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Adhesive sheet

An adhesive sheet, adhesive surface technology, applied in the direction of adhesive types, hydrocarbon copolymer adhesives, adhesives, etc. Deformation of the agent layer, etc.

Active Publication Date: 2021-04-27
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, a high vertical pressure is applied to the fixing material, and the conventional adhesive sheet tends to cause problems such as deformation of the adhesive layer and vibration of the workpiece to be ground, etc.
In addition, the fixing material designed to eliminate these problems has the following problems: heavy peeling occurs, and the workpiece is contaminated when the workpiece is peeled from the fixing material after the back grinding process.
As mentioned above, when grinding hard and brittle substrates, it is difficult to achieve both grinding and peeling properties with conventional fixing materials.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0113]The present invention will be specifically described with reference to the embodiments, but the present invention is not limited by the examples. The evaluation methods in the examples are as follows. It should be noted that in the following evaluation, the adhesive sheet after the isolation body is removed. Further, in the embodiment, "parts" and "%" are the weight reference as long as it is not particularly explained.

[0114]

[0115]In the following evaluation method, the bonding of the adhesive layer (and other adhesive layers) is carried out after pertocking of the isolation of the fitting surface.

[0116](1) Shear bonding strength

[0117]For the adhesive sheet (size: 20 mm × 20 mm) obtained in the examples and comparative examples, the face sticker is attached to the predetermined base (e.g., 20 mm × 20 mm silicon chip) and fixed, The surface of the adhesive layer of the adhesive sheet was formed of a 5 mm × 5 mm silicon chip, and the silicon chip was thermally pressed for 1 minu...

manufacture example 1

[0138][Production Example 1] Preparation of Resin Composition (I)

[0139]Malenic acid modified styrene block copolymer (a) (SEBS: styrene) (SEBS: styrene) = 20 / 80, acid value: 10 (mg) -CH3ONA / G), Made of Chemical Co., Ltd. 80 ° C) 20 parts by weight, epoxy crosslinking agent (Mitsubishi Gas Chemical Co., Ltd., trade name "tetrad-c") 3 parts by weight, fatty acid ester surfactant (manufactured by Huang Co., Ltd. "ExeParl IPP ", molecular weight: 298.5, alkyl number: 16) 3 parts by weight, and a resin composition (I) (mixture) is prepared as a solvent.

manufacture example 2-1

[0140][Production Example 2-1] Preparation of Resin Composition (II-1)

[0141]Malenic acid modified styrene block copolymer (B) (SEBS) (SEBS: styrene) = 30 / 70, acid value: 10 (mg) = 30 / 70, acid value: 10 (mg) -CH3ONA / G), Asahi Chemical Co., Ltd., manufactured, trade name "Tuftec M1913") 100 parts by weight, terpene phenolic tackifier (Yasuhara Chemical Co., LTD. Manufacturing, trade name "ys polystar T80") 50 parts by weight , Epoxy Crosslinking Agent (Mitsubishi Gas Chemical Co., Ltd., trade name "tetrad-c") 3 parts by weight, fatty acid ester surfactant (manufactured by Huang Co., Ltd., trade name "ExeParl IPP", molecular weight: 298.5 , The number of carbon of the alkyl group: 16) 3 parts by weight, and a resin composition (II-1) (mixture) was prepared as a solvent.

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PUM

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Abstract

Provided is an adhesive sheet that can be used to grind a hard and brittle substrate during backgrinding of the hard and brittle substrate and that makes it possible to reduce pollution and achieve excellent productivity, grinding precision, and release. This adhesive sheet comprises an adhesive layer. The thickness of the adhesive layer is 1-300 [mu]m. The indentation hardness H (Pa) of the adhesive layer at 25 DEG C and the thickness hA ([mu]m) of the adhesive layer satisfy the relationship in expression (1): logH>=1.9385*loghA+4.2611.

Description

Technical field[0001]The present invention relates to a binder sheet.Background technique[0002]In recent years, the precision is good to make a sapphire substrate used in electronic devices such as substrates, SOS (SOS (SOS (Silicone Block Gem, Silicon On SAPPHIRE), and / or smartphones and / or watches, which can be expected to be used as a substrate for power semiconductor. The silicon carbide substrate, a gallium nitride substrate, gallium oxide substrate, a diamond substrate, a silicon nitride substrate, a nitrogen oxide substrate, glass, and / or a lens crystal vibrator, such as a heat sink material for power semiconductors. The demand of the quartz substrate such as a hard and brittle ceramic substrate (hereinafter collectively referred to as a crispy substrate) becomes high. As a representative example of the process of manufacturing such a substrate, the back surface grinding of the substrate (wafer) can be mentioned to the back surface grinding process of the desired thickn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/38C09J11/08C09J123/08C09J125/08C09J131/04C09J201/00H01L21/304
CPCC09J7/38C09J123/08C09J131/04C09J201/00B24B7/228H01L21/6836H01L2221/68327H01L2221/6834H01L2221/68386C09J153/025C09J7/10C09J2203/326C09J2453/00C09J2423/04C09J2301/124C09J2431/00C09J7/381C09J11/08C09J125/10C09J153/02C09J2425/00H01L21/304Y10T428/2883
Inventor 上野周作由藤拓三平山高正
Owner NITTO DENKO CORP
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