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High-entropy alloy connection silicon carbide ceramic connecting part as well as preparation method and application thereof

A technology of silicon carbide ceramics and high-entropy alloys, which is applied in the field of non-oxide ceramic connections, can solve problems such as internal stress concentration, lower working temperature of connectors, and weakened ceramic properties, and achieve good high-temperature stability, good high-temperature performance, and improved The effect of connection efficiency

Active Publication Date: 2019-11-15
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The limitation of the existing brazing method is that the thermal expansion coefficient of the solder used for the connection matches that of the base metal, resulting in internal stress concentration. In addition, due to the addition of some low-melting point metals, the overall working temperature of the joints drops, which greatly weakens the ceramics. its own characteristics

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] 1. Preparation:

[0031] (1) Put high-entropy alloy powder AlCoCrFeNi and SiC (wherein SiC is 5wt% of the total mass of AlCoCrFeNi and SiC) into a wide-mouth beaker, select absolute ethanol as solvent, press high-entropy alloy powder: alcohol=2:1 The mass ratio is mixed, put into an ultrasonic instrument for ultrasonication, and at the same time use a glass rod to stir for 10 minutes to make a paste solder.

[0032] (2) Cut the SiC ceramics into ceramic pieces of 10mm*10mm*3mm, and polish them with polishing paste to a mirror effect, without obvious scratches under the microscope.

[0033] (3) Use a brush to evenly apply the solder paste prepared in (1) to the SiC ceramic block prepared in (2), add about 5 mg, and then superimpose another SiC ceramic block on top to make a sandwich shape.

[0034] (4) Put the (3) sandwich-shaped sample into the mold, and then put them together into the SPS and pressurize at 20Mpa, heat up to 1100°C at 100°C / min and keep it warm for 10...

Embodiment 2

[0037] 1. Preparation:

[0038] (1) Put high-entropy alloy powder AlCoCrFeNi and SiC (wherein SiC is 10wt% of the total mass of AlCoCrFeNi and SiC) into a wide-mouth beaker, select alcohol as solvent, press high-entropy alloy powder: alcohol=2:1 mass ratio Mix, put it into an ultrasonic instrument for ultrasonication, and use a glass rod to stir at the same time. After stirring for 15 minutes, it will form a paste solder.

[0039] (2) Cut the SiC ceramics into ceramic pieces of 10mm*10mm*3mm, and polish them with polishing paste to a mirror effect, without obvious scratches under the microscope.

[0040] (3) Use a brush to evenly apply the solder prepared in (1) to a SiC ceramic block prepared in (2), add about 5 mg, and then superimpose another SiC ceramic block on top to prepare a sandwich shape sample.

[0041] (4) Put the (3) sandwich-shaped sample into a special mold and put it into SPS together with a pressure of 20Mpa, heat it up to 1200°C at 200°C / min and keep it for...

Embodiment 3

[0044] 1. Preparation:

[0045] (1) Put high-entropy alloy powder AlCoCrFeNi and SiC (wherein SiC is 20wt% of the total mass of AlCoCrFeNi and SiC) into a wide-mouth beaker, select alcohol as solvent, press high-entropy alloy powder: alcohol=2:1 mass ratio Mix, put it into an ultrasonic instrument for ultrasonication, and use a glass rod to stir at the same time. After stirring for 10 minutes, it will form a paste solder.

[0046] (2) Cut the SiC ceramics into ceramic pieces of 10mm*10mm*3mm, and polish them with polishing paste to a mirror effect, without obvious scratches under the microscope.

[0047] (3) Use a brush to evenly apply the solder prepared in (1) to a SiC ceramic block prepared in (2), add about 5 mg, and then superimpose another SiC ceramic block on top to prepare a sandwich shape sample.

[0048](4) Put the (3) sandwich-shaped sample into a special mold and put it into SPS together with a pressure of 5Mpa, raise the temperature to 1400°C at 50°C / min and kee...

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Abstract

The invention belongs to the technical field of non-oxide ceramic connection and discloses a high-entropy alloy connection silicon carbide ceramic connecting part as well as a preparation method and application thereof. The high-entropy alloy connection silicon carbide ceramic connecting part is prepared by mixing high-entropy alloy AlCoCrFeNi powder with SiC powder, performing stirring and ultrasonic treatment by using absolute ethyl alcohol as a solvent so as to obtain a uniform brazing filler metal, uniformly smearing the brazing filler metal to a SiC surface after polishing, and performingthermal treatment through SPS (spark plasma sintering) sintering at 1000-1400 DEG C at connection pressure of 5-30MPa, wherein the structure of the connecting part is SiC / AlCoCrFeNi-SiC / SiC. When thehigh-entropy alloy is used as a connecting layer, not only is low-temperature connection of a silicon carbide ceramic achieved, but also the internal stress of the ceramic connector can be reduced, and the connecting part can be applied to harsh working environments at high temperatures and high pressure, and particularly can be widely applied to the nuclear industry.

Description

technical field [0001] The invention belongs to the technical field of non-oxide ceramic connection, and more specifically relates to a high-entropy alloy connection silicon carbide ceramic connection piece and its preparation method and application. Background technique [0002] SiC ceramic has excellent oxidation resistance, high hardness, excellent wear resistance and corrosion resistance, and has high thermal conductivity. It is a structural material with wide application prospects. It is used in petroleum, chemical, aircraft, Nuclear energy and many other fields have been widely used. The reliable connection of ceramic itself provides necessary technical support for its wider application. Due to the brittleness and poor toughness of the ceramic material itself, which cannot be overcome, resulting in poor processing performance, it is temporarily impossible to manufacture large-sized or complex-shaped ceramic parts. Therefore, it is necessary to prepare ceramic products...

Claims

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Application Information

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IPC IPC(8): C04B37/00
CPCC04B37/003C04B2237/121C04B2237/122C04B2237/123C04B2237/365
Inventor 郭伟明牛文彬吴利翔朱林林车金涛林华泰
Owner GUANGDONG UNIV OF TECH
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