Preparation method of large-size 6061 aluminum alloy plate for semiconductor equipment

Abstract

The invention discloses a preparation method of a large-size 6061 aluminum alloy plate for semiconductor equipment. The preparation method comprises the following steps of smelting and casting a proportioned aluminum alloy to obtain an aluminum alloy cast ingot; enabling the obtained aluminum alloy cast ingot to be subjected to homogenizing heat treatment, machining, preheating and hot rolling, and obtaining the large-specification aluminum alloy plate; and enabling the large-specification aluminum alloy plate obtained after the hot rolling to be pre-stretched, enabling the pre-stretched plateto be subjected to solution hardening, then conducting stretching and leveling, and conducting artificial aging. According to the preparation method, microstructure distortion energy segregation generated in the rolling process of the ultra-thick and ultra-wide 6061 plate can be eliminated or even, quenching internal stress generated by solid solution quenching is lower and more even, meanwhile,stress relief stretching after the quenching is combined, the residual internal stress is almost completely eliminated, the subsequent machining precision of the plate is remarkably improved, and therequirement of semiconductor equipment on high form and location stability of the aluminum plate is met.

Description

technical field [0001] The invention relates to the technical field of non-ferrous metal processing, in particular to a method for preparing large-size 6061 aluminum alloy plates for semiconductor equipment. Background technique [0002] Large-sized aluminum alloy sheets are widely used in the field of semiconductor equipment. For example, OLED etching machines of the 6th to 10.5th generations generally require a plate width of 2000-4000mm and a thickness of more than 60-260mm. It is extremely difficult to manufacture large-scale aluminum alloy sheets, and it is extremely difficult to ensure uniformity in each area of ​​the sheet. Semiconductor equipment also has extremely high requirements on the comprehensive performance of aluminum alloys. For example, in the process of film formation, it is necessary to repeatedly feed different highly corrosive gases, such as SiH 4 、SiH 2 Cl 2 , WF 6 、TiCl 4 、PH 3 , Cl 2 etc., will cause corrosion damage to the aluminum alloy par...

AI Technical Summary

Problems solved by technology

Compared with the rolling preparation method, this method has the disadvantages of low production efficiency and high production cost

[0004] The 6061 aluminum alloy prepared by the prior art cannot meet the many stringent requirements of semiconductor equipment on aluminum alloy at the same time, and has the following disadvantages: (1) the internal stress of the aluminum alloy is large and unevenly distributed, and it is easily deformed by machining, resulting in poor sealing of semiconductor equipment. Vacuuming is difficult; (2) The grain uniformity is poor, and the grain size deviation is as high as 10%, resulting in low processing accuracy of semiconductor equipment; (3) The AlFe phase is mostly dendritic β-AlFe with a length of about 5-10mm phase, the combination with the matrix is ​​not firm, it is easy to fall off during the grinding and oxidation process, which reduces the stability of the oxide film, thereby shortening the life of semiconductor equipment; The alloy undergoes uniform deformation

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