A kind of preparation method and product of copper alloy composite material for electronic packaging

A technology for electronic packaging and composite materials, which is applied in the field of preparation of copper alloy composite materials for electronic packaging, can solve the problem that the comprehensive performance cannot meet the high requirements of electronic packaging, and achieves the effect of improving electromagnetic shielding performance, simple installation and good thermal conductivity.

Active Publication Date: 2022-05-24
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The preparation of traditional copper alloy materials is simply a multi-phase combination, and its comprehensive performance can no longer meet the high requirements of electronic packaging. How to improve the comprehensive performance of copper alloy composite materials and play a role in promoting the development of the electronic information industry is the current research topic focus

Method used

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  • A kind of preparation method and product of copper alloy composite material for electronic packaging
  • A kind of preparation method and product of copper alloy composite material for electronic packaging
  • A kind of preparation method and product of copper alloy composite material for electronic packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The preparation of copper alloy composite material for electronic packaging includes the following steps:

[0037] (1) Preparation of electroless silver plating solution: add ammonia water with a mass fraction of 25% to a silver nitrate solution with a concentration of 10 g / L until the solution is clarified to obtain the main salt solution of electroless silver plating; add glucose into deionized water to obtain a concentration It is a reducing solution of 100g / L;

[0038] (2) Preparation of electroplating solution: add nickel sulfate hexahydrate solution, nickel dichloride hexahydrate solution, ascorbic acid solution, iron salt solution, sodium saccharin solution, sodium lauryl sulfate solution and CNTs water dispersion to the boric acid solution in turn solution to obtain electroplating solution, wherein the concentration of boric acid is 15g / L, the concentration of nickel sulfate hexahydrate is 100g / L, the concentration of nickel dichloride hexahydrate solution is 10...

Embodiment 2

[0043] Preparation of copper alloy composite materials for electronic packaging:

[0044] (1) Preparation of electroless silver plating solution: add ammonia water with a mass fraction of 20% to a silver nitrate solution with a concentration of 8g / L until the solution is clarified to obtain the main salt solution of electroless silver plating; add glucose into deionized water to obtain the concentration It is a reducing solution of 110g / L;

[0045] (2) Preparation of electroplating solution: add nickel sulfate hexahydrate solution, nickel dichloride hexahydrate solution, ascorbic acid solution, iron salt solution, sodium saccharin solution, sodium lauryl sulfate solution and CNTs water dispersion to the boric acid solution in turn liquid, obtains electroplating solution, wherein the concentration of boric acid is 25g / L, the concentration of nickel sulfate hexahydrate is 130g / L, the concentration of nickel dichloride hexahydrate solution is 15g / L, the concentration of ascorbic ...

Embodiment 3

[0050] The preparation of copper alloy composite material for electronic packaging includes the following steps:

[0051] (1) Preparation of electroless silver plating solution: add ammonia water with a mass fraction of 30% to a silver nitrate solution with a concentration of 12 g / L until the solution is clarified to obtain the main salt solution of electroless silver plating; add glucose into deionized water to obtain the concentration It is a reducing solution of 90g / L;

[0052] (2) Preparation of electroplating solution: add nickel sulfate hexahydrate solution, nickel dichloride hexahydrate solution, ascorbic acid solution, iron salt solution, sodium saccharin solution, sodium lauryl sulfate solution and CNTs water dispersion to the boric acid solution in turn liquid, obtain electroplating solution, wherein the concentration of boric acid is 20g / L, the concentration of nickel sulfate hexahydrate is 115g / L, the concentration of nickel dichloride hexahydrate solution is 12g / L...

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Abstract

The invention discloses a method for preparing a copper alloy composite material for electronic packaging and a product thereof. The method comprises the following steps: preparing an electroplating solution; chemically silver-plating polyurethane foam, and removing the polyurethane foam by heat treatment to obtain silver foam; The carbon nanotube / iron / nickel (CNTs / Fe / Ni) composite foam is obtained by electroplating on top, heat-treated; filled with copper powder, cold-pressed, and hot-pressed and sintered to finally obtain a copper alloy composite material. In the present invention, CNTs / Fe / Ni composite foam is used as a three-dimensional skeleton reinforcement phase, and copper powder is filled as a tough phase, and CNTs do not have a large area of ​​agglomeration inside, and its structural integrity is preserved. The copper alloy composite material prepared by the invention has high electromagnetic shielding performance, good thermal conductivity, high tensile strength, good ductility and low expansion coefficient, and meets the performance requirements of the copper alloy used for electronic packaging.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging copper alloy materials, and particularly relates to a preparation method of a copper alloy composite material for electronic packaging and a product thereof. Background technique [0002] Due to its excellent electrical and thermal conductivity, copper alloy materials are widely used in integrated circuits, heat dissipation and electrical contact materials. At present, modern electronic products are developing in the direction of thinness, smallness and high density. Therefore, the performance requirements of copper alloy materials for electronic packaging are gradually increasing, such as tensile strength, ductility, electromagnetic shielding performance and thermal conductivity. [0003] The preparation of traditional copper alloy materials is only a simple multi-phase combination, and its comprehensive performance can no longer meet the high requirements of electronic packaging. Ho...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C23C18/44C23C18/16C25D5/54C25D15/00C25D3/56C22C1/10
CPCC22C9/00C22C26/00C23C18/44C23C18/1644C23C18/1641C25D5/54C25D15/00C25D3/562C22C1/10C22C2026/002
Inventor 刘意春陈雅芝汪从珍李凤仙陶静梅李才巨鲍瑞方东易健宏
Owner KUNMING UNIV OF SCI & TECH
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