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CMP pad MANUFACTURING METHOD AND CMP PAD Conditioner

A chemical machinery and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, manufacturing tools, grinding/polishing equipment, etc., can solve the problems of coating corrosion, frequency increase, scratches, etc. The effect of expanding and reducing the size

Active Publication Date: 2021-01-15
SHINHAN DIAMOND IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, in a CMP process that flattens a relatively large diameter wafer using a correspondingly large CMP pad, large impact forces and stresses are applied to the wafer and the CMP pad, thereby causing occurrences on the wafer such as Increased frequency of scratched defects
[0007] A problem with typical CMP pad conditioners is that the water used in the wafer polishing process penetrates the junction (interface) between the metal gripper and each diamond grit, causing corrosion of the plating, which causes the diamond grits to separate from the metal gripper and So scratches appear on the surface of the wafer

Method used

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  • CMP pad MANUFACTURING METHOD AND CMP PAD Conditioner
  • CMP pad MANUFACTURING METHOD AND CMP PAD Conditioner
  • CMP pad MANUFACTURING METHOD AND CMP PAD Conditioner

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Embodiment Construction

[0047] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0048] The above and other aspects, features, and advantages of the present disclosure will become apparent from the detailed description of the following embodiments in conjunction with the accompanying drawings.

[0049] It should be understood that the present disclosure is not limited to the following embodiments and may be embodied in various ways, and the embodiments are provided to provide a complete disclosure of the present disclosure and to enable those skilled in the art to thoroughly understand the present disclosure. The scope of the present disclosure is defined only by the claims.

[0050] Descriptions of known functions and constructions that may unnecessarily obscure the subject matter of the present disclosure will be omitted.

[0051] figure 1 is a flowchart of a method of manufacturing a CMP pad conditioner according to the present di...

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Abstract

A CMP pad conditioner and method for manufacturing the same. The CMP pad conditioner includes: a metal plate shank, diamond grit particles each having a lower end secured to a surface of the metal plate shank; a plating layer formed on the surface of the metal plate shank and surfaces of lower portions of the diamond grit particles to expose upper portions of the diamond grit particles; and a coating layer deposited over a surface of the plating layer and surfaces of the upper portions of the diamond grit particles.

Description

technical field [0001] The present disclosure relates to a method of manufacturing a CMP pad conditioner and a CMP pad conditioner produced by the method, and more particularly, to a method of manufacturing a CMP pad conditioner and a CMP pad conditioner produced by the method device, the method may allow improving the bonding strength of diamond grit, improving the environmental friendliness and corrosion and wear resistance of a CMP pad conditioner, accelerating the expansion of a thin line width semiconductor process, and reducing the volume of an electronic device. Background technique [0002] Generally, a chemical mechanical polishing (CMP) process is used in many industrial fields to polish the surface of a specific workpiece. [0003] In particular, in the field of manufacturing semiconductor devices, microelectronic devices, or computer products, the CMP process is widely used for polishing ceramics, silicon, glass, quartz, metals, and / or wafers thereof. [0004] T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00B24B37/11
CPCB24D18/0054B24B37/11B24B53/017B24B37/20B24B37/04B24B53/047H01L21/30625
Inventor 金信京金圣奎朴东阅金刚俊金敬真金兑炫
Owner SHINHAN DIAMOND IND
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