Monocrystalline silicon texturing additive formula containing alkyl glycoside and use method
A technology of alkyl glycosides and additives, which is applied in the field of monocrystalline silicon wafers for solar cells, can solve problems such as high cost and strong toxicity of IPA, and achieve the effects of increasing yield, reducing texturing time, and improving texturing effect
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Embodiment 1
[0027] 1) Additive preparation: use 100mL deionized water as solvent, add 1.0g of APG0810, 1.2g of maltose, 0.2g of sodium isophthalate, 0.3g of NaCl, and 0.4g of sodium silicate to fully dissolve; 2) Preparation of velvet solution: 1 L Add 30.0mL of NaOH solution with a concentration of 30% by weight in deionized water, and add 15.0mL of additives to obtain an alkaline texturizing solution; 3) Pre-cleaning solution preparation: add 30% by weight of NaOH solution 10mL, K 2 MnO 4 0.8mol, fully dissolved; 4) Preparation of mixed acid solution: prepare mixed acid concentration of 1.5 mol / L with HF and HCl at a molar ratio of 1:2; 5) Place the cut monocrystalline silicon wafer in a pre-cleaning solution at 65°C After cleaning for 5 minutes, wash with deionized water, and then immerse the monocrystalline silicon wafer in the texturing solution. The temperature of the texturing solution is 80 ° C, and the texturing time is 14 minutes; Wash in water for 1.5 min, then wash with mix...
Embodiment 2
[0029]1) Additive preparation: use 100mL deionized water as a solvent, add 1.2g of APG1214, 1.5g of sucrose, 0.1g of sodium benzoate, 0.2g of KCl, and 0.2g of sodium silicate to fully dissolve; 2) Preparation of texturing solution: 1 L deionized Add 35.0mL of NaOH solution with a concentration of 30% by weight in water, and add 12.0mL of additives to obtain an alkaline texturizing solution; 3) Preparation of pre-cleaning solution: add 30% NaOH solution with a concentration of 30% by weight in 1 L of deionized water 12mL, H 2 o 2 1.0mol, fully dissolved; 4) Preparation of mixed acid solution: mix HF and H 3 PO 4 Prepare a mixed acid concentration of 2.0 mol / L with a molar ratio of 1:1; 5) Clean the cut monocrystalline silicon wafers in a pre-cleaning solution at 65°C for 8 minutes, then wash them with deionized water, and then immerse the monocrystalline silicon wafers in In the texturing solution, the temperature of the texturing solution is 84°C, and the texturing time is...
Embodiment 3
[0031] 1) Additive preparation: With 100mL deionized water as solvent, add 1.4g of APG0814, 1.8g of lactose, 0.3g of sodium phenylacetate, Na 2 SO 4 0.1g and 0.3g of sodium silicate were fully dissolved; 2) Preparation of texturing solution: 25.0mL of NaOH solution with a concentration of 30% by weight was added to 1 L of deionized water, and 15.0mL of additives were added to obtain an alkaline texturing solution; 3 ) Preparation of pre-cleaning solution: add 15 mL of 30% NaOH solution in 1 L of deionized water, KClO 3 1.4mol, fully dissolved; 4) Preparation of mixed acid solution: mix HF and HNO 3 Prepare a mixed acid concentration of 1.8 mol / L with a molar ratio of 2:1; 5) Clean the cut monocrystalline silicon wafers in a pre-cleaning solution at 65°C for 8 minutes, then wash them with deionized water, and then immerse the monocrystalline silicon wafers in In the texturing solution, the temperature of the texturing solution is 88°C, and the texturing time is 10 minutes; ...
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