hollow microspheres, and the modified hollow microspheres are porous hollow microspheres prepared by compounding tantalum disilicide powder and basic cobalt carbonate. The epoxy resin is used as a matrix, and the added heat-conducting filler not only enhances the heat dissipation capability of the epoxy resin, but also enhances the mechanical property of the epoxy resin, so that the heat dissipation insulating layer has the characteristics of high heat conductivity, high stability and the like, and heat accumulated by a heating element can be quickly, timely and effectively transferred; and normal operation of equipment is ensured.

Description

technical field [0001] The invention relates to the field of metal-based copper-clad laminates, in particular to a metal aluminum-based copper-clad laminate with high heat dissipation. Background technique [0002] With the rapid development of electronic products in the direction of light, thin, small, high-density, multi-functional, and microelectronic integration technology, the volume of electronic components and logic circuits has been reduced exponentially, while the operating frequency has increased sharply and power consumption has continued to increase. Large, the working environment of components will change to high temperature, the reliability of the whole machine will decrease, and the service life will be shortened. The development of metal-based copper clad laminates with high heat dissipation is undoubtedly the most effective means to solve the problems of heat dissipation and structural design. Contents of the invention [0003] In view of the problems men...

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Problems solved by technology

[0002] With the rapid development of electronic products in the direction of light, thin, small, high-density, multi-functional, and microelectronic integration technology, the volume of electronic components and logic circuits has been reduced exponentially, while the operating frequency has increased sharply and power consumption has continued to increase. large, leading to the change of the working environment of the components to high temperature, the decrease of the reliability of the whole machine and the shortening of the service life

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