High-thermal-conductivity single-component underfill adhesive and preparation method thereof
An underfill, one-component technology, used in non-polymer adhesive additives, adhesives, adhesive types, etc., can solve the problems of low thermal conductivity, unhelpful heat dissipation of electronic components, high heat generation, and achieve thermal conductivity. High coefficient, the effect of reducing the reaction exothermic value and curing shrinkage, and high thermal conductivity
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Embodiment 1
[0027] This embodiment provides an underfill adhesive with high thermal conductivity, which includes the following components by mass: 30 parts of polyurethane modified epoxy resin, 10 parts of first filler, 10 parts of second filler, 10 parts of curing agent, and 5 parts of curing accelerator 1 part, 3 parts of reactive diluent, 1 part of coupling agent; the first filler is spherical alumina, carbon nanotube and silicon carbide. Among them, the mass ratio of spherical alumina, carbon nanotubes and silicon carbide is 3:1:2. The second filler includes spherical silica, spherical magnesium oxide and spherical boron nitride. The particle size of spherical alumina and silicon carbide is 7 μm, and the particle size of the second filler is 3 μm. Polyurethane-modified epoxy resins include polyurethane-modified bisphenol-A epoxy resins and polyurethane-modified bisphenol-F epoxy resins. The coupling agent is γ-glycidyl ether propyl trimethoxysilane. The curing agent is a polythiol ...
Embodiment 2
[0035] This embodiment provides a high thermal conductivity one-component underfill adhesive, including the following components by mass: 30 parts of polyurethane modified epoxy resin, 5 parts of first filler, 10 parts of second filler, 5 parts of curing agent, curing 5 parts of accelerator, 1 part of reactive diluent, 2 parts of coupling agent; the first filler is spherical alumina, carbon nanotube and silicon carbide. Among them, the mass ratio of spherical alumina, carbon nanotubes and silicon carbide is 5:0.5:1. The second filler is spherical silica. The particle diameters of spherical alumina and silicon carbide are 9 μm, respectively, and the particle diameter of the second filler is 1 μm. The polyurethane modified epoxy resin is polyurethane modified bisphenol A type epoxy resin. The coupling agent is phenylaminopropyltrimethoxysilane. The curing agent is polythiol curing agent, and the curing accelerator is 2-phenyl-4,5-dimethylolimidazole. The reactive diluent is ...
Embodiment 3
[0043] This embodiment provides a high thermal conductivity one-component underfill adhesive, including the following components by mass: 10 parts of polyurethane modified epoxy resin, 15 parts of first filler, 10 parts of second filler, 15 parts of curing agent, curing 2 parts of accelerator, 5 parts of reactive diluent, 0.5 part of coupling agent; the first filler is spherical alumina, carbon nanotube and silicon carbide. Among them, the mass ratio of spherical alumina, carbon nanotubes and silicon carbide is 1:0.5:1. The second filler is spherical magnesium oxide and spherical boron nitride. The particle diameters of spherical alumina and silicon carbide are 6 μm, respectively, and the particle diameter of the second filler is 4 μm. The polyurethane modified epoxy resin is polyurethane modified bisphenol F epoxy resin. The coupling agent is γ-methacryloxypropyltrimethoxysilane. The curing agent is hexahydro-4-methylphthalic anhydride curing agent, and the curing accelerat...
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