A kind of preparation method of silver metal oxide flake electric contact

Abstract

The disclosure relates to a preparation method of a silver metal oxide flake electric contact, which adopts a magnetron sputtering process to plate silver on an AgMeO substrate; During controlled sputtering silver plating, the AgMeO substrate is heated and kept to 30%-65% of the melting point of the AgMeO substrate. This disclosure uses magnetron sputtering technology, combined with the actual situation of electric contacts and the respective advantages of several conventional preparation processes, to form an independent, efficient and stable electric contact preparation method, and to a certain extent avoid the shortcomings of the above-mentioned processes. On the premise of ensuring the bonding strength of the working layer and the soldered silver layer, the distribution uniformity of the silver layer is improved, and the cost of contact materials in the switching device is reduced.

Description

technical field [0001] The disclosure belongs to the field of electrical alloy materials, in particular to a method for preparing a silver metal oxide flake electrical contact applied in the fields of contactors, circuit breakers, relays and the like. Background technique [0002] In the low-voltage electrical appliance industry, the most widely used electrical contact material is silver-based electrical contact material, and among them, silver metal oxide electrical contact material has excellent arc erosion resistance, welding resistance and low and stable contact resistance, etc. Comprehensive advantages occupy an important position in the entire electrical contact material system. When silver metal oxide materials are used in the field of contactors with relatively large current levels, they are usually processed into the form of sheet contacts, which are assembled after welding with copper contact bridges. Due to the poor wettability between the silver metal oxide mate...

AI Technical Summary

Problems solved by technology

This preparation method has the advantages of high material utilization rate and good silver layer consistency, but in order to ensure the fluidity of the silver paste, a certain amount of organic matter must be added, and there are special requirements for the particle size distribution and morphology of the raw material silver powder. The manufacturing cost of the paste itself is high; defects such as holes are prone to appear in the silver layer after sintering, which affects the soldering performance of the contacts; limited by the fluidity of the silver paste, there is a certain limit on the minimum thickness of the silver layer

Patent No. 94193439.X discloses a preparation process for the connection layer of silver metal oxide contact materials based on a single-sided reduction method, using the reduced silver alloy layer as the connection layer. It has been verified by practice that this method is difficult to obtain a neat The distribution of the connection layer, under the condition of no pressure, the diffusion of the reducing atmosphere in the silver metal oxide material is not synchronous, there is a phenomenon of local uneven speed, and the distribution uniformity of the prepared contact silver layer is poor; after After the reduction treatment, the structure of the silver alloy layer is loose, and it is easy to seal the gas during the welding process, resulting in low shear strength after welding

Images