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Heat dissipation composition of semiconductor device and preparation method thereof

A technology of semiconductor and composition, applied in the field of heat dissipation composition and preparation thereof, can solve the problems of poor formability of epoxy resin composition and reduced adhesiveness of substrates and the like

Pending Publication Date: 2020-10-30
廖铁仙
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, there is a problem that the adhesion to the base material and the adhesiveness after curing are greatly reduced.
In addition, there is a problem that the moldability of the highly filled epoxy resin composition is significantly poor

Method used

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  • Heat dissipation composition of semiconductor device and preparation method thereof
  • Heat dissipation composition of semiconductor device and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Composition of raw materials (parts by weight): 10 parts of thermally conductive metal paste, 50 parts of phenolic epoxy resin, 70 parts of furan resin, 1 part of potassium stearate, 1 part of polytetrafluoroethylene, 30 parts of ethylene glycol phenyl ether, 10 parts of phenol share.

[0040] The preparation method of thermally and electrically conductive metal paste is as follows:

[0041] S1. Casting ingots: casting 100 parts by weight of copper ingots, 10 parts by weight of silver ingots, 1 parts by weight of tin ingots and 5 parts by weight of zinc ingots is processed into cube ingredients of 25mm * 25mm * 25mm with metal mold casting;

[0042] S2. Rolling deformation: the processed billet is cold-rolled and deformed by a two-roll mill at room temperature. After the two-pass rolling is completed, the cumulative deformation is 12%;

[0043]S3. Remelting treatment: Put the cold-rolled and deformed sample into a power frequency induction heating furnace and heat it t...

Embodiment 2

[0050] Raw material composition (parts by weight): 30 parts of thermally conductive metal paste, 100 parts of glycidyl ether epoxy resin, 120 parts of thermosetting acrylic resin, 5 parts of hindered phenol, 3 parts of molybdenum disulfide, 100 parts of ethylene glycol phenyl ether , 20 parts of phenol.

[0051] The preparation method of thermally and electrically conductive metal paste is as follows:

[0052] S1. Casting ingots: casting 100 parts by weight of copper ingots, 25 parts by weight of silver ingots, 5 parts by weight of tin ingots and 15 parts by weight of zinc ingots is processed into a cube batch of 25mm * 25mm * 25mm with metal mold casting;

[0053] S2. Rolling deformation: the processed billet is cold-rolled and deformed by a two-roll rolling mill at room temperature. After the two-pass rolling is completed, the cumulative deformation is 17%;

[0054] S3. Remelting treatment: put the cold-rolled and deformed sample into a power frequency induction heating fur...

Embodiment 3

[0061] Composition of raw materials (parts by weight): 15 parts of thermally conductive metal paste, 70 parts of diphenol-based propane type epoxy resin, 90 parts of polybutadiene resin, 2 parts of aluminum stearate, 1 part of silicone oil, 50 parts of ethylene glycol phenyl ether Parts, 12 parts of phenol.

[0062] The preparation method of thermally and electrically conductive metal paste is as follows:

[0063] S1. Casting ingots: 100 parts by weight of copper ingots, 12 parts by weight of silver ingots, 2 parts by weight of tin ingots and 7 parts by weight of zinc ingots are processed into cube ingredients of 25mm * 25mm * 25mm by metal mold casting;

[0064] S2. Rolling deformation: the processed billet is cold-rolled and deformed by a two-roll rolling mill at room temperature. After the two-pass rolling is completed, the cumulative deformation is 13%;

[0065] S3. Remelting treatment: put the cold-rolled and deformed sample into a power frequency induction heating furna...

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Abstract

The invention provides a heat dissipation composition of a semiconductor device and a preparation method thereof. The heat dissipation composition is prepared from the following raw materials: heat-conducting and electric-conducting metal paste, epoxy resin, thermosetting resin, a stabilizer, a lubricant, ethylene glycol phenyl ether and phenol. The composition has high heat dissipation, adhesionduring operation, adhesion after curing, and long-term reliability, and can be used for fixing electrical components in fields such as power semiconductors, semiconductor elements of optical semiconductors, semiconductor devices, metal plates for circuits, circuits formed by the metal plates, circuit substrates, and hybrid integrated circuits.

Description

technical field [0001] The invention relates to a heat dissipation composition of a semiconductor device and a preparation method thereof. Background technique [0002] In recent years, due to the miniaturization and increase in power of semiconductor devices, electric and electronic components, how to dissipate heat generated by electronic components and the like in a narrow space has become a problem. One of the means is to use an insulating adhesive or sheet that conducts heat from a heat-generating target portion of an electronic component to a heat-dissipating member. As these adhesives and sheets, a composition in which a thermosetting resin is highly filled with an inorganic high-radiation filler is used. However, the amount of heat generated from semiconductor devices, electronic equipment, and electronic parts tends to increase, and further improvements in thermal conductivity are required for adhesives and sheets used for them. Therefore, there is a greater deman...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J161/00C09J133/04C09J109/00C09J183/04C09J161/28C09J9/02C09J11/06C09J11/08C09J11/00C09J11/04H01L23/373
CPCC08K2003/0806C08K2003/085C08K2003/0893C08K2003/3009C08K2201/001C08L2203/20C08L2203/206C08L2205/03C09J9/02C09J11/00C09J11/04C09J11/06C09J11/08C09J109/00C09J133/04C09J161/28C09J163/00C09J183/04H01L23/3737C08L61/00C08L27/18C08K3/08C08K5/098C08K13/02C08L63/00C08K5/13C08K3/30C08L83/04C08K3/04
Inventor 廖铁仙
Owner 廖铁仙
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