Capacitor and manufacturing method thereof

Abstract

The embodiment of the invention provides a capacitor and a manufacturing method thereof. The capacitor comprises a non-semiconductor substrate; a first semiconductor layer arranged above the non-semiconductor substrate, at least one first trench array being formed in the first semiconductor layer; at least one first laminated structure arranged above the first semiconductor layer and filling the at least one first trench array, the first laminated structure comprising N conductive layers and M dielectric layers, the N conductive layers and the M dielectric layers forming a structure in which the conductive layers and the dielectric layers are adjacent to each other, and N and M being positive integers; at least one first external electrode electrically connected to all odd conductive layers in the N conductive layers; and at least one second external electrode electrically connected to all even conductive layers in the N conductive layers.

Description

technical field [0001] This application relates to the field of capacitors, and more particularly, to capacitors and methods of making them. Background technique [0002] Capacitors can play the role of bypass, filtering, decoupling, etc. in the circuit, and are an indispensable part to ensure the normal operation of the circuit. With the continuous development of modern electronic systems towards multi-function, high integration, low power consumption, and miniaturization, compared with traditional multi-layer ceramic capacitors (Multi-layer Ceramic Capacitors, MLCC), trenched silicon based on silicon wafers Capacitors can reduce the volume of the capacitor and increase the capacitance density. However, due to the high price of silicon wafers, the cost of trench silicon capacitors prepared based on silicon wafers is relatively high. How to prepare low-cost, small-volume, high-capacity capacitors has become an urgent technical problem to be solved. Contents of the inventi...

AI Technical Summary

Problems solved by technology

However, due to the high price of silicon wafers, the cost of trenched silicon capacitors based on silicon wafers is relatively high. How to prepare low-cost, small-volume, high-capacity capacitors has become an urgent technical problem to be solved.

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