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Thermal interface material and preparation method thereof

A thermal interface material, thermally conductive filler technology, applied in chemical instruments and methods, lamination, layered products, etc., can solve the problems of high cost, complex preparation process, etc., to achieve easy operation, simple preparation method, high thermal conductivity. Effect

Pending Publication Date: 2021-01-12
SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the preparation process is complicated and the cost is high

Method used

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  • Thermal interface material and preparation method thereof
  • Thermal interface material and preparation method thereof
  • Thermal interface material and preparation method thereof

Examples

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Effect test

Embodiment 1

[0032] Step 1. Immerse 100 parts of natural graphite powder with a size of 5.0 μm and a thickness of 50 nm in an acidic aqueous solution with a pH of 1 prepared by concentrated sulfuric acid for 2 hours, so that the surface of the natural graphite powder is grafted with hydroxyl and carboxyl groups, and use deionization After washing it with water to neutrality, dry it for 12 hours at 50°C.

[0033] Step 2, 100 parts of natural graphite micropowder obtained in step 1, 100 parts of epoxy resin, 100 parts of methyl ethyl ketone organic solvent, 1 part of gamma-aminopropyltriethoxysilane, 50 parts of spherical alumina with a particle diameter of 20 μm, Add it into a stirring reaction kettle, and stir for 8 hours at a temperature of 25°C.

[0034] Step 3: Coat the mixture obtained in Step 2 on the PE release film, and then dry it at 100°C for 2 hours to remove the methyl ethyl ketone organic solvent and form a composite film on the release film.

[0035] Step 4. Peel off the comp...

Embodiment 2

[0039] Step 1. Immerse 1200 parts of flake graphite powder with a size of 200 μm and a thickness of 20.0 μm in an acidic aqueous solution with a pH of 2 prepared by concentrated nitric acid for 6 hours, so that the surface of the graphite powder is grafted with hydroxyl and carboxyl groups, and the surface of the graphite powder is removed. After washing it with ion water to neutrality, dry it for 12 hours at 100°C.

[0040] Step 2: Add 1200 parts of flake graphite micropowder obtained in step 1, 100 parts of silicone resin, 1200 parts of n-hexane, 5 parts of decyltrimethoxysilane, and 50 parts of spherical alumina with a particle size of 500nm into the stirring reaction kettle , stirred at a temperature of 70° C. for 8 hours.

[0041] Step 3. Coating the mixture obtained in step 2 on the PET release film and then drying it at 50°C for 2 hours to remove the n-hexane organic solvent and form a composite film on the release film;

[0042] Step 4. Peel off the composite film obt...

Embodiment 3

[0046] Step 1. Immerse 600 parts of expanded graphite powder with a size of 100 μm and a thickness of 5.0 μm in an acidic aqueous solution with a pH of 2 prepared by concentrated hydrochloric acid for 6 hours, so that the surface of the graphite powder is grafted with hydroxyl and carboxyl groups, and the surface of the graphite powder is removed. After washing it with ion water to neutrality, dry it at 100°C for 4 hours before use.

[0047] Step 2. Add 600 parts of flake graphite micropowder, 100 parts of silicone resin, 600 parts of n-hexane, 3 parts of hexadecyltrimethoxysilane, and 100 parts of spherical alumina with a particle size of 10 μm into the stirring reactor , stirred at 70°C for 4 hours.

[0048] Step 3. Coating the mixture obtained in step 2 on the PET release film, and then drying at 50°C for 6 hours to remove the n-hexane organic solvent and form a composite film on the release film;

[0049] Step 4. Peel off the composite film obtained in step 3 from the rel...

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Abstract

The invention belongs to the technical field of polymer composite materials, and discloses a thermal interface material preparation method, which comprises: 1, impregnating graphite micro-powder in anacidic aqueous solution, and conducting washing and drying; 2, uniformly stirring thermosetting resin, an organic solvent, a coupling agent, a heat-conducting filler and the graphite micro-powder obtained in the step 1 to obtain a mixture; 3, coating a release film with the mixture, and conducting drying; 4, conducting stripping from the release film, stacking multiple layers, and conducting pressing to obtain a laminated compound; 5, cutting the laminated compound along the laminating direction; and 6, conducting curing to obtain the thermal interface material. According to the method, a coating mode is adopted to realize horizontal orientation of the graphite micro-powder in the thermosetting resin, the horizontally oriented graphite micro-powder / thermosetting resin is laminated layer by layer and subjected to compression molding, and a cutting mode is adopted to realize orientation of the graphite micro-powder in the thickness direction, so that the thermal interface material witha high heat conductivity coefficient is prepared.

Description

technical field [0001] The invention belongs to the technical field of polymer composite materials, and in particular relates to a thermal interface material and a preparation method thereof. Background technique [0002] With the advent of the 5G era, the frequency band and bandwidth increase, the number of networked devices and antennas has doubled, folding screens and full screens, and wireless charging functions have been enhanced. The problem of heat accumulation in electronic devices has become more and more serious. Effective heat dissipation has It has become a key issue restricting the development of modern electronic devices. Thermal interface materials are widely used in the thermal management of electronic devices. They are mainly used to fill the gap between electronic devices and heat sinks, reduce the contact thermal resistance between electronic devices and heat sinks, and directly affect the performance and service life of electronic devices. In the high-po...

Claims

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Application Information

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IPC IPC(8): B32B27/06B32B27/08B32B27/18B32B27/38B32B27/40B32B27/28B32B27/32B32B27/42B32B27/36B32B27/20B32B37/06B32B37/10B32B38/00C08L63/00C08L83/04C08L75/04C08K9/02C08K3/04C08K5/544C08K7/18C08K7/00C08K5/5419C08K7/24C08J5/18
CPCB32B27/08B32B27/18B32B27/28B32B27/38B32B27/40B32B27/281B32B27/32B32B27/42B32B27/36B32B27/20B32B37/06B32B37/10B32B38/0004C08J5/18C08J2363/00C08J2383/04C08J2375/04C08K9/02C08K3/04C08K5/544C08K7/18C08K7/00C08K5/5419C08K7/24C08K2201/003B32B2307/302
Inventor 曾小亮孙蓉许建斌邓飞辛陪陪任琳琳张晨旭叶振强
Owner SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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