Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for improving interface characteristics of SiC device

A device surface and device technology, which is applied in the field of improving the interface characteristics of SiC devices, can solve the problems of single improvement surface, improvement of non-transition area, improvement of surface roughness of SiC devices, etc., to achieve the effect of improving work.

Active Publication Date: 2021-06-25
TONGHUI ELECTRONICS
View PDF22 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] China's open invention: CN201811474382.6 discloses a method for improving the interface characteristics of SiC devices and SiC devices. The invention forms an oxide layer on a SiC substrate and breaks the chemical bonds of interface defects between SiC and the oxide layer by ultraviolet irradiation. Improve the interface characteristics of SiC devices, but this method cannot improve the transition region, and does not improve the surface roughness of SiC devices, and the improvement surface is relatively single. Therefore, a method for improving the interface characteristics of SiC devices is proposed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for improving interface characteristics of SiC device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] see figure 1 , the present invention provides a technical solution: a method for improving the interface characteristics of SiC devices, comprising the following steps:

[0033] S1. Coating photoresist on the surface of the SiC device, coating the photoresist on the surface of the SiC device, and drying it naturally for 30 minutes after coating, and controlling the room temperature at 25°C during air drying;

[0034] S2. Heat the SiC device, place the SiC device in a heating device, and heat it to 550°C to form a carbide film on the surface of the SiC device, and the heating time is 30 minutes;

[0035] S3. Perform high-temperature annealing on the SiC device, cool the heated SiC device to room temperature, and put it into an annealing device for high-temperature annealing activation;

[0036] S4. Cleaning the surface of the SiC device, cleaning the surface of the SiC device, removing impurities, and air-drying the SiC device after cleaning, the air-drying time is 15 m...

Embodiment 2

[0051] see figure 1 , the present invention also provides a technical solution, which is different from the first embodiment: a method for improving the interface characteristics of SiC devices, comprising the following steps:

[0052] S1. Coating photoresist on the surface of the SiC device, coating the photoresist on the surface of the SiC device, and drying it naturally for 35 minutes after coating, and controlling the room temperature at 28°C during air drying;

[0053] S2. Heat the SiC device, place the SiC device in a heating device, and heat it to 600°C to form a carbide film on the surface of the SiC device, and the heating time is 33 minutes;

[0054] S3. Perform high-temperature annealing on the SiC device, cool the heated SiC device to room temperature, and put it into an annealing device for high-temperature annealing activation;

[0055] S4. Cleaning the surface of the SiC device, cleaning the surface of the SiC device, removing impurities, and air-drying the SiC...

Embodiment 3

[0070] see figure 1 , the present invention also provides a technical solution, which is different from the first embodiment: a method for improving the interface characteristics of SiC devices, comprising the following steps:

[0071] S1. Coating photoresist on the surface of the SiC device, coating the photoresist on the surface of the SiC device, and drying it naturally for 45 minutes after coating, and controlling the room temperature at 30°C during air drying;

[0072] S2. Heat the SiC device, place the SiC device in a heating device, and heat it to 650°C to form a carbide film on the surface of the SiC device, and the heating time is 35 minutes;

[0073] S3. Perform high-temperature annealing on the SiC device, cool the heated SiC device to room temperature, and put it into an annealing device for high-temperature annealing activation;

[0074] S4. Cleaning the surface of the SiC device, cleaning the surface of the SiC device, removing impurities, and air-drying the SiC...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for improving interface characteristics of a SiC device. The method comprises the following steps: S1, coating the surface of a SiC device with a photoresist; S2, heating the SiC device; S3, performing high-temperature annealing on the SiC device; S4, cleaning the surface of the SiC device; S5, oxidizing the surface of the SiC device; S6, annealing the surface of the SiC device; S7, carrying out secondary oxidation on the surface of the SiC device; S8, performing ultraviolet irradiation; S9, cleaning the surface; and S10, testing the performance. According to the invention, when the method is used, the surface roughness of a SiC device is improved by coating the surface of the SiC device with a photoresist and carbonizing the surface of the SiC device to form a carbonized film, and after the SiC device is subjected to oxidation treatment, secondary oxidation treatment is carried out on the SiC device through a wet oxygen secondary oxidation method, so that the thickness of a transition region of the SiC device is reduced, and the content of components in the transition region is reduced; and when the device is used, the problems existing in the improvement process of the SiC device are recorded through multiple performance tests, and further improvement work is facilitated.

Description

technical field [0001] The invention relates to the technical field of improving SiC devices, in particular to a method for improving interface characteristics of SiC devices. Background technique [0002] Silicon carbide, also known as moissanite and corundum, is an inorganic substance with a chemical formula of SiC. It is smelted through a resistance furnace with raw materials such as quartz sand, petroleum coke (or coal coke), wood chips (salt is required to produce green silicon carbide), etc. Silicon carbide also has rare minerals in nature, moissanite, among the non-oxide high-tech refractory materials such as C, N, and B, silicon carbide is the most widely used and economical one, which can be called Emery or refractory sand, silicon carbide has two commonly used basic varieties of black silicon carbide and green silicon carbide, both of which belong to α-SiC, black silicon carbide contains about 95% SiC, its toughness is higher than that of green silicon carbide, and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/316H01L21/314H01L21/02H01L21/04G01R31/26
CPCH01L21/0445H01L21/0223H01L21/02236G01R31/26
Inventor 白欣娇李帅崔素杭张策李晓波张乾敖金平
Owner TONGHUI ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products