Synthetic quartz glass substrate polishing agent, production method therefor, and synthetic quartz glass substrate polishing method

A glass substrate, synthetic quartz technology, applied in polishing compositions containing abrasives, machine tools suitable for grinding workpiece planes, grinding devices, etc., can solve the problem of easy sedimentation of particles, scratches on quartz glass substrates, poor dispersion stability, etc. problems, to achieve the effect of sufficient grinding speed, suppression of defects, and improvement of productivity and yield

Active Publication Date: 2019-12-06
SHIN ETSU CHEM IND CO LTD
View PDF12 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, common ceria-based abrasives use dry ceria particles. Dry ceria particles have an amorphous crystal shape, and when used as abrasives, they are easier to exist than spherical colloidal silica. Technical problems of scratches and other defects on the surface of quartz glass substrates
In addition, compared with colloidal silica, ceria-based abrasives have the technical problems of poor dispersion stability and easy sedimentation of particles

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Synthetic quartz glass substrate polishing agent, production method therefor, and synthetic quartz glass substrate polishing method
  • Synthetic quartz glass substrate polishing agent, production method therefor, and synthetic quartz glass substrate polishing method
  • Synthetic quartz glass substrate polishing agent, production method therefor, and synthetic quartz glass substrate polishing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] (Synthesis of Composite Oxide Supported Silica Particles)

[0079] Solution A was prepared by diluting 100 g of a colloidal silica dispersion containing silica particles having an average particle diameter of 80 nm and having a silica particle concentration of 20% with 2000 g of ultrapure water. After transferring this solution A to a reaction container, it stirred. Next, 500 g of ammonia water (solution B) was dripped in the reaction container, and it stirred.

[0080] Next, 280 g of diammonium cerium nitrate and 55 g of lanthanum nitrate hexahydrate were dissolved in pure water so that the molar ratio of cerium and lanthanum was 80 / 20, to obtain a composite oxide precursor solution (solution C).

[0081] Next, the composite oxide precursor solution was added dropwise to the reaction container, stirred, and heated to 80° C. under a nitrogen atmosphere. Heat treatment was performed for 8 hours to obtain a mixed solution containing silica particles having composite oxi...

Embodiment 2

[0091] An abrasive was prepared by the same procedure as in Example 1 except that a colloidal silica dispersion liquid containing silica having an average particle diameter of 50 nm was used. The average particle diameter measured with an electron microscope was 70 nm. In addition, the average particle diameter of the composite oxide particles supported on the silica particles was 10 nm. With this abrasive, the synthetic quartz glass substrate was polished in the same manner as in Example 1. As a result, the polishing rate was 1.0 μm / hr and the number of defects was one.

Embodiment 3

[0093] An abrasive was prepared by the same procedure as in Example 1 except that a colloidal silica dispersion liquid containing silica having an average particle diameter of 120 nm was used. The average particle diameter measured with an electron microscope was 140 nm. In addition, the average particle diameter of the composite oxide particles supported on the silica particles was 10 nm. With this abrasive, the synthetic quartz glass substrate was polished in the same manner as in Example 1. As a result, the polishing rate was 5.0 μm / hr and the number of defects was 9.

[0094] Table 1 shows the results of Examples 1 to 3 above. In addition, the numbers in the table are the average values ​​of five synthetic quartz glass substrates polished in each of Examples 1 to 3.

[0095] [Table 1]

[0096]

[0097] As shown in Table 1, by polishing the synthetic quartz glass substrate using the abrasive of Example 1, that is, silica matrix particles of a predetermined size, the o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to view more

Abstract

The present invention provides a synthetic quartz glass substrate polishing agent comprising polishing particles and water, and is characterized in that the polishing particles comprise silica particles as base particles, on the surface of which are supported particles of a composite oxide of cerium and at least one rare-earth element selected from among trivalent rare-earth elements excluding cerium. The synthetic quartz glass substrate polishing agent has a high polishing rate and is capable of reducing the occurrence of polishing defects to a sufficient degree.

Description

technical field [0001] The invention relates to an abrasive for a synthetic quartz glass substrate, a preparation method thereof and a grinding method for a synthetic quartz glass substrate. Background technique [0002] In recent years, due to miniaturization of patterns by photolithography, quality such as defect density, defect size, surface roughness, and flatness of synthetic quartz glass substrates has been more strictly required. Among them, with the increase in the fineness of integrated circuits and the increase in the capacity of magnetic media, further improvements in the quality of defects on substrates are required. [0003] From the above point of view, for the synthetic quartz glass substrate abrasive, in order to improve the quality of the polished quartz glass substrate, it is strongly required that the surface roughness of the polished quartz glass substrate is small and the scratches on the surface of the polished quartz glass substrate There are few surf...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14B24B37/00C03C19/00C09G1/02
CPCB24B37/00C09G1/02C09K3/1463B24B7/242B24B57/02C03C3/06C03C15/025C03C2201/02C03C2203/50C03C2204/00C09K3/1436
Inventor 高桥光人野岛义弘
Owner SHIN ETSU CHEM IND CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products