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Epoxy resin adhesive for bonding rubber materials and preparation method thereof

A technology of epoxy resin and rubber materials, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of weather resistance and environmental resistance, difficult to control room temperature curing, insufficient toughness of adhesives, etc. problems, to achieve the effect of a wide range of working environments, intense molecular motion, and strong adhesion

Pending Publication Date: 2020-11-17
湖北航泰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the prior art, the present invention provides an epoxy resin adhesive for bonding rubber materials and a preparation method thereof. The adhesive prepared by the method has excellent performance and can be better adapted to the use scene inside a rocket engine , Solve the problems of insufficient toughness of viscose glue, difficult control of room temperature curing, pot life, thixotropy, permeability, weather resistance and environmental resistance

Method used

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  • Epoxy resin adhesive for bonding rubber materials and preparation method thereof
  • Epoxy resin adhesive for bonding rubber materials and preparation method thereof
  • Epoxy resin adhesive for bonding rubber materials and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0066] A kind of epoxy resin adhesive for rubber material bonding, comprises A component, B component and hydrophilic silica, the mass ratio of described A component, B component and hydrophilic silica is 100: 40-55:5-7, the A component is a polysiloxane modified epoxy resin body, and the B component is a low molecular weight polyamide curing agent.

[0067] The A component includes 86.2 parts by mass of linear organosilicon-modified epoxy and 13.8 parts by mass of hyperbranched epoxy to prepare a reaction stock solution, and 0.5 parts by mass of silane coupling agent is added to the reaction stock solution The reaction produces A component.

[0068] Such as figure 2 , Figure 2a-2e As shown, the molecular structural formula of the A component is prepared from a linear silicone modified epoxy resin CRE-2501 and a hyperbranched epoxy resin CRE-2502 through the coupling condensation of a silane coupling agent into a bead chain hyperbranched polymer structural formula :

[0...

Embodiment 2

[0091] A kind of epoxy resin adhesive for rubber material bonding, comprises A component, B component and hydrophilic silica, the mass ratio of described A component, B component and hydrophilic silica is 100: 40-55:5-7, the A component is a polysiloxane modified epoxy resin body, and the B component is a low molecular weight polyamide curing agent.

[0092] The mass ratio of A component, B component and hydrophilic silica described in this embodiment is 100:45:7, and the epoxy resin adhesive for rubber material bonding described in the present invention is prepared by mixing, and prepared as After the adhesive is discharged.

[0093] The A component includes 82 parts by mass of linear organosilicon-modified epoxy and 18 parts by mass of hyperbranched epoxy to obtain a reaction stock solution, and 2 parts by mass of silane coupling agent are added to the reaction stock solution The reaction produces A component.

[0094] Such as figure 2 , Figure 2a-2f As shown, the mole...

Embodiment 3

[0127] A kind of epoxy resin adhesive for rubber material bonding, comprises A component, B component and hydrophilic silica, the mass ratio of described A component, B component and hydrophilic silica is 100: 40-55:5-7, the A component is a polysiloxane modified epoxy resin body, and the B component is a low molecular weight polyamide curing agent.

[0128] The mass ratio of A component, B component and hydrophilic silica described in this example is 100:53:5, and the epoxy resin adhesive for rubber material bonding described in the present invention is prepared by mixing, and prepared as After the adhesive is discharged.

[0129] The A component includes 90 parts by mass of linear silicone-modified epoxy and 10 parts by mass of hyperbranched epoxy to prepare a reaction stock solution, and 1 part by mass of silane coupling agent is added to the reaction stock solution The reaction produces A component.

[0130] Such as figure 2 , Figures 2a-2g As shown, the molecular stru...

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Abstract

The invention relates to an epoxy resin adhesive for rubber material bonding and a preparation method thereof. The adhesive comprises a component A, a component B and hydrophilic white carbon black, wherein the mass ratio of the component A to the component B to the hydrophilic white carbon black is 100:40-55:1-8, the component A is a polysiloxane modified epoxy resin body, and the component B isa low-molecular-weight polyamide curing agent. The component A comprises a reaction stock solution prepared from 82-90 parts by mass of linear organic silicon modified epoxy resin CRE-2501 and 10-18 parts by mass of hyperbranched epoxy resin CRE-2502; and 0.5-2 part by mass of a silane coupling agent is added into the reaction stock solution to react to obtain the component A. The adhesive prepared by the method is excellent in performance and strong in permeability, and can be better applied to adhesion of nitrile rubber.

Description

technical field [0001] The invention relates to the field of adhesive preparation methods, in particular to an epoxy resin adhesive used for bonding rubber materials and a preparation method thereof. Background technique [0002] Epoxy resin is one of the most commonly used adhesive types. It is mainly composed of compounds containing multiple epoxy groups, and is composed of curing agent, toughening agent, diluent and other materials. The thermoplastic linear structure epoxy resin and curing The agent undergoes cross-linking and curing reaction under certain conditions to form a body-shaped network structure, which has the advantages of fast curing, strong adhesion, and no release of small molecules during the curing process. Epoxy resins contain a lot of polar C-O bonds. In addition, amine or polyamide curing systems also contain a lot of C-N bonds. Therefore, it has a good interface force with nitrile rubber and can play a good role in adhesion. connection effect. The b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J187/00C09J11/04C08G83/00
CPCC09J187/00C09J11/04C08G83/005C08K7/26
Inventor 黄驰胡铭杰廖俊吕爱民
Owner 湖北航泰科技有限公司
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