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Antioxidant copper material and preparation method thereof

A technology of copper oxide and copper oxide powder, applied in the direction of conductive materials, conductive materials, metal material coating technology, etc., can solve the problems of complex process, poor anti-oxidation effect, high preparation cost, etc.

Active Publication Date: 2020-10-20
厦门铜乐科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the shortcomings of complex process, poor anti-oxidation effect and high production cost in the prior art, the purpose of the present invention is to provide an anti-oxidation copper material and Its preparation method has the advantages of simple preparation process, good anti-oxidation performance and low cost

Method used

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  • Antioxidant copper material and preparation method thereof
  • Antioxidant copper material and preparation method thereof
  • Antioxidant copper material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] Weigh 2 g of spherical copper powder with a particle size of 10 nm. Add 20 mL of butanol, 1.5 mL of oleylamine, and 2 mL of potassium formate solution into the container and stir evenly. Then put the copper powder in the container containing the above mixed solution and heat and stir at 80° C. for 1 h. After natural cooling, discard the supernatant, and then add 20mL concentration of 1.0×10 -1 mol / L mercaptoethanol and stirred for 30s. After suction filtration and drying, the anti-oxidation copper powder can be obtained. Add 0.4g of amino resin and 0.6g of ammonium chloride mixed solvent to the obtained anti-oxidation copper powder, and stir evenly in a natural environment at room temperature for 5 minutes to obtain a conductive paste with a resistivity of 1.4×10 -6 Ω·m.

Embodiment 2

[0058] Weigh 2 g of flake copper powder with a particle size of 500 nm. Add 30 mL of propylene glycol, 1 mL of n-octylamine, and 1 mL of magnesium formate solution into the container and stir evenly. Then the washed copper powder was placed in a container containing the above mixed solution, heated and stirred at 100° C. for 3 h. After natural cooling, discard the supernatant, and then add 20mL concentration of 1.0×10 -3 mol / L cysteine ​​and stirred for 10 min. After suction filtration and drying, formate and thiol co-modified anti-oxidation copper powder can be obtained. Add 0.3g of epoxy resin and 0.7g of phenalkamine mixed solvent to the modified copper powder, and stir evenly for 6 minutes in a natural environment at room temperature to obtain a conductive paste with a resistivity of 1.2×10 -6 Ω·m.

Embodiment 3

[0060] Take a piece of copper foil with a thickness of 18 μm, ultrasonicate it in glacial acetic acid for 10 minutes, wash the surface impurities and organic matter, and dry it for later use. Add 30mL of ethylene glycol, 2mL of dodecylamine, and 3mL of sodium formate solution into the container and stir evenly. Then the washed copper foil was placed in a container containing the above mixed solution and heated at 120°C for 1.5h. After natural cooling, discard the supernatant, and then add 30mL concentration of 1.0×10 -2 mol / L dodecanethiol was allowed to stand for 1 min. Take it out and dry it to get the oxidation-resistant copper foil co-modified with formate and thiol, and immediately test the resistivity, which is 1.8×10 -8 Ω·m. The resistivity is still 1.8×10 after being exposed to the air for 30 days -8 Ω·m.

[0061] refer to Figure 2a , Figure 2b , Figure 2c and 2d , Figure 2a It is the test chart of the surface contact angle of copper foil when it is not m...

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Abstract

The invention discloses an antioxidant copper material and a preparation method thereof. The antioxidant copper material is a copper material of which the surface is modified with formate and mercaptan. The mercaptan compound is adsorbed on the surface of the formate-modified copper material to form a self-assembled film, thereby further enhancing the corrosion resistance of the copper material. On the basis of improving the thermal stability of the copper material by formate, the hydrophobic property of the copper material can be obviously improved by introducing mercaptan modification, so that a more stable hydrophobic anti-oxidation layer is formed on the surface of the copper material. In addition, in the modification process of the copper material, the oxidation resistance of the copper material can be remarkably improved only by a common open container environment in a short time. The preparation method is simple, the cost is low, and effective anti-oxidation and anti-corrosion treatment can be carried out on the copper-containing material.

Description

technical field [0001] The invention belongs to the field of preparation of conductive materials, and in particular relates to an anti-oxidation copper material and a preparation method thereof. Background technique [0002] As a metal material with high conductivity and low cost, copper is widely used in various fields such as electrical power industry, machinery manufacturing industry, chemical industry, construction industry, national defense industry, etc. , Sensors, solar cells, display screens, electronic switches, electrode circuits, motor accessories and other key materials. However, the copper material is easily oxidized in the air, and the surface is easily corroded, so that its conductivity is greatly attenuated, which limits its application. Therefore, the anti-oxidation technology of copper materials has become a research hotspot at present. [0003] For example, CN 108084799A discloses a material for radio frequency identification (RFID) antenna conductive pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/02H01B13/00C23C22/02B22F1/00
CPCH01B1/026H01B13/00C23C22/02B22F1/145
Inventor 吴炳辉洪书晴郝树强郑南峰
Owner 厦门铜乐科技有限公司
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