Tunable slow light device based on phase change material, its preparation method and application
A technology of phase change materials and devices, applied in instruments, optics, nonlinear optics, etc., can solve the problems of limited modulation band, no modulation space, single modulation method, etc. Wide frequency range effect
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Embodiment 1
[0075] This embodiment is used to illustrate the preparation method of the tunable slow light device of the present invention.
[0076] figure 1 A process flow diagram of the tunable slow light device prepared in Example 1 of the present invention is shown.
[0077] Step S1. Spin-coat photoresist 1 on a clean and transparent dielectric substrate, and obtain a periodic strip structure by exposure or other means; the dielectric substrate is a low-loss medium that can transmit light in the desired response band, including quartz , silicon wafers, sapphire substrates, etc.
[0078] Step S2. Etching grooves from the periodic strip structure described in step S1; the depth of the grooves is consistent with the thickness of the subsequent film deposition. Select an appropriate etching method according to the material of the dielectric substrate, which can be dry etching technology or physical and chemical etching.
[0079] Step S3. Deposit the phase-change material 2 and the diel...
Embodiment 2-3
[0097] This embodiment is used to illustrate the preparation method of the tunable slow light device of the present invention.
[0098] Using the same method as in Example 1, the only difference is that the raw materials are replaced, and an adjustable slow light device can also be obtained, and its materials and properties are shown in the following table.
[0099] Table 1 Preparation and properties of different tunable slow light devices
[0100]
[0101] The deposition conditions of the dielectric protection layer silicon oxide and aluminum oxide in the foregoing embodiments are as follows:
[0102] Among them, silicon oxide deposition requires a plasma-enhanced chemical vapor deposition system (System100 PECVD, Oxford Instruments, UK). The reaction gas and ratio used for silicon oxide deposition are SiH4:N2O:N2=10sccm:327sccm:1000sccm, deposition temperature 110°C, power 10W, pressure 650mTorr, deposition rate about 2nm / s. The deposition of alumina requires an atomic ...
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